Total 22 job vacancies by Renesas Electronics

Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.

Key Responsibilities

• Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
• Ramp up manufacturing volume and qualify required sources.
• Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.
• Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
• Manage Product Lifecycle Management documents to the latest status.
• Conduct change-management with suppliers to sustain / improve capacity and cost. 

• Lead a team of manufacturing operators and line leaders to achieve output, quality, and cycle time targets.
• Follow cleanroom protocols, safety regulations, and quality standards at all times.
• Participate in process improvement, cost reduction, yield enhancement projects & RPA.
• Comply with company policies, EHS requirements, and industry regulations
• Perform other duties as assigned to support manufacturing operations

• Lead a team of manufacturing operators and line leaders to achieve output, quality, and cycle time targets.
• Follow cleanroom protocols, safety regulations, and quality standards at all times.
• Participate in process improvement, cost reduction, yield enhancement projects & RPA.
• Comply with company policies, EHS requirements, and industry regulations
• Perform other duties as assigned to support manufacturing operations

We are seeking a Process Engineer with a minimum of 2 years of hands-on experience in semiconductor back-end assembly processes, particularly die bonding and wire bonding. The successful candidate will be responsible for process setup, optimization, yield improvement, and troubleshooting to ensure stable and high-quality manufacturing performance.

The role requires strong technical understanding of back-end equipment, materials, and process interactions, as well as the ability to analyze data, drive continuous improvement, and support production operations.

Key Responsibilities

• Develop, optimize, and sustain die bond and wire bond processes to meet quality, yield, and reliability requirements
• Perform process troubleshooting and root cause analysis for yield loss, defects, and equipment issues
• Support new product introduction (NPI), process qualification, and transfer to mass production
• Establish and maintain process parameters, work instructions, and control plans
• Analyze process data using statistical methods (e.g. SPC, CPK, trend analysis)
• Collaborate with cross-functional teams including Production, Quality, Equipment, and R&D
• Drive continuous improvement activities for cost, yield, cycle time, and reliability 

• Lead a team of manufacturing operators and line leaders to achieve output, quality, and cycle time targets.
• Follow cleanroom protocols, safety regulations, and quality standards at all times.
• Participate in process improvement, cost reduction, yield enhancement projects & RPA.
• Comply with company policies, EHS requirements, and industry regulations
• Perform other duties as assigned to support manufacturing operations

Analog and Mixed Signal Business Unit (AMS) is looking for a Snr Staff Product Engineer to join our team to drive the product development of state-of-the-art products. This is a unique and exciting opportunity to work with a cross-functional team to bring a product to volume production starting from product conception to production release. The job scope includes but is not limited to, development of the test plan to ensure datasheet specifications are met. Own the qualification plan and the execution to comply with various JEDEC/AEC quality standards. Own product quality assessment through reliability tests. Collaborate with multi-functional teams such as Design, Test, Applications and Failure Analysis teams during first silicon debug and to root cause field failures. Creation and maintenance of product BOM. Monitor production data to address yield and quality deficiencies using statistical analysis.

Key Responsibilities:

• Full PE product lifecycle ownership from concept to end of life with a focus on ensuring the delivery of the highest quality products to our end customers

• Provide support for DfT, Product releases and Qualifications in Penang

• Compliance to Jedec and AEC standards

• Datasheet and automotive compliance reports

• Real time customer support for design, product and quality related issues

• Temperature/Voltage/Process characterization and production limit setting

• Product new product introduction and yield ownership

• Product BOM release and maintenance

• Excursion management for both suppliers and customers

• Use commercially available yield tools for yield improvement and monitoring, generate weekly reports and review with PE teams

• KPI achievement in product related deliverables including NPI execution and velocity, product cost (Gross margin improvements), product quality performance and failure analysis cycle times

• PAT, SYL, SBL, SPC limit and disposition optimizations to protect quality without excessive waste

The PQE is responsible for ensuring quality and reliability performance of our products, wherever they are designed, manufactured, and assembled, by performing best in class Product Qualification in accordance with international standards and customer requirements. The PQE is also responsible for Reliability Monitoring through ORT.

The PQE works cross-functionally with Design, Test, Manufacturing, Reliability Labs, FA Labs, and Customer/Supplier Quality to prevent defects, drive robust product quality and continuous improvement initiatives.

Key Responsibilities

• Define, perform, and review Qualification (new products, second source, material changes, design changes, process changes
• Define, evaluate, and implement suitable stress tests for related product applications.
• Ensure product compliance with internal specifications, customer requirements, and applicable standards (e.g., ISO 9001, IATF 16949, IEC, JEDEC, etc.).
• Communicate qualification plans and data with customer (Silicon, Package and Board Level).
• Participate in risk assessments (e.g., DFMEA) and ensure mitigation actions are implemented and validated.
• Review qualification test results, assess risks, and provide quality approval for production release or change management.

We are seeking a Senior Technical Recruiter with strong semiconductor industry expertise, particularly within Integrated Device Manufacturer (IDM) environments. The role leads the full end-to-end recruitment lifecycle while ensuring an exceptional experience for candidates and hiring managers, supported by high standards of data accuracy and process excellence. The ideal candidate is a hands-on technical recruiter with deep experience managing complex semiconductor requisitions and operating effectively in a fast-paced, global environment.

Key Responsibilities

End-to-End Technical Recruitment

• Lead the full recruitment cycle from requisition intake to offer acceptance.
• Develop tailored sourcing strategies for hard-to-fill semiconductor roles across design, manufacturing, test, packaging, and operations.

Sourcing & Screening

• Leverage multiple sourcing channels, semiconductor talent communities, niche platforms, referrals, and proactive market mapping.
• Build longlists and shortlists of qualified semiconductor professionals by applying role-specific technical filters across semiconductor HW & SW R&D IC design, fabrication, equipment engineering, process engineering, test development, and related fields.

Candidate & Stakeholder Management

• Provide high-quality CV presentations and candidate summaries to hiring managers.
• Advise hiring teams on market conditions, candidate availability, competitive intelligence, and recruitment timelines.
• Ensure consistent communication and outstanding experiences for candidates throughout the process.

Operation & System Excellence

• Manage all recruitment status updates in ATS, ensuring transparency and accuracy.
• Partner closely with cross-functional teams including HRBPs, HR Operations, and Business Leaders for compliance and smooth Process flows.

Industry Expertise

• Demonstrate strong familiarity with semiconductor roles across the IDM value chain, including:
  • R&D, IC design, physical design, verification
  • Process integration, yield engineering
  • Manufacturing, packaging, testing
• Maintain up-to-date knowledge of global semiconductor talent markets, competitive landscapes, and emerging skill trends.

We are seeking a Senior Technical Recruiter with strong semiconductor industry expertise, particularly within Integrated Device Manufacturer (IDM) environments. The role leads the full end-to-end recruitment lifecycle while ensuring an exceptional experience for candidates and hiring managers, supported by high standards of data accuracy and process excellence. The ideal candidate is a hands-on technical recruiter with deep experience managing complex semiconductor requisitions and operating effectively in a fast-paced, global environment.

Key Responsibilities

End-to-End Technical Recruitment

• Lead the full recruitment cycle from requisition intake to offer acceptance.
• Develop tailored sourcing strategies for hard-to-fill semiconductor roles across design, manufacturing, test, packaging, and operations.

Sourcing & Screening

• Leverage multiple sourcing channels, semiconductor talent communities, niche platforms, referrals, and proactive market mapping.
• Build longlists and shortlists of qualified semiconductor professionals by applying role-specific technical filters across semiconductor HW & SW R&D IC design, fabrication, equipment engineering, process engineering, test development, and related fields.

Candidate & Stakeholder Management

• Provide high-quality CV presentations and candidate summaries to hiring managers.
• Advise hiring teams on market conditions, candidate availability, competitive intelligence, and recruitment timelines.
• Ensure consistent communication and outstanding experiences for candidates throughout the process.

Operation & System Excellence

• Manage all recruitment status updates in ATS, ensuring transparency and accuracy.
• Partner closely with cross-functional teams including HRBPs, HR Operations, and Business Leaders for compliance and smooth Process flows.

Industry Expertise

• Demonstrate strong familiarity with semiconductor roles across the IDM value chain, including:
  • R&D, IC design, physical design, verification
  • Process integration, yield engineering
  • Manufacturing, packaging, testing
• Maintain up-to-date knowledge of global semiconductor talent markets, competitive landscapes, and emerging skill trends.

• Lead cross-functional teams across Design, Systems, Validation, Product/Test Engineering, Firmware, Supply Chain, Procurement, and Quality to ensure seamless program execution in NPI projects.
• Lead COGS reduction programs from impact assessment through qualification, PCN, safelaunch, and production ramp – quantifying savings, evaluating ROI, and assessing the business impact of schedule slips and risk scenarios.
• Drive capacity expansion initiatives across global manufacturing sites, aligning engineering, operations, and supply chain to support production scalability.
• Build and manage detailed schedules for NPI, COGS and capacity programs; track progress, remove roadblocks, and implement data‑driven mitigation plans.
• Manage Engineering Build Request prioritization, conducting bi‑weekly reviews with PMO and Business Operations leadership to ensure alignment with organizational priorities.
• Act as a liaison between the product group, operations/supply chain teams, and key OSAT interface teams to ensure alignment, clarity, and seamless execution across all stages of the program.
• Drive sample readiness and ramp readiness, ensuring cross‑functional teams maintain schedules that support committed customer delivery timelines.
• Coordinate and conduct Project Gate reviews, ensuring cross‑functional readiness, milestone alignment, and clear communication of risks and dependencies.
• Oversee wafer fab, assembly, and test operations to ensure timeline adherence, cost efficiency, and quality standards across programs.
• Provide structured leadership updates on program status, risks, and mitigation plans, maintaining accurate schedules and qualification documentation.

The Senior Business Planner is responsible for managing end to end supply and demand planning while driving on time delivery (OTD), revenue plan attainment, and days of inventory (DOI) targets.

Key Responsibilities

• Manage forecast and shipment to meet revenue plan
• Work order release and expedite to ensure right loading pattern and keeping to the targeted DOI level without impacting commit to customer
• Responsible for customer OTD and CRD
• Capacity knowledge for assembly and test to better manage wip to meet ship plan
• Manage inventory level, work towards meeting DOI target
• Coordination with inter-departments to resolve planning/shipment related issues.

• Participate on IoT-enabled automation and integration projects for smart factory and industry 4.0 implementation.
• Learn on fundamentals of semiconductor processes and their application in real-world.
• Apply data analysis techniques to identify trends, optimize processes and improvements.
• Create reports and visualizations using software tools like Excel, JMP and Galaxy Examinator.
• Collaborate closely with engineers, gaining an understanding of entire workflow from design to execution.

• Gain practical exposure to semiconductor product and test engineering operations.
• Develop the ability to analyze production data to identify yield issues or abnormal test trends.
• Understand the workflow between product engineering, test engineering, and manufacturing teams.
• Participate in troubleshooting and improvement activities related to test programs and production performance.
• Build foundational technical knowledge relevant to careers in semiconductor manufacturing and test engineering.

We are actively advancing technological innovation in the semiconductor package assembly, with a focus on next generation packaging technologies such as PowerQFN, Flip-Chip, and SiP. In particular, the fields of AI, High Performance Computing (HPC), and Vertical Power Delivery (VPD) are rapidly increasing their demand for higher density, higher reliability, and high thermal dissipation package technologies.

This role offers the opportunity to work on cutting edge technologies such as power packages for AI/HPC, VPD, Server VR core/peripheral, and Accelerator/GPU markets and contribute to the development of packaging technologies that underpin innovations shaping society, including AI and next generation mobile computing.

Key Responsibilities:

• Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, flip-chip LGA, multi-chip module and power device packaging
• Work with OSAT/CM to develop, run DOEs to optimize processes and establish process specifications.
• Work with Product Groups and Reliability teams to qualify new packages and processes within required time frame.
• Ensure smooth transition into production by resolving all process integration issues, establishing production controls and monitors, and monitoring / resolving process issues.
• Develop and maintain technical expertise on advances and innovations in advanced leadframe, power SiP/modules, and flip chip interconnects.
• Address internal and external customer complaints working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.

• Support the development of a full-stack web application for capturing and viewing production lot test results.
• Build and enhance web pages/forms for entry, search, filtering, and basic visualization/reporting.
• Implement Python-based logic for data handling (validation, transformation, storage, retrieval).
• Design and maintain database structures (tables, relationships, indexes) to support lot/result traceability.

We are seeking an experienced Senior IT functional techno analyst for our CRM platform. The ideal candidate will possess a deep understanding of the platform, functionalities and have a proven track record in supporting and delivering CRM projects. This role requires an analytical thinker with strong problem-solving capabilities    

Key Responsibilities

Business Engagement and Project Management

• Communicates effectively with end-users for project activities including requirements gathering, scope prioritization, user acceptance testing, and user training
• Acts as the liaison between the business experts (Sales Ops and Finance) and the IT project team members
• Facilitates business/functional requirement gathering, design, architectural / integration awareness, review, approval and sign-off sessions
• Support month end and quarter end activities     

Technical Expertise

• Identifies solutions to the development and technical team based on approved business and functional requirements.
• Verifies that the technical solution meets the business requirements.
• Provide support and information for projects such as system enhancements, process changes, testing, and system implementations.
• Own and manage operational performance metrics, ensuring targets are clearly defined, tracked, and reported.
• Drive team alignment and accountability to consistently achieve agreed service and delivery metrics.

• Standard order management including expedites/pull ins/cancellation/push outs.
• Support Customer's RMA & other RMA related FA support.
• Support review of account booking/backlog/billing with Sales.
• Other ad-hoc support covering free of charge sample tracking for Distis, customer questionnaires & other EHS/technical matters.
• Partner with Sales to manage all Renesas communications with Distis/customers.
• Renesas contact for Distis and Sales for any other topics.

• Standard order management including expedites/pull ins/cancellation/push outs.
• Support Customer's RMA & other RMA related FA support.
• Support review of account booking/backlog/billing with Sales.
• Other ad-hoc support covering free of charge sample tracking for Distis, customer questionnaires & other EHS/technical matters.
• Partner with Sales to manage all Renesas communications with Distis/customers.
• Renesas contact for Distis and Sales for any other topics.

• Standard order management including expedites/pull ins/cancellation/push outs.
• Support Customer's RMA & other RMA related FA support.
• Support review of account booking/backlog/billing with Sales.
• Other ad-hoc support covering free of charge sample tracking for Distis, customer questionnaires & other EHS/technical matters.
• Partner with Sales to manage all Renesas communications with Distis/customers.
• Renesas contact for Distis and Sales for any other topics.

• Standard order management including expedites/pull ins/cancellation/push outs.
• Support Customer's RMA & other RMA related FA support.
• Support review of account booking/backlog/billing with Sales.
• Other ad-hoc support covering free of charge sample tracking for Distis, customer questionnaires & other EHS/technical matters.
• Partner with Sales to manage all Renesas communications with Distis/customers.
• Renesas contact for Distis and Sales for any other topics.

• Standard order management including expedites/pull ins/cancellation/push outs.
• Support Customer's RMA & other RMA related FA support.
• Support review of account booking/backlog/billing with Sales.
• Other ad-hoc support covering free of charge sample tracking for Distis, customer questionnaires & other EHS/technical matters.
• Partner with Sales to manage all Renesas communications with Distis/customers.
• Renesas contact for Distis and Sales for any other topics.

Support continuous improvement and automation initiatives, productivity and quality excellence.

Key Responsibilities:

Test Manufacturing (Backend Operation) process improvements:

• Backend Process improvement (Standardization and automation)
• Product Yield improvement
• Product Quality improvement (Poka Yoke)
• Backend equipment and Productivity improvement
• New Equipment qualification and buyoff 
• Specs initiate, revise, and update in Agile system
• Support Internal Audit and Customer Audit
• RMA/ Customer Complain Investigation and Analysis
• New Packages BOM setup in Agile system
• Drive Automated processes to minimize human intervention error