Support developing and sustaining electroplating processes (Cu TSV/Damascene/ RDL/Pillar, UBM, micro-bump) in both R&D and small volume manufacturing environments.
Support troubleshooting, root cause analysis for electroplating defects (e.g., voids, roughness, non-uniformity, adhesion issues).
Design and perform DOEs to define process windows, characterize new requirements, and evaluate plating chemistries, technologies.
Compile, analyse, and interpret test data to establish process specifications.
Generate comprehensive technical reports for both internal teams and customers.
Collaborate closely with senior engineers, process integrators, and cross-functional teams to align with technology roadmaps and process capability requirements.
Job Requirements
Bachelor's or higher degree in Materials Science, Chemical Engineering, Chemistry, or related fields.
Knowledge of electroplating process is a plus.
Hands-on experiences in electroplating or related processes are preferred.
Solid knowledge of experimental design (DOE), data analysis, and problem-solving methodologies (e.g., statistical analysis, root cause analysis).
Excellent interpersonal, communication, and teamwork skills, with the ability to collaborate across disciplines.
Self-motivated, resourceful, and capable of managing multiple priorities in a dynamic R&D setting.
