Job Title: Research Engineer / Senior Research Engineer (Laser Drilling & Molding)
About Us: The Institute of Microelectronics (IME) is a global leader in semiconductor innovation, specializing in advanced wafer level packaging. Our research focuses on pioneering platforms such as high-density Fan-Out Wafer-Level Packaging (FOWLP), 2.5D/3D packaging, and co-packaged optics, power module packaging, essential for the next generation of heterogeneous chiplet integration. At IME, you’ll have access to state-of-the-art packaging equipment and be at the forefront of transformative research.
Position Overview:We are seeking a highly skilled and motivated Research Engineer / Senior Research Engineer to drive the development and optimization of advanced wafer level packaging processes focusing on laser drilling and wafer-level molding processes. This role offers the opportunity to work on advanced wafer packaging platforms, contributing to high-impact projects in next-generation semiconductor packaging.
Key Responsibilities
- Drive advanced process innovation: Develop and integrate next-generation laser drilling and wafer-level molding technologies (including FOWLP, 2.5D, 3D and power packaging) through pathfinding, feasibility assessment, technical risk evaluation, establishment of process control methods and cross-process integration to enhance precision, scalability, and overall system capability.
- Enable establishment of robust process: Establish robust, high-performance process ecosystems through extensive DOE optimization, smart recipe development, and proactive analysis—improving reliability, and continuous innovation in process developed.
- Project Collaboration: Work closely with cross-functional teams and equipment vendors to meet project requirements and enhance process capabilities.
- Intellectual Property and Reporting: Generate detailed engineering reports and contribute to the development of intellectual property (IP) and technical knowledge in laser processing and advanced packaging.
- Customer and Market Engagement: Collaborate with internal and external stakeholders to understand future demands and develop the necessary capabilities to meet these needs
Requirements
- Bachelor’s, or Master’s in Materials Science, Mechanical Engineering, Physics, Electrical Engineering, or a related field.
- Relevant experience in laser processing, wafer-level molding, semiconductor fabrication, or FOWLP process development.
- Experience in tool ownership or equipment engineering is an advantage
