Total 9 technology development job vacancies in Batu Caves SGR

We are seeking students pursuing internship with expertise in Machine Learning and Deep Learning algorithms to join our team. As an AI Intern, you will have the opportunity to work with talented Automation Engineers and contribute to cutting-edge projects.

• Role: AI Intern
• Responsibilities:
  • Develop and implement Machine Learning and Deep Learning algorithms.
  • Collaborate with cross-functional teams to define project requirements.
  • Design data pre-processing pipelines for AI model training.
  • Train and fine-tune AI models using large-scale datasets.
  • Integrate AI models into existing automation systems.
  • Stay updated on AI advancements and trends.
  • Collaborate with Automation Engineers to drive innovation.
  • Participate in code reviews and adhere to best practices.
  • Document technical specifications and project progress.

• Responsible for Flip Chip Die Attach & Under Fill New Process Development for new product and new process development.
• Supports New Product Introduction by delivering assigned Process and Equipment solutions meeting quality, development, and operation targets and requirements.
• New process development for new wafer technology, next generation products, new material / machine / tooling / software qualifications.
• Define Leading edge Flip Chip Die Attach & Underfill Technology Roadmap / building block.
• Setup new Flip Chip Die Attach & Underfill processes, recipe, perform complete window study, DOEs, corner limits.
• Golden recipe setup for new package qualification.
• Process Qualification to meet process Critical to Quality Requirements, CPK, Full risk assessment, UPH, Yield, and Cost targets.
• To introduce new products and devices to the production line and to build new process technology capabilities, make sure that the handshake and process handover are done effectively.
• Support new material and tools qualification.
• Work closely with Cross site’s Package development & design team to understand the Package Design Rules & Requirements.
• Strong problem-solving skills and good Root Cause Analysis/Finding using 5M + 1E, 5 whys, DMAIC, 8D approach/methodology.
• Responsible and accountable to related tasks as assigned by superior.

• Responsible to assist Die Attach process development engineers for new process recipe setup and buy-off, machine conversion and buy-off for new process development program.
• First level Root Cause analysis and investigation.
• Process inspection for Critical to Quality parameters buy-off, SPC.
• Data collection and Report compilation.
• Assist engineer in Engineering build, execute DOE/ evaluation run, data collection and compilation.
• Assist engineer for new material / component first articles inspection and final buyoff.
• Assist engineer for create new process recipe, optimization and manage golden recipe for new product qualification.
• Assist engineer in continuous improvement activities on direct/indirect material cost down, UPH & yield enhancement activities.
• Assist engineer with logistic need for engineering build plan execution.
• Handle abnormal lot disposition & Root Cause Analysis.
• Execute Low Volume Manufacturing (LVM) handshake transition with operation process engineering team.
• Any other duties and responsibilities assigned based on schedule and unscheduled activities by the company.

Successful candidate will be working on the AI models for Memory storage solutions. 

• Troubleshoot machine issue, working on improvement and upgrade current machine performance
• Data collection, running DOE, GRR, linearity test etc to buy off the machine
• Simple jig, tray, pallet, machine parts or mechanical process parts design, buy off and release to production
• Any tasks given by manager

• Responsible for Mold Process Recipe/Process Parameters setup
• Define the process window and recipe baseline by using JMP DOE approach.
• Good in problem solving and work on the Root Cause Analysis/Finding using, 5 whys, DMAIC, 8D approach/methodology
• Work closely with Cross site’s Package development team to understand the Package Design Rules & Requirements
• Ensure smooth transition from Development to new product qualification phase
• Work closely with manufacturing process and equipment team, and cross site process development team
• Documentation: SOP, WI, FMEA, OCAP and Control Plan for related process.
• Ensure effective hand shake/pass over of process for New device/product introduction to the production line and new process technology capabilities development.
• Responsible for new material/component first article inspection and final buyoff.
• Continuous improvement on direct/indirect material/UPH cost down & yield enhancement program.
• Ensure robustness of process control to meet yield & through-put expectation.
• Report any non-conformance/customer complaint issue and develop/follow up the improvement actions.

We are seeking students pursuing internship with expertise in Machine Learning and Deep Learning algorithms to join our team. As an AI Intern, you will have the opportunity to work with talented Automation Engineers and contribute to cutting-edge projects.

Duties and Responsibilities:

• Developing and implementing Machine Learning and Deep Learning algorithms to solve complex problems and optimize automation processes.
• Collaborating with cross-functional teams to gather and define project requirements, ensuring alignment with business objectives.
• Designing and implementing data preprocessing and feature engineering pipelines to prepare data for AI model training.
• Training, fine-tuning, and evaluating AI models using large-scale datasets to achieve high performance and accuracy.
• Assisting in the integration of AI models into existing automation systems, ensuring scalability and efficiency.
• Continuously researching and exploring new AI techniques and technologies to enhance the team's capabilities and stay at the forefront of industry advancements.
• Collaborating closely with Automation Engineers and other stakeholders to implement AI solutions and drive innovation in automation processes.
• Participating in code reviews, providing feedback, and ensuring adherence to coding standards and best practices.
• Documenting technical specifications, project progress, and findings to facilitate knowledge sharing and collaboration.
• Keeping up-to-date with the latest developments and trends in Machine Learning, Deep Learning, and related fields, and applying this knowledge to drive continuous improvement in AI development practices.

• Responsible for improving and sustaining the automation equipment capability and meet the KPI (Availability, OEE and Yield)
• Performing and line troubleshooting and supporting daily production operation.
• Analyze equipment failure root causes and propose corrective actions.
• Ability to identify root cause and provide corrective action through use of Effective problem solving tools.
• Perform regular inspections to identify equipment root cause.
• Perform Preventive Maintenance and calibration the equipment to optimal condition.
• Maintain equipment maintenance documentation and checklist.
• Propose improvements to enhance equipment performance and reliability.
• Support equipment setup, relocation and retirement.
• Assist Engineer in continuous Equipment improvement projects and Automation projects
• Demonstrate a high degree of initiative, motivation, and willingness to work proactively either independently or within the team. 

• Responsible for Flip Chip Die Attach & Under Fill New Process Development for new product and new process development.
• Supports New Product Introduction by delivering assigned Process and Equipment solutions meeting quality, development, and operation targets and requirements.
• New process development for new wafer technology, next generation products, new material / machine / tooling / software qualifications.
• Define Leading edge Flip Chip Die Attach & Underfill Technology Roadmap / building block.
• Setup new Flip Chip Die Attach & Underfill processes, recipe, perform complete window study, DOEs, corner limits.
• Golden recipe setup for new package qualification.
• Process Qualification to meet process Critical to Quality Requirements, CPK, Full risk assessment, UPH, Yield, and Cost targets.
• To introduce new products and devices to the production line and to build new process technology capabilities, make sure that the handshake and process handover are done effectively.
• Support new material and tools qualification.
• Work closely with Cross site’s Package development & design team to understand the Package Design Rules & Requirements.
• Strong problem-solving skills and good Root Cause Analysis/Finding using 5M + 1E, 5 whys, DMAIC, 8D approach/methodology.
• Responsible and accountable to related tasks as assigned by superior.