Total 17 Quality Assurance Engineer job vacancies in Pasir Gudang

Job Responsibilities:

• Planning, management and coordination of scheduled, preventive and ad-hoc maintenance/ facilities and building works.
• Manage and coordinate all aspects of assigned projects (renovation works, new business facilities etc) from start to finish, ensuring that projects are completed on time, within budget, and to the satisfaction of stakeholders.
• Oversee the coordination with contractors, vendors, consultants, end users and relevant authorities concerning technical & maintenance services, repairs, installation, renovation, reinstatement works and operational support for promotional activities.
• Prepare cost estimates for repair works, work specifications, drafting of contract documents, invitation for quotation, tender and recommendation for award of quotation/tender
• Identify facilities problems and ensure solutions are implemented.
• Oversee the improvements and revision of existing work processes and policies.
• Ensure proper compliance with local authorities' guidelines and regulations.
• Respond appropriately to emergencies/ urgent issues as they arise.

Requirements:

• Good Degree/Diploma in Estate or Facility Management, Building, Engineering or equivalent related fields.
• Minimum 3 years of experience in project management.
• Proven capability to manage a cross-functional team and drive process improvement initiatives
• Self-starter with good interpersonal, project and stakeholder management, communication skills with a positive and growth mindset.
• Ability to deal with a variety of complex issues concurrently, within tight operational deadlines
• Able to communicate effectively in English and Mandarin (required to liaise with Mandarin speaking stakeholders)

Role and Responsibilities:

• Mixed-Signal IC (MEMS Interface) Design Engineer will be responsible for the design and development of capacitive and/or piezoelectric MEMS interface ASICs, including the required amplifiers, ADCs, filters and control logic, with characteristic high impedance inputs, ultra low power, low noise circuits etc .
• The responsibility of the Senior Mixed-Signal IC Design Engineer includes scheduling, design, simulation and layout of mixed-signal circuit blocks, including pre- and post-silicon verification

Requirements:

• Minimum BSEE with hands-on experience in IC Design flow.
• Familiarity with modern EDA tools such as Cadence, Mentor, Synopsys etc.
• Have working knowledge in analog building blocks such as bandgap reference, LDO, amplifiers, low noise amplifiers
• Understanding of ADC topologies eg Delta-Sigma, SAR, flash, integrating etc … advantageous
• A good team player with good communication skills
• Enthusiastic and independent worker.
• Willing to work in Tampines

Responsibilities

• Assist Quality manager to manage Quality of outsourced foundries, contract suppliers to meet AAC company & customer requirements
• Ensure implementation of customer requirements into product design, product specification, test requirements and product process controls
• Handle new product quality, qualification, validation and control plan
• Assist Quality Manager to conduct quality audits on foundries & contract suppliers, including third party audit authorized by AAC
• Manage Engineering Change Control at foundries
• Work with internal team and foundries to resolve process & quality issues in the product and manufacturing processes
• Experience to conduct failure analysis and work on 8D reports
• Benchmarking against industry practices

Job Requirements:

• Bachelor Degree in Engineering or Science or equivalent. Diploma holders with 2-3 years relevant experiences are welcomed to apply.
• Experience in semiconductor manufacturing is a plus
• Minimum 1 year of experience in quality roles
• Basic knowledge of quality tools such as FMEA, 8D, Pareto, SPC, CpK etc
• Able to effectively communicate (spoken/written) in Chinese with our vendors from China
• Willing to work at Tampines area.

Responsibilities

• Work with R&D on both product actualization and development, and the manufacturing team closely on the related sections such as work Instructions, customer/internal defects, etc
• Improve process capability/defect reduction/throughput improvement for high volume manufacturing using statistical process control, DOE techniques, data driven decision making and systematic problem-solving skills.
• Provide detailed engineering analysis and documentation to support process deployment, transfer and ramp into volume manufacturing.
• Collaborate with Development, Quality, Manufacturing, and other departments as needed to address issues with and set appropriate specifications for MEMS supplied products.
• Define process flows, develop new processes, and ensure successful transfer of new technologies to manufacturing.
• Identify and implement corrective measures for MEMS supplied product variation.
• Defining process flows, develop new processes and drive continuous process improvement efforts to maximize product yield.
• Provide technical expertise and assistance to other engineers and support personnel.
• Applying risk assessments in support of event analysis, including containment decisions, root cause analysis and development of permanent corrective actions
• Experience in physical properties testing, failure analyses and techniques
• Promptly attend to, and resolve, manufacturing issues that occur over the course of Operations’ shift work
• Provide first-line support to the manufacturing technician team in response to any unexpected outcomes or out-of-spec events

Requirements

• Bachelor's Degree in Engineering (Mechanical or Electrical/Electronic) or equivalent.
• Knowledge in Excel VBA, Python, C++/C# programming will be an advantage.
• Strong troubleshooting and analytical skills.
• Possess strong written and verbal communication skills.

Responsibilities

Proficient in troubleshooting Microsoft Windows Server, Windows Client, Microsoft Office Suite

Working knowledge in troubleshooting Cisco network devices would be advantage

Working knowledge in troubleshooting Linux OS would be advantage

Possess a pro-active attitude towards end users and a good working attitude

VMware knowledge would be advantage

Ability to work independently and in a team

Must be able to communicate in Mandarin to liaise with HQ (in China)

Requirement

Provide daily IT Infrastructure/Operations support to users in SG and regional offices

Manage all IT asset (SG and regional offices)

Coordinate with vendor on the repair/maintenance of IT equipment & software

Responsible to IT related tasks

May need to travel to other regional office for on-site support

Overview

MOSFET IGBT engineer/ technical expert (design, manufacture)

There are multiple component development bases in China, and you are required to assist and support the R&D team in China to carry out development work after joining the company.

Description

1. Design/ Development

Use simulation software and layout software to design the structure of the corresponding product, and design the composition of the manufacturing process.

2. Manufacture

Conduct DOE design, identify manufacturing process, and conduct quality evaluation. Cooperate with chip factories to develop, and conduct new product verification such as testing finished products and verification.

3. Quality evaluation

Analyze and organize test data, and apply the technology under research and development to new product development and intellectual property rights.

4、Others

Provide technical support for the company, but also need to assist in various identification and management work.

Experience & abilities required

・Relevant development experience in 6-inch and 8-inch Shield Gate Trench MOSFET, Super-Junction MOSFET IGBT

・3+ years of experience in semiconductor design or manufacturing

・Can use English as working language

・Good logical thinking and communication skills, work hard and have a sense of responsibility for work

・Experience in using simulation software and layout software is preferred

・Experience in IGBT MOS product development, or work experience in semiconductor companies is preferred

Responsibilities

Proficient in troubleshooting Microsoft Windows Server, Windows Client, Microsoft Office Suite

Working knowledge in troubleshooting Cisco network devices would be advantage

Working knowledge in troubleshooting Linux OS would be advantage

Possess a pro-active attitude towards end users and a good working attitude

VMware knowledge would be advantage

Ability to work independently and in a team

Must be able to communicate in Mandarin to liaise with HQ (in China)

Requirement

Provide daily IT Infrastructure/Operations support to users in SG and regional offices

Manage all IT asset (SG and regional offices)

Coordinate with vendor on the repair/maintenance of IT equipment & software

Responsible to IT related tasks

May need to travel to other regional office for on-site support

Responsibilities

• Responsible for the interpretation, design and cost assessment of new product structures;
• Responsible for the management, maintenance and upgrade of product structure design specifications;
• Responsible for the technical review of product structural parts suppliers;
• Responsible for outputting product structure drawings and structural error-proofing lists
• Support DFMEA preparation.

Requirement

• Minimum Bachelor's degree or above in any engineering major
• Understand common processing techniques such as injection molding and stamping;
• Proficient in at least one CAD/CAE software;
• Understand the basic characteristics of materials and the main mechanisms and characteristics of structural failure.
• Strong sense of responsibility, proactive in work, good at identifying problems, strong self-motivation, good communication and coordination skills, teamwork skills, analytical and comprehensive skills and problem-solving skills.

Responsibilities

1. Effectively collect the latest technical information/product information in the OIS industry, and effectively identify the development trends of OIS driver chip technology.

2. Grasp the technology development trend and combine the company's OIS driver chip planning to plan and deploy the OIS driver chip, design and develop it in advance to meet product and project needs.

3. Systematically evaluate OIS driver solutions, identify and control system risks and make improvements.

4. Establish an industry-leading OIS evaluation method, continue to white-box the OIS system, and effectively support the continuous improvement of OIS performance.

5. Integrate algorithms, IC design and lens module teams to lead the development of OIS driver chips from the system architecture level.

Requirements

1. More than 5 years of motor control-related work, preferably those with experience in OIS chip algorithm development.

2. Be familiar with the working principle of CCM, and have a deep understanding of gyroscope technical principles and signal processing, and Proportional–integral–derivative (PID).

3. Efficient execution and forward-looking thinking, and excellent systematic thinking ability.

4. Strong technical experience in implementing digital architecture development and algorithm design

5. Excellent communication skills in both English and Chinese (work effectively with R&D team based in China)

Responsibilities:

• The Mixed-Signal IC (MEMS Interface) Design Engineer will be responsible for the design and development of capacitive and/or piezoelectric MEMS interface ASICs, including the required amplifiers, ADCs, filters and control logic, with characteristic high impedance inputs, ultra low power, low noise circuits etc .
• The responsibility of the Mixed-Signal IC Design Engineer includes scheduling, design, simulation and layout of mixed-signal circuit blocks, including pre- and post-silicon verification.
• It is also expected that you will conduct periodic design reviews, including with application engineers.
• It is also expected that you will support test development and product development teams in bringing projects to production.

Requirements:

• PhD/Master’s Degree in Electronics/Electrical Engineering.
• Minimum 6 years’ experience in Analog or Mixed-signal IC design.
• Very good knowledge of CMOS processes.
• Highly proficient in analog and mixed-signal IC design EDA tools.
• Experienced in analog and mixed-signal circuit designs, such as regulators, DC-DC converters, low-power, low-noise biasing circuits and amplifiers, sigma-delta modulation and ADCs, etc
• Experience in design of high resolution, low power sigma-delta modulation preferred.
• Experience in design of ultra low power ADC preferred.
• Skilled in laboratory testing of IC prototypes.
• Knowledge of Linux operating system required.
• Experience in MEMS interface ASIC design advantageous.

Responsibilities

• Responsible for the interpretation, design and cost assessment of new product structures;
• Responsible for the management, maintenance and upgrade of product structure design specifications;
• Responsible for the technical review of product structural parts suppliers;
• Responsible for outputting product structure drawings and structural error-proofing lists
• Support DFMEA preparation.

Requirement

• Minimum Bachelor's degree or above in any engineering major
• Understand common processing techniques such as injection molding and stamping;
• Proficient in at least one CAD/CAE software;
• Understand the basic characteristics of materials and the main mechanisms and characteristics of structural failure.
• Strong sense of responsibility, proactive in work, good at identifying problems, strong self-motivation, good communication and coordination skills, teamwork skills, analytical and comprehensive skills and problem-solving skills.

Responsibilities

• Capacity assessment, resource optimization, continuous improvement of production efficiency, and assistance in solving problems on the production line;
• Develop standard working hours and personnel quotas as a basis for factory efficiency improvement and cost assessment;
• Plan factory layout, optimize logistics, increase space utilization, optimize assembly line logistics, and rationally arrange assembly lines to maximize efficiency;
• Improve operating methods and line balance, improve operating efficiency, and reduce material scrap;
• Standardization analysis and research (operation analysis, process analysis), determine standardized processes and improve management efficiency;
• Manufacturing cost analysis to reduce scrap costs and manufacturing costs.

Requirement

• Minimum Bachelor's degree or above in any engineering major
• Strong communication and coordination skills and project risk identification skills;
• Strong sense of responsibility, proactive in work, good at identifying problems, strong self-motivation, good communication and coordination skills, teamwork skills, analytical and comprehensive skills and problem-solving skills.

Responsibilities

Proficient in troubleshooting Microsoft Windows Server, Windows Client, Microsoft Office Suite

Working knowledge in troubleshooting Cisco network devices would be advantage

Working knowledge in troubleshooting Linux OS would be advantage

Possess a pro-active attitude towards end users and a good working attitude

VMware knowledge would be advantage

Ability to work independently and in a team

Must be able to communicate in Mandarin to liaise with HQ (in China)

Requirement

Provide daily IT Infrastructure/Operations support to users in SG and regional offices

Manage all IT asset (SG and regional offices)

Coordinate with vendor on the repair/maintenance of IT equipment & software

Responsible to IT related tasks

May need to travel to other regional office for on-site support

Job Responsibilities:

• Design and manufacture non-standard cutting tools such as carbide, cermet, CBN, PCD, etc.
• Optimize the production efficiency and quality of standard cutting tools such as carbide, cermet, CBN, PCD, etc., reduce tooling costs.
• Improve the performance of cutting tools such as carbide, cermet, CBN, PCD, etc.
• Manage daily production, reasonably allocate processing resources, complete production orders, handle production abnormalities, identify and prevent risks.

Job Requirements:

• Minimum with Bachelor's degree in mechanical engineering, materials science, or related fields.
• Proficient in CAD, PROE, or other mechanical drawing software, with some design ability.
• Familiarity with various types of cutting tools, their structures, materials, and basic knowledge of CNC machining processes, mold material selection, and inspection principles.
• Priority will be given to candidates who are familiar with cutting tool manufacturing equipment, including grinders, slow wire cutting machines, laser cutting machines, and welding equipment.

Roles & Responsibilities

• Work with MEMS Research & Development, ASIC design team & Packaging team to perform electrical failure analysis (EFA) and physical failure analysis (PFA) in root cause finding for product development & yield improvement.
• Perform IV/CV measurements on MEMS and ASIC components.
• To work closely with FA vendor to on product qualification, reliability monitoring failure, specific customer request, customer rejects and fab issue.
• Participate in cross-functional teams over different sites to provide analytical support.
• Develop test programs to support product characterization and testing and failure analysis.

Requirements

• Diploma/ Bachelor's Degree in Engineering (Material Science or Electrical/Electronic), Physics or equivalent.
• At least 5 years of FA/QA experience in the semicon industry
• Good knowledge of FA techniques (such as FIB-SEM, EDX, SIMS, Obirch, XRF, FTIR, etc.).
• Able to perform IV/CV measurements with curve tracer.
• Knowledge in Excel VBA, Python, C++/C# programming will be an advantage.
• Strong troubleshooting and analytical skills.
• Possess strong written and verbal communication skills.