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Job Description
New product implementation, especially in Flip Chip related products
Assembly yield improvement, issue and RMA resolving
Package technology development and process improvement
Main Requirements and Qualifications
Knowledge of development processes for advanced IC packaging technologies and materials, including Wire bond, SMT process, Bumping, Flip Chip, Fan-Out, 2.5D/3D, and CPO packaging.
Familiar with various package structures and technologies, including FBGA, Flip-Chip (FC), PoP, SiP, SMT process.
Alternative Phrasings:
RnD/Process experience from IC design house, assembly house and/or Substrate manufacturing for packaging development purpose.
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TW
