Total 9 Production Engineer job vacancies in Bayan Lepas

Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.

Key Responsibilities

• Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
• Ramp up manufacturing volume and qualify required sources.
• Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.
• Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
• Manage Product Lifecycle Management documents to the latest status.
• Conduct change-management with suppliers to sustain / improve capacity and cost. 

• Lead a team of manufacturing operators and line leaders to achieve output, quality, and cycle time targets.
• Follow cleanroom protocols, safety regulations, and quality standards at all times.
• Participate in process improvement, cost reduction, yield enhancement projects & RPA.
• Comply with company policies, EHS requirements, and industry regulations
• Perform other duties as assigned to support manufacturing operations

• Lead a team of manufacturing operators and line leaders to achieve output, quality, and cycle time targets.
• Follow cleanroom protocols, safety regulations, and quality standards at all times.
• Participate in process improvement, cost reduction, yield enhancement projects & RPA.
• Comply with company policies, EHS requirements, and industry regulations
• Perform other duties as assigned to support manufacturing operations

• Lead a team of manufacturing operators and line leaders to achieve output, quality, and cycle time targets.
• Follow cleanroom protocols, safety regulations, and quality standards at all times.
• Participate in process improvement, cost reduction, yield enhancement projects & RPA.
• Comply with company policies, EHS requirements, and industry regulations
• Perform other duties as assigned to support manufacturing operations

We are seeking a Process Engineer with a minimum of 2 years of hands-on experience in semiconductor back-end assembly processes, particularly die bonding and wire bonding. The successful candidate will be responsible for process setup, optimization, yield improvement, and troubleshooting to ensure stable and high-quality manufacturing performance.

The role requires strong technical understanding of back-end equipment, materials, and process interactions, as well as the ability to analyze data, drive continuous improvement, and support production operations.

Key Responsibilities

• Develop, optimize, and sustain die bond and wire bond processes to meet quality, yield, and reliability requirements
• Perform process troubleshooting and root cause analysis for yield loss, defects, and equipment issues
• Support new product introduction (NPI), process qualification, and transfer to mass production
• Establish and maintain process parameters, work instructions, and control plans
• Analyze process data using statistical methods (e.g. SPC, CPK, trend analysis)
• Collaborate with cross-functional teams including Production, Quality, Equipment, and R&D
• Drive continuous improvement activities for cost, yield, cycle time, and reliability 

Analog and Mixed Signal Business Unit (AMS) is looking for a Snr Staff Product Engineer to join our team to drive the product development of state-of-the-art products. This is a unique and exciting opportunity to work with a cross-functional team to bring a product to volume production starting from product conception to production release. The job scope includes but is not limited to, development of the test plan to ensure datasheet specifications are met. Own the qualification plan and the execution to comply with various JEDEC/AEC quality standards. Own product quality assessment through reliability tests. Collaborate with multi-functional teams such as Design, Test, Applications and Failure Analysis teams during first silicon debug and to root cause field failures. Creation and maintenance of product BOM. Monitor production data to address yield and quality deficiencies using statistical analysis.

Key Responsibilities:

• Full PE product lifecycle ownership from concept to end of life with a focus on ensuring the delivery of the highest quality products to our end customers

• Provide support for DfT, Product releases and Qualifications in Penang

• Compliance to Jedec and AEC standards

• Datasheet and automotive compliance reports

• Real time customer support for design, product and quality related issues

• Temperature/Voltage/Process characterization and production limit setting

• Product new product introduction and yield ownership

• Product BOM release and maintenance

• Excursion management for both suppliers and customers

• Use commercially available yield tools for yield improvement and monitoring, generate weekly reports and review with PE teams

• KPI achievement in product related deliverables including NPI execution and velocity, product cost (Gross margin improvements), product quality performance and failure analysis cycle times

• PAT, SYL, SBL, SPC limit and disposition optimizations to protect quality without excessive waste

The PQE is responsible for ensuring quality and reliability performance of our products, wherever they are designed, manufactured, and assembled, by performing best in class Product Qualification in accordance with international standards and customer requirements. The PQE is also responsible for Reliability Monitoring through ORT.

The PQE works cross-functionally with Design, Test, Manufacturing, Reliability Labs, FA Labs, and Customer/Supplier Quality to prevent defects, drive robust product quality and continuous improvement initiatives.

Key Responsibilities

• Define, perform, and review Qualification (new products, second source, material changes, design changes, process changes
• Define, evaluate, and implement suitable stress tests for related product applications.
• Ensure product compliance with internal specifications, customer requirements, and applicable standards (e.g., ISO 9001, IATF 16949, IEC, JEDEC, etc.).
• Communicate qualification plans and data with customer (Silicon, Package and Board Level).
• Participate in risk assessments (e.g., DFMEA) and ensure mitigation actions are implemented and validated.
• Review qualification test results, assess risks, and provide quality approval for production release or change management.

We are actively advancing technological innovation in the semiconductor package assembly, with a focus on next generation packaging technologies such as PowerQFN, Flip-Chip, and SiP. In particular, the fields of AI, High Performance Computing (HPC), and Vertical Power Delivery (VPD) are rapidly increasing their demand for higher density, higher reliability, and high thermal dissipation package technologies.

This role offers the opportunity to work on cutting edge technologies such as power packages for AI/HPC, VPD, Server VR core/peripheral, and Accelerator/GPU markets and contribute to the development of packaging technologies that underpin innovations shaping society, including AI and next generation mobile computing.

Key Responsibilities:

• Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, flip-chip LGA, multi-chip module and power device packaging
• Work with OSAT/CM to develop, run DOEs to optimize processes and establish process specifications.
• Work with Product Groups and Reliability teams to qualify new packages and processes within required time frame.
• Ensure smooth transition into production by resolving all process integration issues, establishing production controls and monitors, and monitoring / resolving process issues.
• Develop and maintain technical expertise on advances and innovations in advanced leadframe, power SiP/modules, and flip chip interconnects.
• Address internal and external customer complaints working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.

Support continuous improvement and automation initiatives, productivity and quality excellence.

Key Responsibilities:

Test Manufacturing (Backend Operation) process improvements:

• Backend Process improvement (Standardization and automation)
• Product Yield improvement
• Product Quality improvement (Poka Yoke)
• Backend equipment and Productivity improvement
• New Equipment qualification and buyoff 
• Specs initiate, revise, and update in Agile system
• Support Internal Audit and Customer Audit
• RMA/ Customer Complain Investigation and Analysis
• New Packages BOM setup in Agile system
• Drive Automated processes to minimize human intervention error