We are seeking a Process Engineer with a minimum of 2 years of hands-on experience in semiconductor back-end assembly processes, particularly die bonding and wire bonding. The successful candidate will be responsible for process setup, optimization, yield improvement, and troubleshooting to ensure stable and high-quality manufacturing performance.
The role requires strong technical understanding of back-end equipment, materials, and process interactions, as well as the ability to analyze data, drive continuous improvement, and support production operations.
Key Responsibilities
- Develop, optimize, and sustain die bond and wire bond processes to meet quality, yield, and reliability requirements
- Perform process troubleshooting and root cause analysis for yield loss, defects, and equipment issues
- Support new product introduction (NPI), process qualification, and transfer to mass production
- Establish and maintain process parameters, work instructions, and control plans
- Analyze process data using statistical methods (e.g. SPC, CPK, trend analysis)
- Collaborate with cross-functional teams including Production, Quality, Equipment, and R&D
- Drive continuous improvement activities for cost, yield, cycle time, and reliability
