Position Summary
R&D Manager is responsible for product and tooling design.
Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position.
Key Responsibilities
· With reference to internal design guidelines, work with the internal & external customer to:
- Generate, update, and revise electrical routing layout based on the netlist or design provided by external customers.
- Generate test vehicle design and the related PCB design.
- Prepare design risk assessment report.
- Generate reticle and stencil design.
- Generate other schematics or drawing as requested.
· Review, maintenance and update the design guidelines.
· Manage the conversion of internal design into suppliers’ final design.
· Document all the drawing revisions and change records.
· Support audits
Requirement
· 5~10 years hand-on experience of using Cadence APD in RDL routing and mask design for wafer-level processes including Wafer bumping, WLCSP, BGA, eWLB and other fan-out processes. Other similar experience could be considered if relevant.
· Good understanding on the design guidelines and familiar in generating risk assessment report based on Fan-in/ Fan-out process capability.
· Familiar with other design software like Linkcad, CAM350, AutoCAD, GDS editor and Gerber editors.
· Familiar with PCB test board design.
· Knowledge and understanding of wafer-level process and product reliability as well as other packaging assembly process will be the advantage.