Total 36 production engineer job vacancies in Others category in Malaysia

Job Description

As an Operation Central Team (OCT) CPEE ADT team member, you will be responsible in defining alignment and projects to meet goals for NPI nodes, collaborating with multi-functional teams across the globe related to Metals/Implant category – Metal thin film processes such as (not limited to) diffusion, physical vapor deposition and chemical vapor deposition and/or Implant processes. Collaborate with Technology Development and site Alpha technology Process and HVM team to improve Fab processes and equipment to meet technology node targets – such as yield ramp, cost goals, quality. Build strong relationship with internal and external stake holders to align on best practices and develop projects. Support implementation of continuous improvement efforts through process optimization, equipment performance, BKMs.

Responsibilities and Tasks:
As a process expert in Metals Process, create innovative process and equipment solutions to meet the needs of the technology as well as collaborate and develop on ideas originating form process development teams in Boise/ Japan/ Taiwan and Singapore

• Partner with Technology Development and Manufacturing fab for effective transfer, pilot ramp and ongoing development to achieve TECHNODE gate criteria. Play an active role in keeping priorities aligned with peers in TD and manufacturing fab
• Engage with Technology Development and High-Volume manufacturing and lead worldwide alignment efforts across technology to improve module effectiveness.
• Equipment Technology development – partner with TD/Fab/ Suppliers to develop and accelerate FOAK hardware maturity in support of TTMCY and product ramp goals to deliver benchmark equipment performance.
• Participate with Boise/Japan TD peers on equipment technology choices for upcoming nodes and have the ability to drive competitive pricing, machine matching and equipment technology roadmaps.
• Play an active consultant role on MOR, BAP, Doc2 related topics and new tool evaluation proposals.
• Engage with suppliers to develop the process and equipment needed to meet Micron’s technology roadmap.

Requirements :

PhD/Masters/Bachelors Degree in Engineering/Science with relevant experience

As Senior/Principal engineer of the PROCT ADT Dry Etch Process Area engineering team, will be working with the Dry Etch network to drive improvements to manufacturing capability, delivering industry benchmark methods at lowest cost, and accelerating First of a Kind Tools (FOAK) performance at global manufacturing sites.

You will need to maximise global network resources and external Supplier expertise to accelerate yield improvement for new products, establish equipment roadmaps and achieve world-class and high volume manufacturing performance. Some examples are etch chamber design optimization, novel process control schemes implementation or hardware and process innovation.

You will be helping to lead PROCT ADT efforts for region E improvement in terms of process optimization, hardware design and new programs initiatives.

This position requires communicating with TD engineering teams, worldwide procurements teams, HVM engineering teams, as well as interaction with global equipment suppliers to drive module level capability forward and establish area improvement roadmaps. You must also be willing and capable of international travel, if needed, to accomplish your objectives.

Responsibilities and Tasks :

• Deliver on hardware and productivity solutions to meet NAND and DRAM business plan
• As process expert in Dry Etch Process, create innovative process and equipment solutions to meet the needs of new technology.
• Create and lead tool config documentation (Doc2) for First of a Kind tools
• Seek out technology trends related information and help refine roadmaps and strategy.
• Engage with suppliers to develop process and equipment needed to meet Micron’s technology roadmap.
• Partner with Technology Development and Manufacturing Fabs for effective transfer, plot ramp and development to achieve tech node gate criteria.
• Engage with TD and HVM to lead worldwide alignment efforts across technology to improve module effectiveness
• Partner with TD/Fabs/Suppliers to develop and accelerate FOAK hardware maturity in support of TTMCY AND Product ramp goals to deliver BIC equipment performance.

Requirements :

• PhD/Masters/Bachelors Degree in Engineering/Science with relevant experience

Job Description

As a Manufacturing Central Team Quality SEAL Senior Engineer/Manager at Micron Technology, Inc., you will be a member of the worldwide Quality Team managing QDR, reducing variation and deviations for all Micron Fabs. Devising strategies to address specific problems. Specific to your role, your work will encompass the responsibilities of handing resources to enable the timely development of Quality Program for the network. Managing the respective Quality programs that will make FE Quality a success. As a solution provider, you will work with SMEs to identify their needs and to develop and implement reporting dashboard and data structure to meet their requirements for quality improvement. This will also extend to recommending improvements to meet the demands of swiftly changing interface technology. Setting up performing backups procedures for maintaining our data. Providing actionable insights in Frontend Global Quality Program through the analysis of facts and figures acquired from the network.

Additional Job Description:

• A solid and wide-reaching foundation in project and program management across different geological locations.
• Independent and self-motivated to see through the completion of projects
• In addition to possessing technical know-how, being communication savvy and be creative problem solvers
• Demonstrated high level problem solving skills, time management, organization and multitasking abilities
• Excellent verbal and written communication skills

As a GQ (Global Quality) Package Reliability Process Engineer, you will be responsible to setup new product package reliability requirement. This includes board level reliability to emulate customer PCB design. As process engineer, you are required to ensure the process control during package reliability and establish procedures to the operation team for execution. Process improvement is also required to ensure cost and productivity gain.

Coordinating with various functional parties and ensuring the reliability process is compliance to industrial standards such like JEDEC and this will not limit to Micron specification. Additionally, you will respond to inquiries from internal and external customers as a subject matter expert for package reliability activities.

Responsibilities and Tasks

Package Reliability Process Development

• To work with engineering team for enablement of new product (NPI)
• Ensure hardware readiness for package reliability process like Temperature Cycling, HAST, HTS and etc.
• Modify and improve reliability process for existing products

Evaluate and Improve Processes, Materials, and/or Equipment

• Identify, investigate, and document process deviations.
• Troubleshoot process deviations using systematic troubleshooting techniques.
• Perform risk assessment at all decision points within the qualification cycle
• Develop Process Reliability Methodology and Qualification

Lead development/improvement of Process, Equipment and/or Material

• Establish engineering evaluation (DOE)
• Identify factors that impact process quality and propose solutions
• Identify and evaluate interactions between equipment, processes and resolve potential issues
• Identify and implement equipment process control methods
• Develop process limits and capabilities (CpK) and lead process improvement

Introduction of New Process and Process Changes to Operation

• Implement new standard to align with changes of industrial standard for reliability process procedure.
• Conduct training/briefing for operation team on operation procedures
• Develop process reliability tests to assess new process failure mechanisms
• Ensure that test methodology follows industry standards, such as the Joint Electron Devices Engineering Council (JEDEC)
• Define process sampling plan and instruction.
• Strong trouble shooting skill using 8D
• Analyze and report results
• Analyze failures and coordinate failure analysis
• Develop process monitor plan
• Support Excursion Material Disposition

Establish documentation and procedure

• To establish document for new process and revise existing procedure whenever applicable.
• To ensure compliance to internal and external audit
• Observe all established EHSS policies, requirements, and procedures
• Follow EHSS guidelines included in work instruction

Education

Required

Bachelors Degree or equivalent experience

Engineering – Electronics/Electrical

Engineering - Materials Science

Engineering - Mechanical

Related field of study

Experience

Required

• Fresh graduates are welcome.

Familiarity with basic semiconductor processing, device physics, quality, and reliability fundamentals

The high degree of self-initiative and ability to think and act independently

Good multi-tasking and problem-solving skills

The ability to work under tight timeframes and prioritize competing activities

Excellent organizational and management skills and outstanding interpersonal and teamwork skills

The proven ability to collaborate well with team members and drive for results

Strong verbal and written communication skills

The ability to collaborate with cross-functional teams to understand needs and translate them into actionable plans, deliverables, and resource requirements

The ability to effectively interact with a wide range of personalities

The ability and willingness to travel when required.

Micron Technology’s vision is to transform how the world uses information to enrich life for all. Our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community.

Looking to advance your career?

Micron is the place for you to expand your caliber by working on key projects and developing the leader in you! As the Test Solutions Engineer, you will be the key project owner for Micron Nand Flash memory test programs. You will be ensuring project readiness and assessing program quality through stringent program release process. In addition, you will have the following job responsibilities:

• Develop and maintain wafer and package functional test strategies and programs for semiconductor NAND Flash products
• Collaborate with various test solutions engineering and production engineering groups to ensure test program, infrastructure and system readiness for new product introduction as well as high volume manufacturing
• Improve device yield, reliability and quality through test condition optimization, advanced redundancy analysis schemes, data analysis and test equipment hardware optimization
• Provide cost effective and innovative solutions for production test flow optimization with cutting-edge test time reduction methodologies
• Assist process and production teams by providing necessary engineering expertise to ensure smooth manufacturing operations
• Introduce innovative test time reduction solutions and release test programs to production in a timely manner

Requirements

• Bachelor’s or Master’s Degree in Electrical, Electronics, Computer Engineering, Computer Science or any related engineering field
• Strong programming skills; C/C++/Python knowledge will be an added advantage
• Solid analytical problem-solving skills
• Excellent verbal and written communication skills
• Good understanding of semiconductor device physics will be an added advantage
• Fresh graduates are most welcome to apply

Responsibilities:

• Support for CXL Product failure analysis from NPI to HVM stage.
• Perform manufacturing yield evaluation, data analysis and test correlation.
• Perform electrical failure analysis and characterization to resolve CXL related issues.
• Responsible for both product development and supporting high volume manufacturing of CXL.
• Characterize CXL to optimize product performance and maximizing product yield.
• Define and develop tests, test flow and methodologies for system level coverage meeting qualification requirements.

Requirements:

• Bachelor/Master’s degree holder in electrical/Electronic/Computer Engineering/Computer Science.
• Relevant experience in SSD testing and failure analysis will be an advantage.
• Working experience in either NAND technology SSD or HDD industry would be an advantage
• Relevant experience with computer hardware, knowledge of storage interface such as PCIe, DDR4/5, NVME will be an advantage.
• Proficiency in programming languages such as C/C++/ Python