Total 14 Process Improvement Manager job vacancies in Engineering category in Batu Ferringhi

-Coordinate of process development and manufacturing for NPI project, include: generate SOW, specification, design implementation, buyoff activities, training delivery, related service contract
-Upgrade/improve current process equipment/system in automation capability

-Performs mechanical engineering and design analysis and solutions to improve quality, reliability, cost, yield, process stability/capability, productivity, and safety utilizing formal education, experience, statistical knowledge, and problem-solving tools.

-Responsible for mechanical process development engineering design, implementation, and integration of building systems solutions to support industry automation, jigs & fixtures project.

-Coordinate and good communication local contract manufacturing (CM), and supplier related to USB/SSD product and manufacturing.
-Capability to handle the automation project, and coordinate between cross function departments.

Background: SanDisk’s Penang SSD Platform Technology Development Integration (PTDI) organization is a SSD technology development group that will be embedded in SanDisk’s green-field production facility, SanDisk Storage Malaysia (SDSM) located in the new Batu Kawan Industrial Park, Penang, Malaysia. PTDI is looking for Process Module Engineer (Material/Process) to join a new team tasked with starting up a vertically integrated SSD-focused technology development team with the charter of developing new generations of SSD products for clients, enterprise, and emerging data storage solutions. The vertically integrated manufacturing capability of SDSM represents the most fundamental shift in completing the end-to-end manufacturing value chain for SanDisk’s solid-state NAND data storage products.

General Description: Defines IC package/SMT/SSD drive requirements, goals, and milestones for all SSD product groups and customer requirements. Develops SSD assembly and IC packaging material and processes to meet quality, reliability, cost, yield, productivity and manufacturing requirements. Develops new package and SMT process qualification programs. Prepares and/or updates specifications for piece parts of integrated circuits or semiconductor assemblies. Plans and conducts experiments to fully characterize material and processes throughout pathfinding to development to ramp. Develops solutions to improve quality, reliability, cost, yield, process stability/capability, productivity, and safety utilizing formal education, experience, statistical knowledge, and problem-solving tools. Establishes process control systems. Transfers process to high volume manufacturing and provide support in new factory start-up. Acts as a liaison with suppliers/vendors. Maintains product quality while developing and introducing package cost reduction programs. Coordinates the introduction of new package processes into production. Using appropriate tools, performs integrity analysis of packages.

PME Specific Role Description : Includes the following but not limited to:

·         SMT material and process development

·         SMT integration development

·         SMT technology (material/process/metrology/equipment) pathfinding & roadmap

·         Stencil design/development for new components

·         DFM assessment and NUDD risk management

·         Component-board-drive interactions

·         DOE & Failure Analysis knowledge

·         Quality Tools: FMEA, 8D, DMAIC, IPC knowledge etc.

·         Statistical Tools: Statistical analysis (JMP/Minitab), GreenBelt/BlackBelt certification

·         Special engineering characterization & improvement projects

·         Factory emergency taskforce support

• Responsible for Flip Chip Die Attach & Under Fill New Process Development for new product and new process development.
• Supports New Product Introduction by delivering assigned Process and Equipment solutions meeting quality, development, and operation targets and requirements.
• New process development for new wafer technology, next generation products, new material / machine / tooling / software qualifications.
• Define Leading edge Flip Chip Die Attach & Underfill Technology Roadmap / building block.
• Setup new Flip Chip Die Attach & Underfill processes, recipe, perform complete window study, DOEs, corner limits.
• Golden recipe setup for new package qualification.
• Process Qualification to meet process Critical to Quality Requirements, CPK, Full risk assessment, UPH, Yield, and Cost targets.
• To introduce new products and devices to the production line and to build new process technology capabilities, make sure that the handshake and process handover are done effectively.
• Support new material and tools qualification.
• Work closely with Cross site’s Package development & design team to understand the Package Design Rules & Requirements.
• Strong problem-solving skills and good Root Cause Analysis/Finding using 5M + 1E, 5 whys, DMAIC, 8D approach/methodology.
• Responsible and accountable to related tasks as assigned by superior.

Internship students will be focusing on

• Overall SMT manufacturing process 
• New Product Introduction (NPI)
• SMT process characterization & development
• SMT integration development
• SMT technology (equipment/process/metrology) pathfinding & roadmap

• Manage and own Inspection process false call and yield 
• Drive inspection recipe enhancement
• Ensure inspection program are meeting quality out going requirement.
• Create program for new product SKU for inspection recipe.
• Improve Visual inspection false call and programming fine tuning to mitigate line trigger due to programming.
• Drive final inspection program standardization, inspection recipe management 
• Build visual inspection library and capabilities
• Support and train shift teach for false call and programming trouble shoot in the line

1. Assist the process engineer make sure that the screen printing module works perfectly (CIP) without any defects.
2. Assist the process engineer ensure there are no defects in the EB Process module, especially when comparing LTS and Non-LTS methods (CIP).
3. Assist  the process engineer with activities related to the thermal reflow process (like fabricating thermal profile boards) and monitor oxygen levels in all furnaces (bi-weekly basis)
4. Assist the SMT process engineer in particular with the initiative to improve quality at the SMT process that is in line with ZDM and also in particular, with activities related to
5. Automated Inspection Enhancement Project that are aligned with Quality Improvement (no human intervention).
6. SMT Profiling
7. Mechanical assembly processes.
8. Supporting engineer on problem solving / engineering data collection (Yield)

• Plan and conduct for the DOE executions for all SSD improvement task force for mechanical assembly process
• Participate in DFMA (Design for Mechanical & Automation) activities for all NPI products that are introduced in the factory to align with the Industry 4.0 concept.
• Involved in Mechanical Design activities for the manufacturing process.
• Engaged in PCN projects to ensure proper qualification/test plans are in place for products/parts that require engineering changes such as EOL, material changes, supplier changes, or re-tooling.
• Prepare engineering documentation for mechanical 2D drawings, engineering checklists, and WI (Work Instructions).

• Plans and conducts experiments to improve process yield and downtime.
• Work with engineer to plan cost down and improve process quality project example improve process cpk to >1.67.
• Design production parts like tray, pallets etc which can is needed to improve the process.
• Assist in jig and tooling design and modification 
• Any priority tasks given by manager 

• Learn the basic fundamentals & responsibilities of an engineer.
• Incorporate academic knowledge into hands-on work and perform processes study with data collection.
• Involve in line issue and problem solve, data analysis, process WI standardization with the guidance engineer.
• Supporting Daily Operations: Assisting with routine tasks such as file organization, data entry, and other administrative duties.
• Project Assistance: Providing support for projects, which may involve assisting with project planning, implementation, and monitoring.
• Communication and Coordination: Participating in team meetings, communicating with colleagues, assisting in problem-solving, and ensuring the flow of information.
• Reporting and Documentation: Writing reports, documents, or presentation slides to update the team on work progress.
• Team Participation: Engaging in team activities, such as training sessions, events, or social gatherings, to foster team building.

• Responsible for Mold Process Recipe/Process Parameters setup
• Define the process window and recipe baseline by using JMP DOE approach.
• Good in problem solving and work on the Root Cause Analysis/Finding using, 5 whys, DMAIC, 8D approach/methodology
• Work closely with Cross site’s Package development team to understand the Package Design Rules & Requirements
• Ensure smooth transition from Development to new product qualification phase
• Work closely with manufacturing process and equipment team, and cross site process development team
• Documentation: SOP, WI, FMEA, OCAP and Control Plan for related process.
• Ensure effective hand shake/pass over of process for New device/product introduction to the production line and new process technology capabilities development.
• Responsible for new material/component first article inspection and final buyoff.
• Continuous improvement on direct/indirect material/UPH cost down & yield enhancement program.
• Ensure robustness of process control to meet yield & through-put expectation.
• Report any non-conformance/customer complaint issue and develop/follow up the improvement actions.

Responsibilities and Accountabilities

• Responsible for New Process Development support
• Fulfill short term project assigned by supervisor/engineer from new process development department.
• Perform engineering study and data collection at a supervisor/engineer's request.
• Hands on task for assembly processes in a cleanroom environment.
• Compile and generate report with Microsoft Excel, Word, .ppt, and statistical tools.

Key Responsibilities:

- Lead the design and development of mechanical parts include plastic injection molding tray, machining pallet, jig, fixture for SSD drive manufacturing, including conceptualization, prototyping, testing, and implementation.

- Analyze and improve existing manufacturing processes and equipment for better performance, cost-efficiency, and reliability.

- Collaborate with cross-functional teams, including production, quality assurance, and R&D, to integrate new technologies and methodologies into the manufacturing process.

- Conduct thorough risk assessments for equipment designs and processes, implementing preventive measures to minimize downtime and ensure safety.

- Manage equipment development projects, ensuring they meet timelines, budget constraints, and quality standards.

- Stay abreast of the latest trends and advancements in mechanical engineering and SSD manufacturing technology, incorporating innovative solutions into our operations.

- Provide technical guidance and mentorship to junior engineers and technicians.

*Please state internship timeline*

• To develop assembly process jigs and fixtures as needed, ie PCB, lidset assembly for NPI product
• To develop & proliferate work instructions for critical features & assembly for NPI product
• To qualify SMT process relevant to PCB and SIP products
• To develop & qualify local sourcing & tooling buy off, such as Plastics & Metal components
• Mass production process/assembly engineering management: Yield/Cycle time/production efficiency CIP
• Cost saving initiative from product and process introduction

• Responsible for Flip Chip Die Attach & Under Fill New Process Development for new product and new process development.
• Supports New Product Introduction by delivering assigned Process and Equipment solutions meeting quality, development, and operation targets and requirements.
• New process development for new wafer technology, next generation products, new material / machine / tooling / software qualifications.
• Define Leading edge Flip Chip Die Attach & Underfill Technology Roadmap / building block.
• Setup new Flip Chip Die Attach & Underfill processes, recipe, perform complete window study, DOEs, corner limits.
• Golden recipe setup for new package qualification.
• Process Qualification to meet process Critical to Quality Requirements, CPK, Full risk assessment, UPH, Yield, and Cost targets.
• To introduce new products and devices to the production line and to build new process technology capabilities, make sure that the handshake and process handover are done effectively.
• Support new material and tools qualification.
• Work closely with Cross site’s Package development & design team to understand the Package Design Rules & Requirements.
• Strong problem-solving skills and good Root Cause Analysis/Finding using 5M + 1E, 5 whys, DMAIC, 8D approach/methodology.
• Responsible and accountable to related tasks as assigned by superior.