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Job Description
Advanced process technology development 2. Advanced package technology development
Main Requirements and Qualifications
Experience in research and development of advanced 3nm/2nm process technology
Development of advanced yield improvement and failure analysis techniques (IP test chip trial production, DRC inspection, failure diagnosis analysis, material analysis)
Development of advanced new product introduction technology (new product trial production planning, DRC inspection, DOE and yield improvement planning, mass production interval and yield analysis)
More than 4 years of work experience in a semiconductor foundry
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TW
