Total 17,119 job vacancies in Singapore

As a Front-End (FE) Global Manufacturing Senior Engineer, you will collaborate with all Front-End Manufacturing sites to deliver strategic solutions and drive the sharing of Best-Known Methods (BKMs) towards operations excellence. You will support global Manufacturing Engineering (ME) operations through standardization, optimization, digitalization, and systemization. This includes developing clear metrics to define deliverables, leveraging your front-end manufacturing expertise, and influencing key business partners to achieve alignment and improve output efficiency.

In this role, you will engage with diverse global stakeholders to execute network-wide projects and identify benchmarking opportunities across all sites. By facilitating effective knowledge sharing, you will help maximize the utilization of talent and capabilities worldwide. You will contribute to competitive business outcomes by leading innovative solutions, removing operational barriers, assisting in troubleshooting efforts, and escalating issues when necessary to ensure timely resolution.

Responsibilities and Tasks

• Global Standardization and BKM (Best Known Methods) Governance: Lead the development, standardization, benchmarking, and continuous improvement of FE ME operation/equipment metrics, capacity readiness processes, business processes, and BKMs across all sites.

• Govern Fab Manufacturing Engineering operational ground rules and ensure consistent alignment of methodologies, metrics, and best practices globally.

• Act as a global/area technical SME to optimize area operations, systems integration, and digital ecosystem adoption, driving global standardization and systemization of BKMs into long‑term ME blueprints.

• Facilitate WW ME forums, area network meetings, and sustain/audit existing global BKMs and business processes.

• Analyze line performance, equipment utilization, OEE, workstation/block WPD, and capacity readiness using Theory of Constraints and Lean Manufacturing.

• Proactively drive area efficiency improvement by deep‑diving into root causes of equipment availability losses, operating losses, and baseline capability gaps—partnering with Site Manufacturing, Process, Equipment, and SIC teams.

• Forecast potential roadblocks in constraint workstation management and work with Site Manufacturing Managers to create mitigation plans.

• Lead proof‑of‑concepts and deployment of automation solutions, scheduling enhancements, BKM dashboards, and digital reporting to improve fab productivity.

• Govern global change processes and drive scheduling system improvements that enhance predictability, agility, and performance.

• Drive BKM knowledge sharing and effective implementation across FE sites, fostering a strong culture of collaboration and continuous improvement.

• Build a motivating environment that strengthens team engagement and enables members to reach their fullest potential.

• Collaborate with cross-functional and multicultural teams globally, demonstrating strong cultural agility and the ability to build rapport remotely and in person.

Requirements / Qualifications

• Bachelor’s or Master’s Degree in Engineering, Industrial Engineering, or related technical field (or equivalent experience).

• Minimum 3 years of experience in Manufacturing Engineering, Industrial Engineering, or relevant semiconductor engineering roles.

• Intermediate knowledge of the 300mm fully-automated semiconductor manufacturing process preferred.

• Strong understanding of Lean Manufacturing, Theory of Constraints, Fab Capacity Management, Equipment Utilization, and Line Management.

• In-depth knowledge of MES, Scheduling Systems, Line Management systems, and related production/planning reporting tools.

• Proficiency in data analytics and visualization tools (e.g., SQL, Python, Tableau) to enable automation and data-driven decision making.

• Experience in cycle time management, inventory optimization, constraint management, and fab operations analytics.

• Lean Six Sigma certification (Green/Black Belt) or Project Management Professional (PMP) or equivalent certification is preferred.

• Demonstrated initiative, tenacity, and ability to identify the right collaborators to drive impactful results across global teams.

• Strong analytical and problem‑solving skills with proven success applying engineering knowledge to develop scalable solutions deployable across all Micron sites.

• Excellent communication skills with the ability to influence and engage stakeholders at all levels.

• Strong organizational skills with the flexibility to assume new responsibilities based on dynamic business needs.

• Ability to travel to Micron sites as needed for collaboration and alignment.

• Proven track record of effective teamwork in a global environment.

• Strong cultural awareness and agility to drive alignment and build rapport across sites using both in‑person and digital collaboration tools.

• Well Established Company

• Basic $4200 - $4700 + Variable Bonus

• Excellent Welfare and Benefits + Career progression

• Working location: Tuas (Company Transport Provided)

• Working Days: Monday to Friday

• Working Hours: 8am to 5pm
  

Job Responsibilities:

• Manage and supervise all production activities at the assigned yard.

• Oversee cut and bend operations and steel fabrication services to ensure quality and compliance with specifications.

• Monitor and track steel stock levels, ensuring optimal availability and accurate inventory records.

• Work closely with other managers and stakeholders to define objectives, clarify requirements and support operational alignment.

• Prepare cost estimates, assist in budget planning and monitor production expenses.

• Plan, organize and optimize workflow to meet production schedules, quality standards and project deadlines.

• Identify process improvements to enhance productivity, safety and operational efficiency.

• Ensure adherence to workplace safety regulations and organizational policies.
  

Job Requirements:

• Proven experience in production management, preferably in steel fabrication or related industries.

• Strong understanding of production processes, materials and workflow planning.

• Competency in budgeting, cost estimation and inventory management.
  

Candidates are encouraged to apply this position via Apply Now button with the following information in the resume

• Work experiences and job responsibilities

• Current and Expected salary

• Reason for leaving

• Date of availability

• Education background
  

We regret that only shortlisted candidates will be contacted.

LIONG ZHAO GUAN (R22107632)

EA Recruitment Pte Ltd

EA License No: 21C0492

Job Responsibilities:

• Lead process integration (PI) structural uniformity and cross‑loop integration for critical modules (e.g., capacitance loop), owning end‑to‑end integration strategies to resolve yield, quality, and reliability gaps. Drive physics‑ and process‑based integration solutions through close collaboration with cross‑module process owners, PI subject‑matter experts, and key suppliers to optimize integration structures and achieve BIC yield and quality targets.

• Develop and apply model‑based root cause analysis frameworks (transport, reaction kinetics, pattern density, and geometry‑dependent effects) to diagnose structural non‑uniformity. Define, implement, and continuously strengthen critical inline monitoring and defense lines (CD, film loss, mass delta, defectivity, edge/periphery metrics) to ensure robust control of structural uniformity.

• Own and advance product integration programs and loop‑level domain expertise, maintaining deep technical knowledge across node transitions. Proactively drive node‑over‑node “shift‑left” integration, including early implementation of uniformity, bevel, and backside best‑known‑methods (BKMs) during development phases to accelerate whole‑wafer (center‑to‑edge) yield and quality ramp.

• Drive worldwide technical alignment and execution excellence by leading global projects, standardizing and leveraging network BKMs, and scaling proven solutions across sites. Identify efficiency and performance gaps, and lead business process creation, optimization, and re‑engineering to improve benchmark performance, cycle time, and development productivity.

Job Requirements:

• With more than 5 years of semiconductor industries' experience / knowledge.

• Bachelors/Masters/PhD. in EE, Materials Engineering, Materials Science, Physics and Chemical but optional if candidates have more than 8 years' experience in process related role in semiconductor industry.

• Understanding of DRAM and NAND operation and structure to decipher parametric, probe and qual data from both front-end and backend assembly process.

• Good logical thinking and knowledge in Semiconductor Fabrication process flows, interaction of different processes and how changes affect yield, device performance and reliability.

• Good model-based problem solving together with data driven decision making, and presentation skills. Proven ability to troubleshoot and solve structure and device related issues, and address root cause.

• Good organizational capabilities and ability to work effectively. Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities. Travel to Micron sites as necessary for face-to-face collaboration.

• Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.

• Good multi-tasking, verbal and written communication skills.

Responsibilities and Tasks:

• Establish strategy, models and systems to improve wafer at risk reduction for RAM Defense line hardening.

• Establish strategy, model and systems to improve RAM quality control and reduce defect OOC% variation.

• Establish strategy, model and systems to improve RAM operation efficiency to achieve labor productivity improvement, Cycle time performance, tool utilization performance for lower cost.

• Establish and improve BKM (Best Known Method) related to RAM defense line hardening and operation efficiency.

• Ensure BKM sharing spans across all sites regardless of technology and/or site mission differences.

• Implement abnormal analysis and improvement.

• Lead Copy Smart Team (CST), facilitate taskforce discussion and drive RAM network alignment on strategy business process and roadmap to achieve area objectives and deliver to timelines/commitments.

• Support and performs audit and establish metrics that can efficiently audit adoption rate and compliance to business process, BKM and strategy.

• Actively provide recommendations to improve and optimize programs and processes to the respective program and/or process owners.

• Manage projects with proper Project Management process with metric to track project success.

• Track Fab performance metrics for benchmarking purposes. Identify gaps and area of improvements for Fabs.

• Provide tactical support and coordination for the Fabs as required for issues of People, Safety, Time to Mature cummulative Yield, Quality, Cost, and Cycle Time.

• Communicate clearly and present strategy and updates to network members and leaders.

Requirements:

• Master's/Bachelor's in Engineering

• Relevant working experiences in RDA and/or Metrology

• Willing and capable of international travel, including Extended International Business Travel (EIBT) assignment to 6 months as needed, to accomplish the goals.

• Good communication skills, maintain a strong and open relationship with peer group and appropriate team members in other functional areas such as Process Integration Engineering, Quality Systems, Production Operations Management

• Promote worldwide sharing and transfer of area-specific domain knowledge

• Proficiency, experience and knowledge relating to product and test wafer capacity modeling, wafer at risk modeling, Failure Mode Effect Analysis (FMEA) concept and system, defect analysis tools, sampling strategy and systems, Statistical Process Control (SPC) tools, Cycle Time Management, tableau creation, SQL and Programming language and Organization Change Management have advantage.

As a Senior Engineer, Instrumentation & Controls for the Global Facilities Engineering department at Micron Technology, Inc., you will be responsible to provide Engineering system ownership and technical support for the planning, design, construction, operations, and maintenance programs of the critical Facilities systems. In this role, you will support the Micron Semiconductor Manufacturing sites across the network, including Facilities and Manufacturing teams, through all phases of design, construction, installation, start-up, operations and maintenance with focus and emphasis on Global Standardization and Alignment, Innovation, Reliability and Performance, and Sustainability.

The Facilities system ownership and responsibilities include for the I&C, FMCS, SCADA, Life Safety Systems, Toxic Gas Monitoring, Telecom, and Security systems, as well as the Controls interfaces with other Facilities Mechanical, Electrical, Process, and Building systems.  This role will also lead the Facilities Digitalization and SMART Facilities program initiatives.

Provide Technical Support, Leadership, and Expertise

• Provide consultation and support to Global, Regional, and Site Facilities and Manufacturing teams as the Technical Field Domain Expert.

• Collaborate with internal partners and collaborators including Technology Development Team, Procurement, Finance, Legal, etc.

• Analyze system designs to identify improvements that will result in better performance, efficiency gains, reduced maintenance, and cost savings

• Support sites with problem analysis using standard tools and methodologies as requested

• Benchmark within and external to Micron sites on Engineering Best Practices and Best Known Methods (BKM) of Facilities buildings and systems

• Maintain technical knowledge domain expertise on your respective subject area including for Industry Standards and Best Practices, Trends and Technological advances, emerging technology roadmap, Design Innovations, Sustainability, Digitalization, etc.

Provide Design and Construction Project Support, Leadership, and Expertise

• Support the Micron Global, Regional, and Site Design and Construction project teams in the Engineering and Design development for new large-scale, Facilities Infrastructure Expansion projects

• Develop, review, and maintain the Micron Global Design and Construction Standards and Construction Specifications with focus and emphasis on Engineering Design and Construction of your respective systems.

• Develop the system design concepts for your respective field systems to be deployed into the Design and Construction Projects, including for Control System Architecture, System P&IDs, Sequence of Operations, and Functional Description of System Operations

• Ensure that project scope meets customer and requestor needs

• Ensure appropriate communication and collaboration with Facilities, Design, Construction, Procurement and Manufacturing stakeholders, to deliver project objectives and results

• Perform timely review of design packages and providing documented comments and feedback as necessary.  Ensure designs are in compliance with all standards, codes, and regulations

• Monitor progress and provide Engineering and Design support during construction projects

• Provide support for project cost and schedule estimates and justification for approval

• Provide supervision and coordination of Consultant resources 

• Review capacity planning databases and system operating trends across the network and validating utilization and diversity factor assumptions

• Participate and/or lead capacity and scenario planning across the network, including evaluation of system and distribution capacity impacts based on scenario changes

• Review and advise on scope, schedule, and cost estimates for Facilities infrastructure additions or modifications

Provide Global Initiatives Program Support, Leadership, and Expertise

• Develop, review, and maintain Micron Global Best Known Methods (BKM) documents with focus and emphasis on Operations and Maintenance Reliability and/or Performance

• Lead & own the Global Facilities Programs & Initiatives, including establishing and defining the program objectives, roadmaps, and high-level implementation plan

• Lead the Global Facilities Digitalization and SMART Facilities Programs in support of Micron’s Corporate Digitalization goals and initiatives

• Lead the Global Facilities Sustainability Programs in support of Micron’s Corporate Sustainability goals and initiatives

• Collect and consolidate Lessons Learned and feedback from Micron Global, Regional, and Site teams to incorporate into the Micron Global Standards and BKMs

Job Requirements:

• Bachelor’s Degree in Mechanical, Electrical, Chemical, or Industrial Engineering required

• Minimum 7 to 10-years experience in Semiconductor and/or Facilities related industry

• Technical expertise, knowledge, and experience on Facilities and Semiconductor Instrumentation and Controls systems, including I&C, FMCS, SCADA, Life Safety Systems, Toxic Gas Monitoring, Telecom, and Security systems, as well as the Controls interfaces with other Facilities Mechanical, Electrical, Process, and Building systems

• Ability to prioritize and schedule workload and work on multiple tasks concurrently

• Good organizational skills and Service demeanor

• Excellent interpersonal skills and good team working skills, English Required

• Self-motivated worker

• Familiarity with Semiconductor Manufacturing and Facilities systems

• Ability to travel internationally 15-25% of the time on average, but up to 30% of the time during Critical Project phases or Site Activities

Responsibilities

• Develop strategies, models, and systems to:

• Reduce wafer-at-risk and strengthen RAM defense line hardening.

• Improve RAM quality control and minimize defect variation.

• Enhance operational efficiency to achieve labor productivity, cycle time performance, and tool utilization for cost reduction.

• Establish and maintain Best Known Methods (BKM) for RAM defense and operational efficiency, ensuring sharing across all sites.

• Conduct abnormal analysis and implement corrective actions.

• Lead Copy Smart Team (CST), facilitate taskforce discussions, and drive RAM network alignment on strategy, processes, and roadmap.

• Support audits and establish metrics to monitor adoption and compliance with processes and BKMs.

• Proactively provide recommendations for program and process optimization.

• Manage projects using structured project management practices and success metrics.

• Track and benchmark Fab performance; identify gaps and improvement opportunities.

• Provide tactical support for issues related to people, safety, yield, quality, cost, and cycle time.

• Communicate strategies and updates effectively to network members and leadership.

Requirements

• Bachelor’s or Master’s degree in Engineering.

• Relevant experience in RDA and/or Metrology.

• Willingness and ability to travel internationally, including extended assignments (up to 6 months).

• Strong communication skills and ability to collaborate across functional teams.

• Ability to promote global knowledge sharing.

• Preferred skills:

• Capacity modeling, wafer risk modeling.

• FMEA, defect analysis tools, sampling strategies.

• SPC tools, cycle time management.

• Tableau, SQL, programming languages.

• Organizational change management.

You will play a critical role in managing the engineering and maintenance and project works in the fields of Mechanical Facilities equipment and system on site, to achieve continuous improvement to system robustness, reliability and efficiency with the necessary guidance and direction from Facilities organization. Your ability to achieve team target will help in accomplishing department and company goals.

Job Responsibilities:

• Plan, design and lead Cleanroom Facilities mechanical system expansion projects to facilitate tool utilities demand of future technology of manufacturing equipment as required per project if necessary.

• Respond and problem solving of system issues and production interruptions to mechanical related systems

• Identification, evaluation and potential implementation of advanced technology on Mechanical systems to improve electricity, waste or water reduction to align to Micron Environment Sustainability efforts

• Perform capacity tracking and planning for mechanical systems

• Enforce to company’s environmental safety health policy and procedure, standard operating procedure with risk assessment, good housekeeping standard and quality policy when performing work.

• Responsible for continual improvement of preventive maintenance programs for systems to achieve optimal system performance and uptime.

• Engage in driving system reliability improvement initiative to enable maximum equipment uptime and reduction of system interruption.

• Lead troubleshooting and timely response to site for system abnormities to reduce production impacts. Carry out Root cause analysis and implement action plans to prevent recurrence.

• Perform effective capacity tracking and planning for mechanical systems

• Innovate ideas, implement predictive maintenance through SMART Facilities initiative in collaboration with control team.

• Track and monitor equipment spare parts and consumable inventory

• Enforce the company’s environmental safety health policy and procedure, standard operating procedure with risk assessment, good housekeeping standard and quality policy when performing work.

• Plan and ensure execution of preventive and corrective maintenance programs for facilities' mechanical systems, including HVAC, exhaust systems, scrubbers, process cooling water, chillers, boilers, cooling towers, compressed air systems, Fire protection system and cleanroom air systems to ensure maximum equipment uptime and reliability

• Identification and enablement of smart technologies and AI for improvement of managed tasks, i.e.: project tracking, maintenance overviews, budget tracking, etc.

• Procurement tasks involving ARIBA / SAP software for the purchase of services and parts to upkeep the Facilities Mechanical System

Job Requirements:

• Bachelor’s degree in Mechanical engineering with minimum of 8-10 years Semiconductor Facilities Experience

• Technical expertise, knowledge, and experience on Facilities and Semiconductor Mechanical and Process Systems including Cleanroom HVAC, Chilled Water, Heating Water, Makeup Air, Recirculation Air, Process Cooling Water, Process Exhaust, Compressed Air, Process Vacuum, General HVAC, etc.

• Knowledgeable and experienced and application of problem solving and data analysis methodology

• Knowledge able of maintenance practices and procedure and installation work for Facilities mechanical system

• Proficient in quality tools such as 8D & 5 WHY analysis for troubleshooting or incident investigation.

• Ability to work in a team environment with various professional levels.

• Familiarity with sustainability efforts (electricity, waste, water reduction) is a plus

• Ability to prioritize and schedule workload and work on multiple tasks concurrently

• Strong documentation, analytical, logical, and critical thinking skills

• Effective communicator, able to collaborate across all levels

• Growth mindset with a passion for continuous learning

• Ability to operate in fast-paced, 24/7 manufacturing environments

• Embody Micron’s core values:

• People – Respect, develop, and empower others

• Innovation – Drive continuous improvement and breakthrough thinking

• Tenacity – Show grit and determination

• Collaboration – Build trust and foster teamwork

• Customer Focus – Deliver excellence and value

  Plans facilities changes for plant, office, and production equipment layouts, working toward economy of operation, maximum use of facilities and equipment, and compliance with laws and regulations. Coordinates with architecture/engineering firms in developing design criteria and preparing layout and detail drawings. Prepares bid sheets and contracts for construction and facilities acquisition. Reviews and estimates design costs including equipment, installation, labor, materials, preparation and other related costs. Inspects construction and installation progress for conformance to established drawings, specifications, and schedules. Develops criteria and performance specifications required to meet unique operating requirements and building and safety codes.

Role Summary

The Costing Engineer is responsible for end‑to‑end cost estimation, control, and reporting across semiconductor fab construction (base‑build). The role develops benchmarked, defensible cost models; supports design‑to‑cost decisions; drives tendering/commercial rigor; and ensures predictable CAPEX outcomes for cleanrooms, subfab structures, ultra‑high purity (UHP) utilities, abatement, and high‑density electrical/mechanical systems. You will collaborate with Facilities Engineering, Tool Install, Process/Equipment Engineering, QS/Commercial, Procurement, and Planning to deliver cost certainty from feasibility through handover.

Key Responsibilities:

1) Pre‑Construction / Feasibility & Concept

• Build Class 5–3 estimates for greenfield fabs, brownfield expansions, and capacity upgrades.

• Develop parametric cost models (cost per sqft cleanroom, per utility density) and maintain historical benchmarks by technology node and region.

• Identify scope/risks for cleanrooms (ISO 3–7), subfab, UPW/WWT, CDA/N₂, HPM gases, exhaust & abatement, electrical distribution, chilled water/HVAC.

2) Design Development / Front‑End Planning

• Provide design‑to‑cost inputs on cleanroom type, plenum heights, slab/vibration criteria (VC‑A to VC‑E), redundancy (N+1/2N), and specialty materials (FM‑approved, chemical‑resistant).

• Quantify and compare alternatives (modular utility skids vs stick‑build, ceiling grid/FFU density, substrate/trench layouts) with TCO/ROI implications.

• Align estimates with facility load from Process/Equipment Engineering and Line Planning.

• Able to prepare BOQs, rate build‑ups, and bid packages across C/S/A/M/E/P scopes if required.

• Lead RFQ/RFP processes: clarify scope, normalize bids, validate inclusions/exclusions (HPM compliance, seismic supports, cleanroom finishes).

• Create and defend should‑cost breakdowns for UHP piping, gas cabinets, bulk/CDA/N₂ systems, scrubbers/abatement, electrical switchgear, and modular skids.

3) Risk, Compliance & Governance

• Lead Quantitative Cost Risk Analysis (QCRA); model scenarios for commodity volatility (stainless/copper), lead times (switchgear/chillers), UHP welding productivity, certification failures.

• Ensure compliance with FM Global, NFPA/IFC, SCDF requirements, local codes, and internal audit.

• Keep documentation audit‑ready (assumptions, sources, bid tabs, approvals).

4) Reporting & Stakeholder Management

• Produce monthly cost reports, VE registers, risk logs, cash flow updates, and executive summaries.

• Present cost deltas for design changes and VE proposals with quantified savings and schedule impact.

• Interface with Facilities/Tool‑Install/Line Planning, QS/Commercial, Procurement, PMO, and suppliers/contractors.

Skills / Qualifications

Minimum Qualifications:

• Bachelor’s degree in Quantity Surveying, Mechanical/Electrical Engineering, Construction Management, Industrial Engineering, or related field. Master’s degree is a plus.

• 5–10+ years of cost engineering/estimating experience, with semiconductor fab or advanced manufacturing projects (cleanrooms, UHP, tool‑install) strongly preferred.

• Demonstrated competency in BOQ take‑offs, rate build‑ups, estimating classes, tender evaluations, and cost control.

• Solid understanding of cleanroom systems, UHP piping, HPM compliance, abatement, power & mechanical redundancy, and vibration criteria.

• Good analytical skills with problem solving aptitude.

• Skills in excel and simple code writing desired.

• Ability to integrate and work in a global multicultural team

• Great leadership, interpersonal skills and team building spirit.

• Excellent communication skills, both written and verbal.

Preferred Experience & Skills

• Experience with greenfield megaprojects or fast‑track brownfield fab upgrades.

• Familiarity with FM Global, NFPA/IFC, SCDF guidelines, and local regulatory processes.

• Proficiency with:

• Estimating/QS tools: CostX/PlanSwift/CCS Candy/WinQS, Bluebeam

• Planning/Control: Primavera P6, MS Project, ERP (SAP/Oracle), Power BI/Excel modeling

• Risk: @Risk/Crystal Ball (Monte Carlo)

• Strong data/analytics capability; can build parametric models and reconcile top‑down vs bottom‑up estimates.

• Excellent written/oral communication; able to defend estimates with evidence and negotiate variations.

As the Global Facilities Central Engineering CSA Engineer (Civil, Structural & Architectural) you will be responsible for the development, oversight, and ownership of the CSA specific subject area standardization, alignment, and programs related to CSA Engineering, design, construction, operations, and maintenance of CSA Facilities systems in support of Semiconductor Manufacturing Sites and Projects across the Micron Global Manufacturing Network. In this role, you will support the Facilities Teams and Manufacturing sites across the network as a domain expert through all CSA related design, construction, installation, start-up, operations and maintenance requirements of the field specific systems, and will ensure environmental, safety, regulatory, and code compliance. develop and own Micron CSA Structural Technical Specifications and Standards. Provide technical direction on Micron's requirements to outside A&E firms during Project concept and detailed design phases, interface with site groups, other engineering disciplines, local municipalities/utilities, trade contractors, and other project stakeholders.

Perform regular field inspections during construction and monitor the project to ensure that it is within agreed scope, schedule and budget and that the work is being performed in accordance with design intent.

Understand basic Uniform Building Code (or IBC) applications and determine compliance for issues related to exiting, occupancy and building types. Possess experience in design of raised floor, demountable walls and ceiling grid systems for clean rooms. Ensure constructability in challenging environments in or near operating buildings without interruptions.

Provide technical support, expertise, and lead business process alignment on construction project design, management, schedule, cost control, testing & commissioning, operational and maintenance programs for the CSA Engineering at all Micron network manufacturing sites.

As a global team member you will represent all facility design standard alignment, construction project management, O&M BKM alignment initiatives.  You will also support the Global Facilities Regional Engineering Team, Construction Team , Line Planning Team and O&M Team in providing critical design standard alignment, supplier quality improvement, operational and maintenance input and support construction projects.

Critical metrics include construction project management, schedule, cost control, safety index, and facilities system reliability improvement program in eliminating production events that minimize lost moves and scrap.

Responsibilities and tasks:

Project

Design and construction of regional green field project with alignment to global standards and collaboration with central sustainability, cost, construction and line planning team.

Engineering support for site projects, Alpha to Beta technology transfer and sustainability projects

Review and approve site capacity expansion and sustainability capex

Review priority and make business driven decision on Facilities Reliability Improvement project capex
 

Reliability

• Engineering support for site system improvement projects (System Reliability Improvements, Quality Improvement and Equipment EOL replacements)

• Oversee regional efforts and identify opportunities to align strategic program (eg BCP, Critical spec, Quality Defense line)

• Engineering support for major SIPP review

• Regional events lesson learnt sharing and influence of global standards development

Communication

• Single point of contact for regional sites and GFC central teams

• Provide alignment on metrics reporting

Engineering and Others

• Expert understanding of each sites CSA (Civil, Structural and Architectural) Engineering in order to provide critical support

• In addition to your global CSA Engineering role you will also provide site/regional support for global facility initiatives at your location/region

• Technically lead a global cross functional team focused on project, design, construction, operational excellence with the site CSA Engineering.

• Provide support to all sites including on site presence for construction project and critical CSA

Engineering issues/matters

• CSA Engineering design and construction oversite of major construction projects.

• Construction shown experience working with A&E and construction firms. Industrial facilities and the typical Structural and Architectural scope associated with these facilities.

• Providing engineering support during construction thru submittal reviews, reviewing changes initiated by construction GC’s, developing project modifications, and conducting QA/QC reviews of design documents (e.g., structural plans, specifications, and calculations)

• Providing technical review of structural design work performed by other A&E or GC’s design group and sub-consultants.

• Prepare structural design calculations, RFP’s, write design documentation reports, and develop engineering plans, specifications, and quantity estimates for projects.

• Conducting site visits and field surveys as necessary to assess field conditions.

• Working directly with a variety of engineering disciplines, office/project staff, GC’s and sub-contractors, throughout the project life cycle.

• Ensuring project compliance and quality and safety standards.

• Provides engineering for semiconductor manufacturing site facilities changes for plant, office, and production equipment layouts, including semiconductor tool installations and R&D applications, working toward economy of operation, maximum use of facilities and equipment, and compliance with laws and regulations. Prepares bid sheets and contracts for construction and facilities acquisition.

• Completes engineering for requested changes to develop estimates for design costs including equipment, installation, labor, materials, preparation and other related costs for semiconductor manufacturing sites, including R&D applications. Inspects construction and installation progress for conformance to established drawings, specifications, and schedules.

• Develops criteria and performance specifications required to meet outstanding operating requirements and building and safety codes.

• Effectively control commercial, managerial, and technical aspects of projects or parts thereof for which you are responsible.

• Excellent knowledge of design in Steel, Precast, OSM, and Reinforced Concrete

• Excellent working knowledge of Structural Analysis Software or similar software.

• Experience in the assessment of existing structures and their justification, as well as new build designs.

• Review of Design drawings and specifications for completeness and accuracy.

• Review of engineering calculations and supporting documentation to ensure design quality.

• Review of Autodesk, BIM 3D models relative to functionality, egress, ease of maintenance requirements, constructability, alignment with other engineering subject areas.

• Review and approval of submittals.

• Review and validation of construction RFI responses.

• Review and approval of shop drawings and construction models.

• Inspect construction and installation progress for conformance to established drawings, specifications, and schedules.

• Develop and validate cost estimates and construction schedules for structural portions of projects.

• Develop criteria and performance specifications required to meet unique operating requirements for new projects.

• Perform regular field inspections during construction and monitor projects to ensure alignment to Micron specifications and standards, codes, laws, regulations, best known methods, agreed scope, schedule, and budget.

• Evaluate existing structural elements on campus for safety and integrity and provide recommendations and design for improvements.

• Evaluate site and tool base acoustical and vibration requirements and recommend design control solutions.

• Lead a sustaining structural design team to produce structural construction drawings that meet schedule and budget requirements.

• Evaluate site fall restrain tie-off points for stability and safety.

• Ensure constructability in relevant environments in or near operating buildings without interruptions.

• You will review FIPA/METS events and provide recommendations to drive the reduction of critical CSA Engineering impact events.

• Collaborate with the construction / engineering team to insure alignment on projects

• Support the network effort to implement, monitor and drive continuous improvement for success of Micron’s Sustainability programs in alignment with the long-term Sustainability strategy

• Benchmark system performance and drive Best-In-Class approach (BICs) across the network

• In depth review of site sustainability projects and sustainability data monitoring to support site’s and company’s sustainability targets.

• Provide technical advice and support to overcome challenges and roadblocks in project planning & execution

• Support sustainability projects achievement data acquisition and validation in central tracking depository.

Requirements:

Knowledge:

• Large Building Structural Engineering Design, Analysis and Technical Calculations, Technical specifications, Conceptual design and OSM Vibration Design in Structures, Structural Steelwork, Foundation and building/structural designs, Underground layouts and pipework, AMHS, Ceiling Grid System

• Coordinate structural-related issues with the other fields.

• Ensure the overall quality of the Structural design by performing regular reviews.

• Participate in formal 3D plant model reviews.

• Apply knowledge/skills to a range of activities; act as a technical resource to regional sites and other network sites

• Understand project needs and identify solutions to non-standard requests

• Understand local Building Code (IBC, Eurocode, NBC and etc) applications and resolve compliance for issues related to exiting, occupancy and building types.

Skills & Experience:

• An experienced CSA Engineer with relevant semiconductor experience including design office and industrial facility experience gained with an EPC Contractor.

• Civil & Structural Engineering leadership experience on large EPC projects

• Experience in design of raised floor, demountable walls and ceiling grid systems for cleanroom spaces.

• Knowledge of civil, structural, underground and architectural design and engineering, as applicable for industrial facilities.

• Good knowledge of Geotechnical engineering principles

• Knowledge of piling, soil improvement and site preparation

• Knowledge of seismic design techniques and dynamic analysis of foundations for rotating/reciprocating machinery.

• Ability to apply in-depth skills and broad knowledge to address sophisticated problems and non-standard situations. Solves sophisticated problems; takes a broad perspective to identify innovative solutions.

• Capable of explaining difficult concepts and able to persuade others to adopt a point of view.

• Able to empower other team members.

Job Requirements:

• Bachelor’s Degree in CSA Engineering required

• Minimum 7 to 10 years of experience in the Semiconductor and/or Facilities-related industry

• Technical expertise, knowledge, and experience in building design and construction of the Semiconductor Wafer Fab building and CUB building.

• Ability to prioritize and schedule workload and work on multiple tasks concurrently

• Good organizational skills and Service demeanor.

• Excellent interpersonal skills and good teamwork skills,

• Excellent communication skills

• Self-motivated worker

• Familiarity with Semiconductor Manufacturing and Facilities systems

• Ability to travel internationally 15-25% of the time on average, but up to 30% of the time during Critical Project phases or Site Activities

Responsibilities and Tasks:

Metric Management

• Drive and align the FE Production team on critical reports for Line Management, Inventory Management and Cycle time.

• Own and maintain the Global Inventory Metrics, Business processes and Reports.

• Consolidate Fab Metrics performance and roll up for executive metrics update.

• Partner with sites closely to enable timely communication of fab deviation to plan.

• Improvement of efficiency of network Fab metrics consolidation through automation

Optimize the Inventory and Line Performance for the FE Network

• Able to analyze line performance and provide line direction through concept of Line Management and Inventory Management to meet business plan.

• Fluent in the basic concept of weekly wafer starts and wafer outs business process.

• Forecast potential roadblocks in inventory management and develop mitigation plans with the site SIC Managers.

• Collaborate with Area/Shift Production, Engineering, and IE to continually improve SIC metrics (wafers starts, wafer out, samples delivery, cycle time)

• Lead proof-of-concepts and facilitate deployment of BKM reports and automation to improve fab/ probe area efficiency and productivity.

• Develop manufacturing science concepts to line management and inventory scheduling.

• Participate in the WW SIC forums, facilitate network meetings and sustain/audit existing BKMs and business processes in the network.

• Create an environment of motivation to foster global team member’s engagement to the fullest of their potential.

• Promote and model the use of automation, analytical and systematic thinking processes.

Supply Chain Management

• Maintain open and regular two-way communication with Supply Chain teams to understand upcoming Die Mix and Pull-in changes

• Liaise and partner with Supply Chain teams to develop plans that fulfill all critical demand need

Requirements:

• Bachelors Degree in Engineering or related field of study or equivalent experience

• Intermediate knowledge of the 300mm semiconductor manufacturing process is preferred.

• More than 3 years experience in Inventory Control/Production Planning/Line Management is preferred.

• Thorough knowledge of Micron’s Lot Tracking, Capacity Planning, Scheduling, Line Management systems and related production and planning reporting tools.

• Demonstrate ability to solicit feedback, accept input and analyze success/failure in order to increase team’s effectiveness.

• Demonstrate understanding of different Mfg Area and different departments such as OI/PIE/Change Management to assist in area improvement projects.

• Demonstrate success in utilizing their knowledge of Mfg Area processes and equipment to make informed, confident decisions.

• Demonstrate meticulousness and striving for accuracy.

• Intermediate to advance proficiency with Microsoft Office programs including Word, Excel, and PowerPoint.

• SQL, Tableau, Reporting capability to enable automation is preferred.

Responsibilities and Tasks Responsibilities include but are not limited to:

Lead and Support Strategic Change Management initiatives

• Lead and support global alignment of processes and continuous improvement efforts.

• Lead SWAT activities and refine the SWAT charter to ensure scope and discussions address global and business needs, while maintaining effective communication with all stakeholders and leadership.

• Collaborate with subject matter experts (SMEs) to identify process gaps and implement Best Known Methods (BKMs).

• Collect, analyze, and evaluate data requests; establish trackable follow-up actions, monitor timelines, and assess gaps to confirm project objectives are achieved.

• Develop and maintain a roadmap and timeline to drive global alignment, system development, and deployment in partnership with end-users, sites, central teams, and developers.

• Build strong global relationships with GQ teams, OCT PEE, OCT MAE, SMAI, and IT to ensure business requirements are documented, validated, and escalated as needed.

• Conduct feasibility studies and provide technical assessments of global systems to support current and future manufacturing needs. 

Demonstrate Individual Competence/Technical Expertise

• Provide technical consulting and hands-on assistance to Fab teams in identifying and implementing optimal solutions.

• Identify functional and business processes to uncover opportunities and propose innovative global solutions that align with organizational goals.

• Stay current on industry trends and internal best practices through continuous learning, research, and participation in technical seminars to foster innovation.

Program Management

• Demonstrate the ability to successfully guide projects through the full lifecycle—initiation, planning, execution, and closure—while balancing time, cost, quality, scope, and risk/opportunity constraints.

• Collaborate with stakeholders and project team members to ensure accountability, coordinate activities, and drive timely completion of project tasks.

• Define clear success metrics, manage timelines, and engage stakeholders to ensure milestones and deliverables are achieved. 

Communication

• Provide timely updates to relevant stakeholders and management on project status, progress, and potential risks or opportunities based on project criticality.

• Share strategic ideas and recommendations to support corporate objectives, while actively listening to customer and stakeholder feedback to maximize organizational benefit.

• Build and maintain strong internal and external relationships to broaden influence and foster learning opportunities within the CH community.

• Communicate effectively with end-users, developers, and partners by clearly articulating goals, aligning on requirements, and ensuring agreed outcomes and milestones are met through structured and transparent communication. Share lessons learned, project repositories, summit insights, new technologies, conference proceedings, and Best Known Methods (BKMs) as part of knowledge exchange.

• Demonstrate cultural sensitivity by respecting diverse cultures and languages in all interactions.

Qualifications:

• Degree in Engineering.

• Minimum 3 years’ experience in semiconductor wafer fabrication preferable with experience on systems and business processes.

• Strong knowledge of Micron systems (ORION, Sigma, SPACE, ET, GeRM, MES) and/or Global Change Process (GCP).

• Demonstrated data analysis, multi-tasking and problem-solving skills with high level of attention to details.

• Proven ability to communicate effectively both written and verbal forms.

• Strong negotiating and collaboration skills and has partnered successfully with different cross functional groups.

• Strong customer focus skills and is dedicated to meeting the needs of customers.

• Successfully demonstrated skill in obtaining results through individual contribution and the coordination of multiple teams.

• Ability to present technical information to a various levels of audience   

• The ability and willingness to travel, including extended business travel.

Key Responsibilities

• Lead and drive global Product Integration initiatives to improve yield, quality, and benchmark performance across technology nodes and products.

• Centralize and synthesize project information (design requirements, test challenges, yield learning) from multiple global teams and drive execution to closure.

• Drive yield breakthroughs by understanding the end‑to‑end test flow, product design and operation, packaging interactions, and manufacturing processes while balancing yield vs. reliability requirements.

• Foster technical innovation by characterizing device failure modes using deep knowledge of device architecture, physics, packaging interaction, and available test/process knobs.

• Define and drive strategies to ensure Packaging Technology and Chip‑Package Interaction are developed and qualified ahead of product qualification.

• Lead cross‑functional and cross‑site taskforces (Product, Test, Yield, Design, Fab, Packaging, Quality, TD) to resolve yield and quality challenges in a timely manner.

• Promote network Best‑Known‑Method (BKM) development, standardization, and business process creation or re‑engineering to improve productivity and efficiency.

• Maintain strong working relationships with stakeholders in Fab, Technology Development, Product Engineering, Test Engineering, Quality, and Packaging teams.

• Communicate project status, risks, and proposals effectively through clear written reports and technical presentations.

• Proactively identify obstacles, escalate when needed, and partner with management to drive successful outcomes.

• Travel to Micron fab and development sites as needed to support project execution and alignment.
  

  Minimum Qualifications

  • Bachelor’s, Master’s, or PhD degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science Engineering, or a related field.

  • 2+ years of experience in one or more of the following:

  • Product Integration

  • Test Engineering

  • Yield Engineering

  • Design Engineering

  • BEOL semiconductor processing or process integration

  • Strong knowledge of Semiconductor Device Physics and DRAM product operations.

  • Understanding of wafer fabrication process flows, parametric/electrical testing, and probe yield.

  • Strong data analysis, debugging, troubleshooting, and problem‑solving skills with attention to detail.

  • Effective verbal and written communication skills with the ability to present to both small and large technical audiences.

  • Demonstrated ability to collaborate across functions and cultures, building strong customer and co‑worker relationships.

  • Ability to work independently with minimal supervision, manage multiple priorities, and stay organized.

  • Intermediate to advanced PC skills, including Microsoft Office.

  • Willingness to travel approximately 20–50% to support global project needs.

  • Flexibility to adapt to changing priorities and take on additional responsibilities as needed.

  Preferred Qualifications

  • Experience in DRAM High Bandwidth Memory (HBM) products.

  • Exposure to DRAM HPM, advanced packaging, chip‑package interaction, BEOL integration, or layout‑related topics.

  • Experience working across Test, Product, Yield, Design, Packaging, and Manufacturing organizations.

  • Proven ability to drive alignment and execution in central or network‑level roles.

  • Strong interest in innovation, continuous improvement, and scalable solution development.

Responsibilities and Tasks

• Drive E2E yield improvement initiatives across FE wafer fabrication, probe, assembly, and final test through deep data analysis and technical insight, with primary ownership from a Central YE perspective.

• Lead global yield analytics and learning loops, connecting FE process data, electrical/parametric test results, and AT test outcomes to rapidly identify root causes and improvement opportunities.

• Define and execute yield strategies to ensure FE process readiness and robustness are fully aligned and qualified to support downstream AT performance and overall product yield.

• Serve as a technical integrator across FE–AT boundaries, working with cross-functional teams to close gaps in yield, quality, and test coverage.

• Champion standardization of yield analysis methodologies, dashboards, and business processes across the Micron network, leveraging best-known methods (BKM) and benchmarking internal and external intelligence.

• Lead or actively participate in cross-site taskforces to resolve critical yield and quality excursions, ensuring timely containment, root cause identification, and sustainable corrective actions.

• Apply strong statistical and data-driven problem-solving techniques to large, complex manufacturing and test datasets to support decision-making and executive communication.

• Maintain and continuously enhance domain expertise in yield engineering, test methodologies, and FE–AT interactions, proactively identifying innovation opportunities with a structured and strategic mindset.

• Build strong working relationships with global peers and stakeholders in Fab, AT, TD, Product Engineering, and GQ. Communicate status, risks, and recommendations clearly and effectively.

• Deliver clear and compelling technical presentations to diverse audiences, including project updates, yield deep-dives, and new initiative proposals.

• Align regularly with management on goals, priorities, and execution status, proactively escalating risks and driving resolution.

• Travel to Micron global manufacturing and assembly/test sites as needed to support yield learning and execution.

Requirements

• Solid knowledge of semiconductor manufacturing and yield engineering, including FE wafer fabrication processes, electrical/parametric test, probe yield, and AT test fundamentals.

• Strong experience in E2E data analysis, correlating FE process data with probe and final test results to drive yield and quality improvements.

• Hands-on capability in statistical analysis, data mining, root cause analysis, and problem solving, with strong attention to detail.

• Experience with DRAM device operation, test flows, and yield learning methodologies is highly desirable.

• Exposure to FE integration, advanced packaging, AT processes, or test development is a plus.

• Excellent written and verbal communication skills, with the ability to clearly explain complex technical issues to cross-functional and global audiences.

• Demonstrated ability to work effectively in a matrixed, global environment, with strong collaboration and influence skills.

• Strong organizational skills and the ability to manage multiple priorities with minimal supervision.

• Intermediate to advanced PC skills, including Microsoft Office; experience with data analysis tools or scripting languages is a plus.

• Self-motivated, flexible, and proactive in taking ownership and driving results beyond defined responsibilities.

• Travel Required: Yes
  

  Job Profile:

  E2/3/4

As a Scanner Engineer in the Front‑End (FE) Operation Central Team (OCT) Central Process & Equipment Engineering (CPEE) Photo Scanner group, you will provide deep technical and operational leadership to drive best‑in‑class photo scanner performance across the global Micron network. 

You will partner closely with Technology Development (TD), R&D, manufacturing sites, suppliers, and central planning to deliver improvements in scanner uptime, utilization, productivity (WPD), tool install readiness, MA%, cost, and quality.

You will serve as a domain expert in scanner engineering, technology introduction, and network benchmarking, ensuring consistent execution and continuous improvement across sites. You will influence and elevate Micron’s global Photo Scanner performance, working with world‑class engineers, suppliers, and partner teams. This role offers a mix of deep technical challenges, cross‑site leadership, and large‑scale impact across the global network.

Key Responsibilities

1. Scanner Performance & Productivity Leadership

• Drive global improvements in WPD, uptime, utilization, MA%, and tool throughput across the Micron photo network.

• Benchmark site performance and establish best‑known‑methods (BKMs) to reduce variability and elevate network standards.

• Lead assessments and recovery actions for recurring issues, chronic network bottlenecks, and tool performance gaps.

2. New Technology & Tool Install Introduction

• Collaborate with TD, suppliers, and global facilities/layout teams to optimize tool‑install sequencing, qualification, ramp models, and readiness.

• Provide technical leadership during first‑of‑kind workstation introductions, ensuring manufacturing availability and utilization meet targets.

• Govern technical change management, ensuring alignment and consistency across sites.

3. Cross‑Functional and Supplier Collaboration

• Work with PEE teams, Quality Engineering, Central Planning, Procurement, and external suppliers to resolve issues and drive engineering improvements.

• Support supplier engagements, quality workshops, and cross‑company collaboration (e.g., ASML x Micron workshops) to ensure strong integration and performance stewardship. 

4. Continuous Improvement & Cost Optimization

• Lead projects targeting tool performances and availability, and cycle‑time improvements.

• Prioritize and execute continuous improvement projects aligned to OCT/CPEE strategies and manufacturing needs.

• Evaluate technical and operational solutions to reduce downtime, technician labor demand, and material/scrap cost.

5. Network Governance & Technical Stewardship

• Provide expert guidance on TOR, BKM governance, process windows, and technical decision frameworks.

• Ensure standardization of troubleshooting flows, tool health metrics, and scanner capability indices across sites.

Minimum Qualifications

• Bachelor’s or Master’s degree in Engineering (Electrical, Mechanical, Physics, Materials, or related field).

• 6+ years of relevant semiconductor photo processing or scanner engineering experience.

• Excellent communication and collaboration skills, including supplier engagement.

• Strong expertise with scanner hardware, applications, diagnostics, and process‑equipment interaction.

• Proven ability to lead cross‑functional and cross‑site engineering initiatives.

Preferred Qualifications

• Experience with ASML scanners and advanced technology node ramps.

• Demonstrated success in driving large‑scale manufacturing or equipment performance programs.

• Technical leadership in Photo technical engineering functions with excellent project management knowledge

• Experience with structured problem solving (8D, DOE, SPC).
  

  Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.

Responsibilities and Tasks:

• Establish Detection to have 100% Inline Visibility and Inline control

• Improve Detection strategy, system, and methods to continuously strengthen detection performance.

• Enhance Detection capability and strategy to enable Yield improvement, improve the cycle of Learning and strengthen Defense Line.

• Establish and improve BKM (Best Known Method) related to RAM Detection performance, RAM detection cost and RAM supplier engagement

• Ensure BKM sharing spans across all sites regardless of technology and/or site mission differences.

• Set up process parameters for Inspection and Measurement equipment.

• Plan and evaluate through supplier demo, tool evaluation or H2H (head-to-head) and promote new equipment/ material through TOR (Tool of Record) process.

• Implement abnormal analysis and improvement.

• Facilitate and drive global peer groups (HVM and TD) to ensure alignment on strategy and roadmap to achieve area objectives

• Prioritise resources (internally across network and/or externally with Suppliers) to close any gaps.

• Lead Copy Smart Team (CST) and hold the teams accountable to deliver to timelines/commitments. Support cross-site alignment activities through CST and provide strategic direction for the team.

• Set Business Process to manage your area(s) of responsibility to meet the expectations of programs and business processes and adhere to the standards required by those programs and processes.

• Actively provide recommendations to improve and optimize programs and processes to the respective program and/or process owners.

• Be part of the team to manage global business for RAM area, including Tool of Records (TOR), Model of Records (MOR), Manufacturing Tool Evaluation Program (MTEP), DOC2, Executive Review Meeting (ERM), Supplier Change Notice (SCM) documentation etc.

• Keep Acceptance Documentation and Configuration Specs (ADCS) updated to the current TOR configuration in your area(s) of responsibility.

• Manage projects with a proper Project Management process with metrics to track project success.

• Initiate, develop, drive and support strategies that not only benefit one site, but Micron network as a whole.

• Identify and share Best Known Method (BKM) across sites and track compliance with the agreed-upon alignment to BKMs.

• Track Fab performance metrics for benchmarking purposes. Identify gaps and areas of improvement for Fabs.

• Partner with Technology Development and Global Procurement to drive suppliers' competitiveness in RDA and Metrology area to reduce CAPEX and OpEx.

• Provide tactical support and coordination for the Fabs as the need arises for issues of People, Safety, Time to Mature cumulative Yield, Quality, Cost, and Cycle Time.

• Engage and drive suppliers on Tool roadmap (MRM), Technology sharing, and other projects

Requirements :

• Master's/Bachelor's in Engineering

• Relevant working experiences in RDA and/or Metrology

• Willing and capable of international travel, including Extended International Business Travel (EIBT) assignment to 6 months as needed, to accomplish the goals. Work with suppliers to address issues of spares delivery, quality, performance and change management.

• Good communication skills, maintain a strong and open relationship with peer group and appropriate team members in other functional areas such as Process Integration Engineering, Quality Systems, Production Operations Management, and Purchasing.

• Promote worldwide sharing and transfer of area-specific proven experience

As FE CPIE CPI PI Senior Engineer or Engineer at Micron Technology, Inc., you will be responsible for working with global Micron network to drive each silicon node's Packaging Product yield, quality improvement, new product introduction (NPI) through technical expertise, business process management and project execution.

 In addition, you will be responsible in integrating solutions by connecting cross-functional expertise, standardizing the business process and regularly benchmarking internal and external intelligence to achieve the highest value bits and productivity. 

Responsibilities and Tasks

• Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering.

• Define strategies to ensure that Packaging Technology and interaction with Front End manufacturing process are fully developed and qualified well ahead of any qualification of the product itself.  

• Lead the PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow in a timely manner to achieve BIC yield performance.

• Maintain and enhance domain knowledge and technical expertise, explore innovation opportunities with strategic thinking and systematic approach.

• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Fab, TD, Product Engineering, GQ. Communicate and respond to issues in a timely manner. Help drive to fix the issue where necessary.

• Demonstrate ability to give effective presentations to both small and large groups on project updates and new initiative proposals.

• Periodically follow up with manager to ensure all type of goals are met and get assistance to remove obstacles.

• Travel to Micron Fab locations as necessary for face-to-face work.

Requirements

• Bachelor’s  or Master's degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Material Science Engineering or related field .

• Knowledge in Semiconductor Device Physics, DRAM operations, wafer fabrication process flows, parametric/electrical test and probe yield.

• The experience on DRAM HPM, BEOL integration, advanced packaging and layout will be a plus to this job position.

• Good data analysis, troubleshoot, problem solving, reporting and presentation skills with a strong attention to detail.

• Good multi-tasking, verbal, and written communication skills.

• Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.

• Good organizational capabilities and ability to work effectively with minimal supervision.

• Intermediate to advanced PC skills including Microsoft Office.

• Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities.

• Travel Required: Yes. Willing to travel as needed to support department goals

• Travel Frequency: 20-50%.
  

  Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.

As Front End Central Product Integration Engineer-Chip Package Interaction at Micron Technology, Inc., you will be responsible for working with global Micron network to drive each silicon node's Packaging Product yield, quality improvement, new product introduction (NPI) through technical expertise, business process management and project execution.

In addition, you will be responsible in integrating solutions by connecting cross-functional expertise, standardizing the business process and regularly benchmarking internal and external intelligence to achieve the highest value bits and productivity. 

Responsibilities and Tasks

• Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering.

• Define strategies to ensure that Packaging Technology and interaction with Front End manufacturing process are fully developed and qualified well ahead of any qualification of the product itself.  

• Lead the PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow in a timely manner to achieve BIC yield performance.

• Maintain and enhance domain knowledge and technical expertise, explore innovation opportunities with strategic thinking and systematic approach.

• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Fab, TD, Product Engineering, GQ. Communicate and respond to issues in a timely manner. Help drive to fix the issue where necessary.

• Demonstrate ability to give effective presentations to both small and large groups on project updates and new initiative proposals.

• Periodically follow up with manager to ensure all type of goals are met and get assistance to remove obstacles.

• Travel to Micron Fab locations as necessary for face-to-face work.

Requirements

• Bachelor’s  or Master's degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Material Science Engineering or related field

• A minimum of 2 years of experience in Back-End-of-Line (BEOL) semiconductor processing or process integration is required

• Must be willing to travel as needed to support departmental goals, with an expected travel frequency of approximately 20–50%

• Knowledge in Semiconductor Device Physics, DRAM operations, wafer fabrication process flows, parametric/electrical test and probe yield.

• The experience on DRAM HPM, BEOL integration, advanced packaging and layout will be a plus to this job position.

• Good data analysis, troubleshoot, problem solving, reporting and presentation skills with a strong attention to detail.

• Good multi-tasking, verbal, and written communication skills.

• Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.

• Good organizational capabilities and ability to work effectively with minimal supervision.

• Intermediate to advanced PC skills including Microsoft Office.

• Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities.
  

  Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.

Key Responsibilities

• Leadership & Strategy

• Lead and manage OCT Photo teams across multiple sites, ensuring alignment with company goals and technology roadmaps.

• Develop your team, build up, train and enable collaborations across all collaborators.

• Drive strategic initiatives in scanner and track hardware, process optimization, cost reduction and yield improvement.

• Build and implement Photo Manufacturing Roadmap, Equipment and Material Strategy for capex optimization in new node enablement and ramp-up.

• Engage with both internal and external suppliers to strengthen partnership and lead initiatives to achieve and exceed internal customer expectations

• Lead worldwide efforts to transform VOC (voice of the customer) to enhance Photo team business processes or standards

• Cross-Functional Collaboration

• Partner with multiple cross function teams such as global procurement, global quality, central process integration engineering, Technology development, Central Planning and Modeling, Central Layout, SMAI, Corp IT, FECOS, MAE etc teams across central and site-specific organizations to achieve best in class Photo DRUM performance and cost.

• Represent Micron in Photo supplier engagements and industry forums to influence Photolithography manufacturing roadmap and equipment strategies.

• Project & Business Process Management

• Contribute to global expansion projects in both existing facilities and greenfield sites

• Prioritize and manage numerous projects aligned with fab and corporate objectives.

• Spearhead global initiatives to boost product performance by implementing improvements to equipment or applications

• Lead and govern Photo SWATs teams and Photo Technical Authority teams to drive best in class performance. 

• Facilitate Photo SEAL PPP ranking for resource management and prioritization.

• Workforce Development

• Lead all aspects of workforce readiness and team member development in collaboration with workforce development partners.

• Mentor and grow future TLP leaders in Photo engineering and applications.

• Based on the OCT Photo Functional Responsibilities, the Director will be responsible for:

• ERM engagement across ASML, Canon, TEL

• Cost management (Photo materials, spares, laser)

• MOR and Capex planning for DRAM and NAND

• EUV/DUV track hardware, materials, defectivity, and Photo efficiency

• Scanner hardware and applications (ASML EUV, DUV, Canon, Nikon)

• Photo metrology, overlay, and reticle specifications

• Strategy development and data science projects for Photo innovations

• Govern TOR for new Photo Tool configurations and Doc2

• Job Requirements and Skills

• Bachelor’s or master’s degree in engineering, Physics, Materials Science, or a related field; equivalent experience will be considered.

• Proven expertise in the field of semiconductor production, having served in leadership positions for a minimum of 5 years.

• Proven record of accomplishment in managing multi-functional teams and driving technical programs.

• Proven leadership in semiconductor manufacturing, preferably in Photo process engineering and equipment strategy.

• Experience with EUV/DUV technologies, scanner and track systems, and supplier engagement.

• Strong project management skills with ability to lead multi-functional teams across geographies.

• Excellent communication and leadership skills.

Responsibilities and Tasks:

• Drive end‑to‑end front‑end process integration across multiple modules to support yield, functionality, and scalability

• Lead cross‑module root cause analysis for complex yield detractors and integration issues

• Support yield ramp, derivative matching, and node transitions through focused integration execution

• Act as a core cPIE contributor for assigned programs, partnering closely with site PI/PE/Device teams

• Develop and apply Best Known Methods (BKM) within owned integration scope

• Provide technical input to POR/TOR and ECN decisions affecting integration margin

• Apply data‑driven analysis to quantify process sensitivity, margin, and risk

• Participate in SWAT teams and technical deep dives for high‑impact issues

• Mentor junior engineers and contribute to knowledge sharing within CPIE

• Collaborate with PI, PE, Device, Yield, TD, and Quality to accelerate learning cycles

Required Qualifications:

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related discipline

• At least 3 years of strong front‑end semiconductor manufacturing experience, with demonstrated exposure to process integration across multiple modules

• Proven ability to perform complex root‑cause analysis on yield, functionality, or integration issues using data‑driven methods

• Solid understanding of device–process interactions and system‑level integration trade‑offs

• Experience collaborating across PI, PE, Device, Yield, TD, and Quality organisations

• Ability to influence technical decisions through analysis, insight, and technical credibility

• Strong written and verbal communication skills for technical reviews, deep dives, and cross‑team alignment

Good to Have:

• Direct experience supporting advanced DRAM technology nodes and/or technology ramps

• Demonstrated ownership of integration loops, yield ramp activities, or derivative matching efforts

• Experience contributing to or developing Best Known Methods (BKM), standard practices, or reusable integration solutions

• Familiarity with POR/TOR definition, ECN review, and change risk assessment from an integration perspective

• Exposure to statistical analysis, yield modelling, or advanced analytics applied to manufacturing data

• Track record of leading or contributing to SWAT teams or high‑impact technical investigations

• Experience mentoring junior engineers or serving as a technical reference within a team
  

  Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.

As a HBM Customer Systems Validation Engineer at Micron Technology, Inc., you will:

• Be responsible for system-level validation, failure analysis, characterization, and experimentation of customer systems

• Run and configure diagnostic software, design experiments, analyze and interpret data, creating custom tools (Hardware and Software), presenting data to customers both inside and outside Micron

• Provide technical customer integration support at customer locations. To accomplish these responsibilities, you will use a variety of equipment (oscilloscopes, logic analyzers, signal generators, multi-meters, etc.)

• Work with customers and memory enablers like GPU manufacturers to attain design wins and qualifications of Micron memory products in their applications

• You will work with other engineers within the HBM team, Product Engineering, FAE, Quality Assurance, and business unit teams

Debug Micron Product Customer Failures

• Provide technical support to customers and the field sales

• Utilize diagnostics to reproduce the original failure

• Identify failure mechanism

• Collaborate with Product Engineering and Return Material Authorization (RMA)

• Provide 8D or failure documentation for customer failure resolution

• Implement fixes for fails (design or process)

Design and Implement Micron System Tools

• Create test scripts for a variety of applications

• Create and modify hardware that controls test parameters (i.e. temperature or voltage)

• Support internal customer diagnostics software and hardware tools within Micron labs

• Interface with external customer to create intelligent DOE (design of experiments)

Perform System Characterization

• Use software, Internal logic analyzers, oscilloscopes, and other tools to understand system memory usage

• Develop software to interpret data

• Collaborating with Product and Application Engineering

• Communicating results with cross-functional teams and customers

Successful candidates will have, but not limited to:

• A Bachelor’s or a Master’s degree in Electrical and Computer Engineering (or an equivalent field) with 2-4 years of experience or 1-3 years of experience respectively, both requiring a balanced hardware and software skill set.

• Comfortable working and programming with Linux, Python/C/C++, version control systems (git, svn)

• Excellent problem-solving and analytical skills

• Works well in a team environment

• Good communication, data analytics and presentation skills

• Basic understanding of DRAM operations and computer networking

• Self-motivation and passion

Successful candidates suggested to have but not required:

• Experience in bios/linux driver development/debug

• Understanding of system architecture and memory subsystem

• Comfortable working with lab equipment including oscilloscopes, logic analyzer, protocol analyzers, soldering equipment, etc

• Previous experience validating products with both hardware/firmware/software components

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The role of a High Bandwidth Memory (HBM) System Engineer at Micron Technology, Inc. is pivotal in the introduction of Micron's HBM with our customers.  This role will empower customers through the utilization of High Bandwidth Memory (HBM) integrated with ground breaking 2.5D and 3D System in Package (SiP) solutions. This encompasses a comprehensive approach to system level testing, encompassing electrical, software, and system validation perspectives. The incumbent will spearhead the development of innovative test algorithms and plans, which includes the design and execution of robust system test infrastructure capabilities to ensure the highest standards of quality and performance.  Your strategic leadership will be crucial in synchronizing efforts across various teams to achieve a seamless and successful product launch with our customers.

Responsibilities:

Provide Technical Leadership and Direction

• Initiate collaborations with customers, Technology Development (TD), Testing, and Manufacturing teams in advance of silicon arrival

• Maintain responsibility for the successful customer launch of the product

• Great communication and presentation skills – ability to present to both internal leadership and customer forums

• Strong interpersonal skills with ability to convey sophisticated technical concepts to peers and customers

• Develop, diagnose, and validate HBM System testing programs and inhouse system solutions

• Assess and determine the necessary equipment and hardware for optimal system validation processes

• Lead the development of High-Performance Computing (HPC) and Artificial Intelligence (AI) software testing strategies to enhance product testing

• Strategically plan projects and manage resource allocation to adhere to established timelines and objectives

• Enhance efficiency, coverage, turnaround time of validation activities

• Provide guidance and ensure alignment with specific company-wide projects

Minimum Qualifications:

• BS or MS in Electrical or Computer Engineering or related field.

• 8+ years (BS) or 10+ years (MS) of relevant experience.

• Deep knowledge of DRAM operation, JEDEC specs, and HBM product family.

• Strong communication skills to convey complex technical concepts.

• Experience with scripting languages (Python, TCL, Perl).

• Proven innovation and problem-solving in high-performance memory development

• Good understanding of computer architecture, memory subsystems, and memory technologies

• Proven team leader – respect, integrity, positive demeanor

Preferred Qualifications:

• Understanding of system architectures and memory subsystems; Previous experience validating products with both hardware/firmware/software components

• Experience with bring-up and validation of ASIC/GPU with HBM memory subsystems

• Familiarity with industry-standard memory interfaces and protocols, such as LPDDR, DDR, HBM, GDDR, CXL, UCIe, and PCIe

• Excellent problem-solving and analytical skills

• A self-motivated, enthusiastic team player who enjoys working with others

• Good communication skills with the ability to convey complex technical concepts to other design and verification peers in verbal and written form

As a HBM Customer Systems Validation Engineer at Micron Technology, Inc., you will:

• Be responsible for system-level validation, failure analysis, characterization, and experimentation of customer systems

• Run and configure diagnostic software, design experiments, analyze and interpret data, creating custom tools (Hardware and Software), presenting data to customers both inside and outside Micron

• Provide technical customer integration support at customer locations. To accomplish these responsibilities, you will use a variety of equipment (oscilloscopes, logic analyzers, signal generators, multi-meters, etc.)

• Work with customers and memory enablers like GPU manufacturers to attain design wins and qualifications of Micron memory products in their applications

• You will work with other engineers within the HBM team, Product Engineering, FAE, Quality Assurance, and business unit teams

Debug Micron Product Customer Failures

• Provide technical support to customers and the field sales

• Utilize diagnostics to reproduce the original failure

• Identify failure mechanism

• Collaborate with Product Engineering and Return Material Authorization (RMA)

• Provide 8D or failure documentation for customer failure resolution

• Implement fixes for fails (design or process)

Design and Implement Micron System Tools

• Create test scripts for a variety of applications

• Create and modify hardware that controls test parameters (i.e. temperature or voltage)

• Support internal customer diagnostics software and hardware tools within Micron labs

• Interface with external customer to create intelligent DOE (design of experiments)

Perform System Characterization

• Use software, Internal logic analyzers, oscilloscopes, and other tools to understand system memory usage

• Develop software to interpret data

• Collaborating with Product and Application Engineering

• Communicating results with cross-functional teams and customers

Successful candidates will have, but not limited to:

• A Bachelor’s or a Master’s degree in Electrical and Computer Engineering (or an equivalent field) with 3-5 years of experience or 2-4 years of experience respectively, both requiring a balanced hardware and software skill set.

• Comfortable working and programming with Linux, Python/C/C++, version control systems (git, svn)

• Excellent problem-solving and analytical skills

• Works well in a team environment

• Good communication, data analytics and presentation skills

• Basic understanding of DRAM operations and computer networking

• Self-motivation and passion

Successful candidates suggested to have but not required:

• Experience in bios/linux driver development/debug

• Understanding of system architecture and memory subsystem

• Comfortable working with lab equipment including oscilloscopes, logic analyzer, protocol analyzers, soldering equipment, etc

• Previous experience validating products with both hardware/firmware/software components

Purpose
Provide quality end-to-end Service Delivery of Wealth Management Settlement transactions in accordance to ENBD Group directives. Ensure compliance to Group policies and procedures, local regulatory requirements and guidelines, review of processes to ensure effective controls and efficiency is in place. The unit works closely with ENBD HO IT, Group Wealth Ops / Group Wealth Management and Global Services (Tanfeeth) to leverage on technology to support our physical and digital banking services and operations.
Job Content

1. Operations & Control

• Review procedural control frameworks to ensure implementation of Wealth Management processing and Settlements operation procedures.
• Conduct effective day-to-day management of all Wealth Management Settlements operation issues, adhering to Group and local approval matrices.
• Ensure appropriate controls via timely updates on reconciliations through support and ongoing engagement levels with relevant business / support units e.g., other operations units, Finance, ENBD Global Services (Tanfeeth), International etc.
• Work with custodians on operational and settlements related matters with respect to custody of investments held.
• Monitor control operations and conduct regular reviews to ensure that they reflect changes in products, systems, policy and regulation.
• Regular process review to eliminate unproductive processes.
• Track and ensure system & process issues are resolved and control gaps are addressed.
• Ensure compliance with all regulatory requirements and internal policies with respect to Private Bank / Wealth Management.

2. Operational Risk

• Manage errors in processing, system errors. Work with relevant parties to resolve issues.
• Regular process review to eliminate erroneous steps or processes.
• Review errors resulting in operational losses and revise processes to address any risks or control issues.
• Engage stakeholders to resolve any operational risk issues.
• Timely escalation of potential operational issues / losses, risks.

3. New Products / Initiatives / Projects

• Review new product programs rolled out for Singapore branch taking into consideration all the rules involved in Wealth Management Settlement, all regulatory requirement and compliance guidelines.
• Lead various Weath Management Ops related projects / initiatives.
• Review and propose new process / process improvements taking into consideration system capability, policies and procedures, regulatory requirements, reporting requirement etc.
• Oversee and manage rollout of new Wealth Management systems, working closely with stakeholders in SIN WM, HO IT, Compliance, Finance.
• Work with Group Wealth Management and Wealth Operations to support operationalization of new products and initiatives.
• Proactive engagement with project teams on planning and execution of User Acceptance Tests (UAT).

4. Business Continuity Planning (BCP)

• Review and update business continuity plans for Wealth Management Settlement Ops.
• Work with various business and support units to perform Business Impact Analysis.

5. Reporting

• Ensure submission of regulatory reports and country specific reports in timely manner and with accuracy.
• Submission of performance KPIs on Ops Service Delivery to INTL COO.

Requirements

• Min. a Diploma / Bachelor’s degree from a reputable university.
• Min. 15 years of working in the Banking Industry and 10 years in Wealth Management / Private Bank operations experience.
• Good knowledge and understanding Wealth Management / Private Banking regulations and securities operations.
• Experience with end-to-end settlement process including managing of operating requirements with custodians, settlement and asset services on alternative assets, including illiquid, semi liquid and OTC products.
• Experienced in handling a small team.
• Conscientious, independent and takes initiative.
• Excellent interpersonal skill
• Self-motivated and hard working

*Note that salary will be commensurate with relevant experience.

Responsibilities and Tasks:

• Drive end‑to‑end front‑end process integration across multiple modules to support yield, functionality, and scalability

• Lead cross‑module root cause analysis for complex yield detractors and integration issues

• Support yield ramp, derivative matching, and node transitions through focused integration execution

• Act as a core cPIE contributor for assigned programs, partnering closely with site PI/PE/Device teams

• Develop and apply Best Known Methods (BKM) within owned integration scope

• Provide technical input to POR/TOR and ECN decisions affecting integration margin

• Apply data‑driven analysis to quantify process sensitivity, margin, and risk

• Participate in SWAT teams and technical deep dives for high‑impact issues

• Mentor junior engineers and contribute to knowledge sharing within CPIE

• Collaborate with PI, PE, Device, Yield, TD, and Quality to accelerate learning cycles

Required Qualifications:

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related discipline

• At least 3 years of strong front‑end semiconductor manufacturing experience, with demonstrated exposure to process integration across multiple modules

• Proven ability to perform complex root‑cause analysis on yield, functionality, or integration issues using data‑driven methods

• Solid understanding of device–process interactions and system‑level integration trade‑offs

• Experience collaborating across PI, PE, Device, Yield, TD, and Quality organisations

• Ability to influence technical decisions through analysis, insight, and technical credibility

• Strong written and verbal communication skills for technical reviews, deep dives, and cross‑team alignment
  

  Good to Have:

  • Direct experience supporting advanced DRAM technology nodes and/or technology ramps

  • Demonstrated ownership of integration loops, yield ramp activities, or derivative matching efforts

  • Experience contributing to or developing Best Known Methods (BKM), standard practices, or reusable integration solutions

  • Familiarity with POR/TOR definition, ECN review, and change risk assessment from an integration perspective

  • Exposure to statistical analysis, yield modelling, or advanced analytics applied to manufacturing data

  • Track record of leading or contributing to SWAT teams or high‑impact technical investigations

  • Experience mentoring junior engineers or serving as a technical reference within a team
    

    Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.

As a Global FE Central Planning Capital Engineer at Micron, you will play a critical role in driving capital planning excellence across our global Front-End Manufacturing network. You will be part of the Global FE team responsible for end-to-end capital budgeting, funding governance, and capital savings initiatives, enabling data-driven investment decisions that support Micron’s long-term manufacturing strategy.

In this role, you will partner closely with Micron Central teams, site (Fab) stakeholders, Global Procurement, Global Facilities and Finance to consolidate capital requirements, evaluate trade-offs, and ensure funding alignment. You will leverage strong analytical, communication, and presentation skills to translate complex capital data into clear, actionable insights for leadership decision-making. 

The ideal candidate brings a strong understanding of capital expenditure (CAPEX) management, demonstrates structured problem-solving capabilities, and proactively identifies opportunities for capital optimization, cost efficiency, and process improvement across the global FE footprint. This role offers broad exposure to global stakeholders and the opportunity to influence high-impact capital decisions at scale.

Roles & Responsibilities

Capital Ledger Management

• Own and maintain the Global FE Capital Ledger, ensuring accuracy, completeness, and alignment with approved budgets and funding decisions.

• Perform regular reconciliation across capital systems and financial records to support reporting, compliance, and audit readiness.

• Provide clear visibility of capital position, movements, and variances to key stakeholders.

ER / Portfolio / LRP Fanout

• Lead Executive Review (ER), Capital Portfolio, and Long‑Range Plan (LRP) fanout activities across sites and central stakeholders.

• Translate top‑down capital targets into site‑level guidance and ensure consistent understanding of assumptions, constraints, and priorities.

• Partner with Central Teams, Sites, Finance, Facilities, and Procurement to resolve gaps and alignment issues.

Quarterly BP CAPEX

• Drive Quarterly Business Plan (BP) CAPEX cycles, including data consolidation, validation, and submission.

• Ensure consistency between BP assumptions, Capital Management system references and execution outlook.

• Support leadership reviews by providing risks call out, and trade‑off options.

WFE / BOD Support

• Support Wafer Fab Equipment (WFE) and Board of Directors (BOD) related capital reviews and materials.

• Prepare and validate capital data, narratives, and insights required for executive‑level decision making.

• Ensure alignment between capital strategy, business priorities, and manufacturing roadmaps.

Micron Central Teams CAPEX Management

• Manage Central Teams' capital to balance gaps, timing differences, and scenario adjustments across portfolios.

• Work with stakeholders to drive accurate updates to the Central Teams CAPEX.

• Clearly communicate risks, and mitigation plans to leadership.

Capital System Enhancement

• Drive Capital System (CALM) and process enhancements to improve usability, data quality, automation, and reporting efficiency.

• Act as a business partner to IT and system owners by defining requirements, validating solutions, and supporting deployment.

• Continuously identify opportunities to streamline capital planning and reporting workflows.

CALM Plan CF Cleanup

• Own CALM planned cashflow (CF) cleanup activities to ensure data integrity and accuracy.

• Identify and resolve inconsistencies, timing issues, and data quality gaps in planned cashflow.

• Partner with sites and central teams to reinforce disciplined capital planning and execution practice

ESLT Preparation

• Prepare capital‑related content for Equipment Strategy Leadership Team (ESLT) reviews.

• Develop concise, data‑driven narratives that highlight key issues, risks, opportunities, and decisions required.

• Ensure leadership materials are accurate, timely, and aligned across functions.

Daily Cashflow Report Snapshot

• Produce and maintain daily cashflow report snapshots to support near‑term capital visibility and monitoring.

• Ensure timely delivery of accurate data for operational tracking, issue escalation, and leadership awareness.

• Analyze daily movements and highlight anomalies or risks proactively.

Requirements

• Bachelor’s or Master’s degree in Engineering (Industrial and Systems, or related discipline).

• Strong verbal communication and presentation skills, with the ability to clearly communicate capital plans, trade‑offs, and recommendations to technical and business stakeholders.

• Proven ability to work effectively in a cross‑functional, global team environment, partnering closely with Manufacturing, Finance, Procurement, Facilities, and Technology teams.

• Strong data validation, data integrity, and reporting skills to support accurate capital tracking, forecasting, and governance.

• Demonstrated strength in data analysis, quantitative reasoning, and structured problem-solving related to CAPEX planning and execution.

• Ability to synthesize large and complex datasets into clear insights and actionable conclusions that support capital investment and prioritization decisions.

• Strong customer and stakeholder focus, with the ability to understand business needs and translate them into data‑driven capital plans.

• Solid knowledge and practical application of statistics, data analysis techniques, and problem‑solving methodologies to support capital planning and performance assessment.

• High level of independence, ownership, and determination to deliver high‑quality results on time in a fast‑paced, deadline‑driven environment.

• Familiarity with capital tracking systems, planning tools, or financial models used for CAPEX governance and reporting.

• Ability to manage multiple priorities across competing programs while maintaining data accuracy and stakeholder alignment