Total 3,174 job vacancies in Singapore

Key Responsibilities:

• Direct strategic and tactical capacity planning for all elements of test wafer and carrier life cycles, ensuring flawless completion of Send-Fab operational efficiency.

• Collaborate with Industrial Engineering to assess workstation capacity and pinpoint operational bottlenecks, applying creative solutions to improve efficiency and output.

• Facilitate the introduction and qualification of new materials, establishing risk management protocols and automated systems to ensure business continuity.

Material Handling Operation Team

• Coordinate SMART warehouse operations, emphasizing efficient staffing, process efficiency, and strict adherence to customer and quality standards.

• Prioritize the implementation of automation and technology-based solutions to streamline logistics, reducing manual intervention and improving delivery accuracy.

• Support the integration of automation tools and AI to improve productivity and maintain business continuity.

Digital Twin and Process Automation

• Orchestrate the deployment of Digital Twin technology and agentic AI, applying simulation-based optimization for space utilization, material flow, and delivery efficiency.

• Collaborate with internal and external partners to develop and roll out physical AI solutions, improving efficiency, quality, and safety.

• Lead cross-functional projects to integrate Digital Twin simulation and Physical AI into Fab operations, driving continuous improvement of automation platforms to achieve high availability and cost-effectiveness.

• Formulate interpersonal resource plans, advance talent development, and prepare change-management strategies to maintain operational alignment with the Business Plan.
  

  • Bachelor’s or Master’s degree in engineering or a related field, or equivalent experience

  • Minimum 5 years of relevant semiconductor industry engineering experience in a managerial role

  • Preferably with experience working in Fab operations and equipment or automation with understanding of Semiconductor operation flow

  • Strong data analysis, problem solving and fixing skills with consistent track record to solve problems and address root causes

  • Demonstrated capability in proactively prioritizing projects that meet the Fab operation goals.

  • Proven experience in team development, project management, or a similar role

  • Strong leadership and team building skills

  • Excellent communication and presentation skills, both verbal and written.

  • Visionary and futuristic view of Automation

As FE CPIE CPI PI Senior Engineer or Engineer at Micron Technology, Inc., you will be responsible for working with global Micron network to drive each silicon node's Packaging Product yield, quality improvement, new product introduction (NPI) through technical expertise, business process management and project execution.

 In addition, you will be responsible in integrating solutions by connecting cross-functional expertise, standardizing the business process and regularly benchmarking internal and external intelligence to achieve the highest value bits and productivity. 

Responsibilities and Tasks

• Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering.

• Define strategies to ensure that Packaging Technology and interaction with Front End manufacturing process are fully developed and qualified well ahead of any qualification of the product itself.  

• Lead the PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow in a timely manner to achieve BIC yield performance.

• Maintain and enhance domain knowledge and technical expertise, explore innovation opportunities with strategic thinking and systematic approach.

• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Fab, TD, Product Engineering, GQ. Communicate and respond to issues in a timely manner. Help drive to fix the issue where necessary.

• Demonstrate ability to give effective presentations to both small and large groups on project updates and new initiative proposals.

• Periodically follow up with manager to ensure all type of goals are met and get assistance to remove obstacles.

• Travel to Micron Fab locations as necessary for face-to-face work.

Requirements

• Bachelor’s  or Master's degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Material Science Engineering or related field .

• Knowledge in Semiconductor Device Physics, DRAM operations, wafer fabrication process flows, parametric/electrical test and probe yield.

• The experience on DRAM HPM, BEOL integration, advanced packaging and layout will be a plus to this job position.

• Good data analysis, troubleshoot, problem solving, reporting and presentation skills with a strong attention to detail.

• Good multi-tasking, verbal, and written communication skills.

• Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.

• Good organizational capabilities and ability to work effectively with minimal supervision.

• Intermediate to advanced PC skills including Microsoft Office.

• Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities.

• Travel Required: Yes. Willing to travel as needed to support department goals

• Travel Frequency: 20-50%.
  

  Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.

As Front End Central Product Integration Engineer-Chip Package Interaction at Micron Technology, Inc., you will be responsible for working with global Micron network to drive each silicon node's Packaging Product yield, quality improvement, new product introduction (NPI) through technical expertise, business process management and project execution.

In addition, you will be responsible in integrating solutions by connecting cross-functional expertise, standardizing the business process and regularly benchmarking internal and external intelligence to achieve the highest value bits and productivity. 

Responsibilities and Tasks

• Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering.

• Define strategies to ensure that Packaging Technology and interaction with Front End manufacturing process are fully developed and qualified well ahead of any qualification of the product itself.  

• Lead the PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow in a timely manner to achieve BIC yield performance.

• Maintain and enhance domain knowledge and technical expertise, explore innovation opportunities with strategic thinking and systematic approach.

• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Fab, TD, Product Engineering, GQ. Communicate and respond to issues in a timely manner. Help drive to fix the issue where necessary.

• Demonstrate ability to give effective presentations to both small and large groups on project updates and new initiative proposals.

• Periodically follow up with manager to ensure all type of goals are met and get assistance to remove obstacles.

• Travel to Micron Fab locations as necessary for face-to-face work.

Requirements

• Bachelor’s  or Master's degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Material Science Engineering or related field

• A minimum of 2 years of experience in Back-End-of-Line (BEOL) semiconductor processing or process integration is required

• Must be willing to travel as needed to support departmental goals, with an expected travel frequency of approximately 20–50%

• Knowledge in Semiconductor Device Physics, DRAM operations, wafer fabrication process flows, parametric/electrical test and probe yield.

• The experience on DRAM HPM, BEOL integration, advanced packaging and layout will be a plus to this job position.

• Good data analysis, troubleshoot, problem solving, reporting and presentation skills with a strong attention to detail.

• Good multi-tasking, verbal, and written communication skills.

• Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.

• Good organizational capabilities and ability to work effectively with minimal supervision.

• Intermediate to advanced PC skills including Microsoft Office.

• Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities.
  

  Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.

Key Responsibilities

• Leadership & Strategy

• Lead and manage OCT Photo teams across multiple sites, ensuring alignment with company goals and technology roadmaps.

• Develop your team, build up, train and enable collaborations across all collaborators.

• Drive strategic initiatives in scanner and track hardware, process optimization, cost reduction and yield improvement.

• Build and implement Photo Manufacturing Roadmap, Equipment and Material Strategy for capex optimization in new node enablement and ramp-up.

• Engage with both internal and external suppliers to strengthen partnership and lead initiatives to achieve and exceed internal customer expectations

• Lead worldwide efforts to transform VOC (voice of the customer) to enhance Photo team business processes or standards

• Cross-Functional Collaboration

• Partner with multiple cross function teams such as global procurement, global quality, central process integration engineering, Technology development, Central Planning and Modeling, Central Layout, SMAI, Corp IT, FECOS, MAE etc teams across central and site-specific organizations to achieve best in class Photo DRUM performance and cost.

• Represent Micron in Photo supplier engagements and industry forums to influence Photolithography manufacturing roadmap and equipment strategies.

• Project & Business Process Management

• Contribute to global expansion projects in both existing facilities and greenfield sites

• Prioritize and manage numerous projects aligned with fab and corporate objectives.

• Spearhead global initiatives to boost product performance by implementing improvements to equipment or applications

• Lead and govern Photo SWATs teams and Photo Technical Authority teams to drive best in class performance. 

• Facilitate Photo SEAL PPP ranking for resource management and prioritization.

• Workforce Development

• Lead all aspects of workforce readiness and team member development in collaboration with workforce development partners.

• Mentor and grow future TLP leaders in Photo engineering and applications.

• Based on the OCT Photo Functional Responsibilities, the Director will be responsible for:

• ERM engagement across ASML, Canon, TEL

• Cost management (Photo materials, spares, laser)

• MOR and Capex planning for DRAM and NAND

• EUV/DUV track hardware, materials, defectivity, and Photo efficiency

• Scanner hardware and applications (ASML EUV, DUV, Canon, Nikon)

• Photo metrology, overlay, and reticle specifications

• Strategy development and data science projects for Photo innovations

• Govern TOR for new Photo Tool configurations and Doc2

• Job Requirements and Skills

• Bachelor’s or master’s degree in engineering, Physics, Materials Science, or a related field; equivalent experience will be considered.

• Proven expertise in the field of semiconductor production, having served in leadership positions for a minimum of 5 years.

• Proven record of accomplishment in managing multi-functional teams and driving technical programs.

• Proven leadership in semiconductor manufacturing, preferably in Photo process engineering and equipment strategy.

• Experience with EUV/DUV technologies, scanner and track systems, and supplier engagement.

• Strong project management skills with ability to lead multi-functional teams across geographies.

• Excellent communication and leadership skills.

Responsibilities and Tasks:

• Drive end‑to‑end front‑end process integration across multiple modules to support yield, functionality, and scalability

• Lead cross‑module root cause analysis for complex yield detractors and integration issues

• Support yield ramp, derivative matching, and node transitions through focused integration execution

• Act as a core cPIE contributor for assigned programs, partnering closely with site PI/PE/Device teams

• Develop and apply Best Known Methods (BKM) within owned integration scope

• Provide technical input to POR/TOR and ECN decisions affecting integration margin

• Apply data‑driven analysis to quantify process sensitivity, margin, and risk

• Participate in SWAT teams and technical deep dives for high‑impact issues

• Mentor junior engineers and contribute to knowledge sharing within CPIE

• Collaborate with PI, PE, Device, Yield, TD, and Quality to accelerate learning cycles

Required Qualifications:

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related discipline

• At least 3 years of strong front‑end semiconductor manufacturing experience, with demonstrated exposure to process integration across multiple modules

• Proven ability to perform complex root‑cause analysis on yield, functionality, or integration issues using data‑driven methods

• Solid understanding of device–process interactions and system‑level integration trade‑offs

• Experience collaborating across PI, PE, Device, Yield, TD, and Quality organisations

• Ability to influence technical decisions through analysis, insight, and technical credibility

• Strong written and verbal communication skills for technical reviews, deep dives, and cross‑team alignment

Good to Have:

• Direct experience supporting advanced DRAM technology nodes and/or technology ramps

• Demonstrated ownership of integration loops, yield ramp activities, or derivative matching efforts

• Experience contributing to or developing Best Known Methods (BKM), standard practices, or reusable integration solutions

• Familiarity with POR/TOR definition, ECN review, and change risk assessment from an integration perspective

• Exposure to statistical analysis, yield modelling, or advanced analytics applied to manufacturing data

• Track record of leading or contributing to SWAT teams or high‑impact technical investigations

• Experience mentoring junior engineers or serving as a technical reference within a team
  

  Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.

Micron Technology is a global leader in memory and storage solutions. 
As the Senior Manager, MTE TIQ and Materials Cost, you will lead global Tool Installation Qualification (TIQ) strategy and Materials Cash Cost Value Engineering to achieve Best in Class (BIC) performance across Micron’s front-end manufacturing network. 

This role is accountable for driving standardised TIQ BKMs, enabling cross-site execution excellence, and delivering year-on-year cost-per-gigabit reductions through materials value engineering. You will partner closely with Fab Operations, Site Facilities & Global Facilities, Global Procurement, Central Engineering, Technology Development, and Suppliers. 

Key Responsibilities 

TIQ Strategy & Execution 

• Define and drive global TIQ engineering strategy, BKMs, and business processes 

• Lead year on year optimization in TIQ safety, schedule, cost, BKM and quality 

• Monitor TIQ performance metrics, benchmark fab performance, and enable cross-site learning 

• Provide tactical TIQ support to ramping and operating fabs 

Front End Materials Cost & Value Engineering 

• Drive Front End Materials Cash Cost VE (value engineering) strategy to achieve front-end manufacturing cost targets 

• Lead cross-functional programs across Chemicals, Film & Gas, Photo, CMP materials, Bulk gas and UPW 

• Partner with Procurement, suppliers and sites to identify, prioritize, and execute cost-reduction opportunities 

• Ensure alignment of short and long-term materials cost roadmaps with corporate objectives 

Program & Stakeholder Leadership 

• Manage global portfolios of TIQ and cost programs to maximize ROI 

• Define scope, milestones, resources, and risks; drive issue resolution 

• Influence global stakeholders to align on strategy, priorities, and execution plans 

• Provide regular executive updates on progress, risks, and results 

People & Capability Development 

• Lead, mentor, and develop global engineering and program teams 

• Set clear goals, development plans, and performance expectations 

• Foster a culture of collaboration, accountability, continuous improvement, and safety 

Core Competencies 

• Strategic leadership with execution focus 

• Global stakeholder influence 

• Data-driven problem solving 

• Strong prioritization and organizational skills 

Qualifications 

• Bachelor’s Degree in Engineering (Master’s preferred) 

• Eligibility minimum E5 or M1+ 

• 5+ yrs semiconductor technical leadership or management experience in a 300mm FAB 

• Strong knowledge of TIQ, front-end manufacturing, and front-end materials cost drivers 

• Proven experience leading global, cross-functional teams and complex programs 

• Strong analytical, communication, and fact-based decision-making skills 

• Program / project management experience strongly preferred 

• Willingness to travel internationally as required 
  

  Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.

• Lead in process equipment improvements contributing to high device yield and quality, reduce cycle time and cost competitiveness

• Improve tool availability to create capacity and enable production ramp

• Develop strong relationships with Fabs, MCT, and suppliers to improve yield, quality, cost, cycle time and safety

• Communicate fab engineering status, goals, challenges and plans to the engineering team and related Micron network

• Drive positive culture for safety programs by setting the safety expectations for your team as well as ensure safety standards are met

• Lead team to do tool installs

• Propose capital of process equipment required for benchmark performance

• Identify, develop and implement organizational initiatives that drive benchmark performance

• Provide ideas and recommendations to site leadership on department initiatives

• Manage, measure and monitor projects to ensure deliverables and time frames are met

• Mentor the engineering team, identify and develop the pipeline of potential technical and managerial successors

• Develop engineering community technically and deploy team members to maximize every individual’s potential

• Deploy Big Data Technology to enable BIC performance in yield, quality, output and cost

Requirements:

• Bachelor’s Degree/Masters in Engineering or Science discipline or equivalent work experience

• Relevant Experience in Advanced Packaging/HBM related fields

• Ability to manage multiple complex projects

• Demonstrated success in a E4/M1 position

• Ability to train and develop others

• Ability to clearly communicate with content experts from Fabs within the Micron Enterprise

• Proven ability to set measure and achieve short and long range goals

• Demonstrated success in leading teams in defining and solving process problems

As a HBM Customer Systems Validation Engineer at Micron Technology, Inc., you will:

• Be responsible for system-level validation, failure analysis, characterization, and experimentation of customer systems

• Run and configure diagnostic software, design experiments, analyze and interpret data, creating custom tools (Hardware and Software), presenting data to customers both inside and outside Micron

• Provide technical customer integration support at customer locations. To accomplish these responsibilities, you will use a variety of equipment (oscilloscopes, logic analyzers, signal generators, multi-meters, etc.)

• Work with customers and memory enablers like GPU manufacturers to attain design wins and qualifications of Micron memory products in their applications

• You will work with other engineers within the HBM team, Product Engineering, FAE, Quality Assurance, and business unit teams

Debug Micron Product Customer Failures

• Provide technical support to customers and the field sales

• Utilize diagnostics to reproduce the original failure

• Identify failure mechanism

• Collaborate with Product Engineering and Return Material Authorization (RMA)

• Provide 8D or failure documentation for customer failure resolution

• Implement fixes for fails (design or process)

Design and Implement Micron System Tools

• Create test scripts for a variety of applications

• Create and modify hardware that controls test parameters (i.e. temperature or voltage)

• Support internal customer diagnostics software and hardware tools within Micron labs

• Interface with external customer to create intelligent DOE (design of experiments)

Perform System Characterization

• Use software, Internal logic analyzers, oscilloscopes, and other tools to understand system memory usage

• Develop software to interpret data

• Collaborating with Product and Application Engineering

• Communicating results with cross-functional teams and customers

Successful candidates will have, but not limited to:

• A Bachelor’s or a Master’s degree in Electrical and Computer Engineering (or an equivalent field) with 2-4 years of experience or 1-3 years of experience respectively, both requiring a balanced hardware and software skill set.

• Comfortable working and programming with Linux, Python/C/C++, version control systems (git, svn)

• Excellent problem-solving and analytical skills

• Works well in a team environment

• Good communication, data analytics and presentation skills

• Basic understanding of DRAM operations and computer networking

• Self-motivation and passion

Successful candidates suggested to have but not required:

• Experience in bios/linux driver development/debug

• Understanding of system architecture and memory subsystem

• Comfortable working with lab equipment including oscilloscopes, logic analyzer, protocol analyzers, soldering equipment, etc

• Previous experience validating products with both hardware/firmware/software components

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The role of a High Bandwidth Memory (HBM) System Engineer at Micron Technology, Inc. is pivotal in the introduction of Micron's HBM with our customers.  This role will empower customers through the utilization of High Bandwidth Memory (HBM) integrated with ground breaking 2.5D and 3D System in Package (SiP) solutions. This encompasses a comprehensive approach to system level testing, encompassing electrical, software, and system validation perspectives. The incumbent will spearhead the development of innovative test algorithms and plans, which includes the design and execution of robust system test infrastructure capabilities to ensure the highest standards of quality and performance.  Your strategic leadership will be crucial in synchronizing efforts across various teams to achieve a seamless and successful product launch with our customers.

Responsibilities:

Provide Technical Leadership and Direction

• Initiate collaborations with customers, Technology Development (TD), Testing, and Manufacturing teams in advance of silicon arrival

• Maintain responsibility for the successful customer launch of the product

• Great communication and presentation skills – ability to present to both internal leadership and customer forums

• Strong interpersonal skills with ability to convey sophisticated technical concepts to peers and customers

• Develop, diagnose, and validate HBM System testing programs and inhouse system solutions

• Assess and determine the necessary equipment and hardware for optimal system validation processes

• Lead the development of High-Performance Computing (HPC) and Artificial Intelligence (AI) software testing strategies to enhance product testing

• Strategically plan projects and manage resource allocation to adhere to established timelines and objectives

• Enhance efficiency, coverage, turnaround time of validation activities

• Provide guidance and ensure alignment with specific company-wide projects

Minimum Qualifications:

• BS or MS in Electrical or Computer Engineering or related field.

• 8+ years (BS) or 10+ years (MS) of relevant experience.

• Deep knowledge of DRAM operation, JEDEC specs, and HBM product family.

• Strong communication skills to convey complex technical concepts.

• Experience with scripting languages (Python, TCL, Perl).

• Proven innovation and problem-solving in high-performance memory development

• Good understanding of computer architecture, memory subsystems, and memory technologies

• Proven team leader – respect, integrity, positive demeanor

Preferred Qualifications:

• Understanding of system architectures and memory subsystems; Previous experience validating products with both hardware/firmware/software components

• Experience with bring-up and validation of ASIC/GPU with HBM memory subsystems

• Familiarity with industry-standard memory interfaces and protocols, such as LPDDR, DDR, HBM, GDDR, CXL, UCIe, and PCIe

• Excellent problem-solving and analytical skills

• A self-motivated, enthusiastic team player who enjoys working with others

• Good communication skills with the ability to convey complex technical concepts to other design and verification peers in verbal and written form

As a HBM Customer Systems Validation Engineer at Micron Technology, Inc., you will:

• Be responsible for system-level validation, failure analysis, characterization, and experimentation of customer systems

• Run and configure diagnostic software, design experiments, analyze and interpret data, creating custom tools (Hardware and Software), presenting data to customers both inside and outside Micron

• Provide technical customer integration support at customer locations. To accomplish these responsibilities, you will use a variety of equipment (oscilloscopes, logic analyzers, signal generators, multi-meters, etc.)

• Work with customers and memory enablers like GPU manufacturers to attain design wins and qualifications of Micron memory products in their applications

• You will work with other engineers within the HBM team, Product Engineering, FAE, Quality Assurance, and business unit teams

Debug Micron Product Customer Failures

• Provide technical support to customers and the field sales

• Utilize diagnostics to reproduce the original failure

• Identify failure mechanism

• Collaborate with Product Engineering and Return Material Authorization (RMA)

• Provide 8D or failure documentation for customer failure resolution

• Implement fixes for fails (design or process)

Design and Implement Micron System Tools

• Create test scripts for a variety of applications

• Create and modify hardware that controls test parameters (i.e. temperature or voltage)

• Support internal customer diagnostics software and hardware tools within Micron labs

• Interface with external customer to create intelligent DOE (design of experiments)

Perform System Characterization

• Use software, Internal logic analyzers, oscilloscopes, and other tools to understand system memory usage

• Develop software to interpret data

• Collaborating with Product and Application Engineering

• Communicating results with cross-functional teams and customers

Successful candidates will have, but not limited to:

• A Bachelor’s or a Master’s degree in Electrical and Computer Engineering (or an equivalent field) with 3-5 years of experience or 2-4 years of experience respectively, both requiring a balanced hardware and software skill set.

• Comfortable working and programming with Linux, Python/C/C++, version control systems (git, svn)

• Excellent problem-solving and analytical skills

• Works well in a team environment

• Good communication, data analytics and presentation skills

• Basic understanding of DRAM operations and computer networking

• Self-motivation and passion

Successful candidates suggested to have but not required:

• Experience in bios/linux driver development/debug

• Understanding of system architecture and memory subsystem

• Comfortable working with lab equipment including oscilloscopes, logic analyzer, protocol analyzers, soldering equipment, etc

• Previous experience validating products with both hardware/firmware/software components

Funeral Planning Advisor (Training Provided | High Income Potential)

Part Time/ Full Time

Looking for a meaningful career with income growth?

Join a professional team in the funeral and pre-planning industry, helping families make important life decisions with clarity and dignity.

What You’ll Get:

Performance-based income (no basic salary)

Income potential $3,000 – $10,000+

Structured training and mentorship provided

Clear career progression pathway

Supportive and experienced team environment

What You’ll Do:

Guide families in funeral and pre-planning arrangements

Provide professional advice based on individual needs

Build long-term relationships with clients

Follow up on enquiries and manage cases

Who This Is For:

Individuals looking for a career switch or income growth

Those who prefer flexibility over fixed office hours

People with business mindset or entrepreneurial thinking

Self-driven and willing to learn

Important to Note:

This is a performance-based role with flexible income structure

Ideal for individuals who are self-driven and open to building their own results

Ability to communicate with Mandarin-speaking clients is required

Apply Now:

WhatsApp ShuZhen (89458977) directly to find out more.

Only shortlisted candidates will be contacted.

Responsibilities and Tasks:

• Drive end‑to‑end front‑end process integration across multiple modules to support yield, functionality, and scalability

• Lead cross‑module root cause analysis for complex yield detractors and integration issues

• Support yield ramp, derivative matching, and node transitions through focused integration execution

• Act as a core cPIE contributor for assigned programs, partnering closely with site PI/PE/Device teams

• Develop and apply Best Known Methods (BKM) within owned integration scope

• Provide technical input to POR/TOR and ECN decisions affecting integration margin

• Apply data‑driven analysis to quantify process sensitivity, margin, and risk

• Participate in SWAT teams and technical deep dives for high‑impact issues

• Mentor junior engineers and contribute to knowledge sharing within CPIE

• Collaborate with PI, PE, Device, Yield, TD, and Quality to accelerate learning cycles

Required Qualifications:

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related discipline

• At least 3 years of strong front‑end semiconductor manufacturing experience, with demonstrated exposure to process integration across multiple modules

• Proven ability to perform complex root‑cause analysis on yield, functionality, or integration issues using data‑driven methods

• Solid understanding of device–process interactions and system‑level integration trade‑offs

• Experience collaborating across PI, PE, Device, Yield, TD, and Quality organisations

• Ability to influence technical decisions through analysis, insight, and technical credibility

• Strong written and verbal communication skills for technical reviews, deep dives, and cross‑team alignment
  

  Good to Have:

  • Direct experience supporting advanced DRAM technology nodes and/or technology ramps

  • Demonstrated ownership of integration loops, yield ramp activities, or derivative matching efforts

  • Experience contributing to or developing Best Known Methods (BKM), standard practices, or reusable integration solutions

  • Familiarity with POR/TOR definition, ECN review, and change risk assessment from an integration perspective

  • Exposure to statistical analysis, yield modelling, or advanced analytics applied to manufacturing data

  • Track record of leading or contributing to SWAT teams or high‑impact technical investigations

  • Experience mentoring junior engineers or serving as a technical reference within a team
    

    Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.

As a Global FE Central Planning Capital Engineer at Micron, you will play a critical role in driving capital planning excellence across our global Front-End Manufacturing network. You will be part of the Global FE team responsible for end-to-end capital budgeting, funding governance, and capital savings initiatives, enabling data-driven investment decisions that support Micron’s long-term manufacturing strategy.

In this role, you will partner closely with Micron Central teams, site (Fab) stakeholders, Global Procurement, Global Facilities and Finance to consolidate capital requirements, evaluate trade-offs, and ensure funding alignment. You will leverage strong analytical, communication, and presentation skills to translate complex capital data into clear, actionable insights for leadership decision-making. 

The ideal candidate brings a strong understanding of capital expenditure (CAPEX) management, demonstrates structured problem-solving capabilities, and proactively identifies opportunities for capital optimization, cost efficiency, and process improvement across the global FE footprint. This role offers broad exposure to global stakeholders and the opportunity to influence high-impact capital decisions at scale.

Roles & Responsibilities

Capital Ledger Management

• Own and maintain the Global FE Capital Ledger, ensuring accuracy, completeness, and alignment with approved budgets and funding decisions.

• Perform regular reconciliation across capital systems and financial records to support reporting, compliance, and audit readiness.

• Provide clear visibility of capital position, movements, and variances to key stakeholders.

ER / Portfolio / LRP Fanout

• Lead Executive Review (ER), Capital Portfolio, and Long‑Range Plan (LRP) fanout activities across sites and central stakeholders.

• Translate top‑down capital targets into site‑level guidance and ensure consistent understanding of assumptions, constraints, and priorities.

• Partner with Central Teams, Sites, Finance, Facilities, and Procurement to resolve gaps and alignment issues.

Quarterly BP CAPEX

• Drive Quarterly Business Plan (BP) CAPEX cycles, including data consolidation, validation, and submission.

• Ensure consistency between BP assumptions, Capital Management system references and execution outlook.

• Support leadership reviews by providing risks call out, and trade‑off options.

WFE / BOD Support

• Support Wafer Fab Equipment (WFE) and Board of Directors (BOD) related capital reviews and materials.

• Prepare and validate capital data, narratives, and insights required for executive‑level decision making.

• Ensure alignment between capital strategy, business priorities, and manufacturing roadmaps.

Micron Central Teams CAPEX Management

• Manage Central Teams' capital to balance gaps, timing differences, and scenario adjustments across portfolios.

• Work with stakeholders to drive accurate updates to the Central Teams CAPEX.

• Clearly communicate risks, and mitigation plans to leadership.

Capital System Enhancement

• Drive Capital System (CALM) and process enhancements to improve usability, data quality, automation, and reporting efficiency.

• Act as a business partner to IT and system owners by defining requirements, validating solutions, and supporting deployment.

• Continuously identify opportunities to streamline capital planning and reporting workflows.

CALM Plan CF Cleanup

• Own CALM planned cashflow (CF) cleanup activities to ensure data integrity and accuracy.

• Identify and resolve inconsistencies, timing issues, and data quality gaps in planned cashflow.

• Partner with sites and central teams to reinforce disciplined capital planning and execution practice

ESLT Preparation

• Prepare capital‑related content for Equipment Strategy Leadership Team (ESLT) reviews.

• Develop concise, data‑driven narratives that highlight key issues, risks, opportunities, and decisions required.

• Ensure leadership materials are accurate, timely, and aligned across functions.

Daily Cashflow Report Snapshot

• Produce and maintain daily cashflow report snapshots to support near‑term capital visibility and monitoring.

• Ensure timely delivery of accurate data for operational tracking, issue escalation, and leadership awareness.

• Analyze daily movements and highlight anomalies or risks proactively.

Requirements

• Bachelor’s or Master’s degree in Engineering (Industrial and Systems, or related discipline).

• Strong verbal communication and presentation skills, with the ability to clearly communicate capital plans, trade‑offs, and recommendations to technical and business stakeholders.

• Proven ability to work effectively in a cross‑functional, global team environment, partnering closely with Manufacturing, Finance, Procurement, Facilities, and Technology teams.

• Strong data validation, data integrity, and reporting skills to support accurate capital tracking, forecasting, and governance.

• Demonstrated strength in data analysis, quantitative reasoning, and structured problem-solving related to CAPEX planning and execution.

• Ability to synthesize large and complex datasets into clear insights and actionable conclusions that support capital investment and prioritization decisions.

• Strong customer and stakeholder focus, with the ability to understand business needs and translate them into data‑driven capital plans.

• Solid knowledge and practical application of statistics, data analysis techniques, and problem‑solving methodologies to support capital planning and performance assessment.

• High level of independence, ownership, and determination to deliver high‑quality results on time in a fast‑paced, deadline‑driven environment.

• Familiarity with capital tracking systems, planning tools, or financial models used for CAPEX governance and reporting.

• Ability to manage multiple priorities across competing programs while maintaining data accuracy and stakeholder alignment

Join Micron as a Staff Engineer in our Global Wafer Logistic Automation team, and be part of a highly dedicated group driving world-class innovation. This is an outstanding opportunity to lead and transform our automated packing solutions, ensuring the flawless delivery of wafer logistics!

Key Responsibilities

• Provide technical ownership and engineering support for mechanised packaging solutions, including FOSB and HWS/BHWS Auto Packer, Auto Unpacker, and Auto Packer and Unpacker for Hybox applications.

• Provide support and advance HWS (Horizontal Wafer Shipper) packing operations, covering process definition, validation, and sustained improvement.

• Promote worldwide consistency in equipment specifications, process flows, and operating procedures for semiconductor packaging and shipping.

• Partner with equipment suppliers to define requirements, review builds, support FAC/SAC, and resolve technical and operational issues.

• Assist new fab wafer logistic automation rollouts by conducting layout reviews, evaluating capacity, and coordinating deployment efforts.

• Analyse equipment and process performance data to identify improvement opportunities in efficiency, reliability, ergonomics, and safety.

• Collaborate with AMHS, warehouse operations, EHS, quality, and IT teams to ensure compliance with Micron policies and standards.

• Develop and maintain engineering documentation, specifications, and standard process guidelines.

• Provide technical mentorship and training to site engineers and operations teams.

• Support technology roadmaps and future automation initiatives related to wafer packaging and logistics.

Job Requirement

• Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Mechatronics, Automation Engineering, or a related field.

• 7+ years of engineering experience in semiconductor manufacturing, warehouse automation, or wafer logistics.

• Hands‑on experience with FOSB and HWS Auto Packer / Auto Unpacker / Hybox Auto Packer/Unpacker systems, preferably supporting FOSB, HWS, Hybox or equivalent wafer shipping containers.

• Demonstrated expertise in automated packaging systems and semiconductor logistics.

• Solid technical knowledge in equipment specification, process flow, and operating procedures.

• Working knowledge of HWS (Horizontal Wafer Shipper) packing processes.

• Outstanding analytical skills to determine and successfully implement process improvements.

• Ability to collaborate effectively across global, cross‑functional teams.

• Excellent written and verbal communication skills, with the ability to deliver clear technical guidance and mentorship.

• Experience supporting multi‑site or global deployments of automated packaging or warehouse systems is advantageous.

• Familiarity with AMHS, ASRS, or automated warehouse environments is advantageous.

• Experience working directly with equipment vendors throughout the equipment lifecycle is advantageous.

• Knowledge of semiconductor EHS, ergonomics, and cleanroom requirements is advantageous.

• Willingness to travel domestically and internationally as required.

At Micron, we strictly adhere to the highest standards of excellence while encouraging a collaborative and inclusive environment. We value diverse perspectives and are committed to your professional growth. Join us in crafting a brighter future through innovative technology!

Minimum Qualifications

• Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Mechatronics, Automation Engineering, or a related field.

• 7+ years of engineering experience in semiconductor manufacturing, warehouse automation, or wafer logistics.

• Hands‑on experience with FOSB and HWS Auto Packer / Auto Unpacker / Hybox Auto Packer/Unpacker systems, preferably supporting FOSB, HWS, Hybox or equivalent wafer shipping containers.

• Working knowledge of HWS (Horizontal Wafer Shipper) packing processes.

• Strong problem‑solving skills with a structured and data‑driven approach.

• Ability to collaborate effectively across global, cross‑functional teams.

• Strong written and verbal communication skills.

Preferred Qualifications

• Experience supporting multi‑site or global deployments of automated packaging or warehouse systems.

• Familiarity with AMHS, ASRS, or automated warehouse environments.

• Experience working directly with equipment vendors throughout the equipment lifecycle.

• Knowledge of semiconductor EHS, ergonomics, and cleanroom requirements.

• Willingness to travel domestically and internationally as required.

Job Responsibilities:

• Lead process integration (PI) structural uniformity and cross‑loop integration for critical modules (e.g., capacitance loop), owning end‑to‑end integration strategies to resolve yield, quality, and reliability gaps. Drive physics‑ and process‑based integration solutions through close collaboration with cross‑module process owners, PI subject‑matter experts, and key suppliers to optimise integration structures and achieve BIC yield and quality targets.

• Develop and apply model‑based root cause analysis frameworks (transport, reaction kinetics, pattern density, and geometry‑dependent effects) to diagnose structural non‑uniformity. Define, implement, and continuously strengthen critical inline monitoring and defence lines (CD, film loss, mass delta, defectivity, edge/periphery metrics) to ensure robust control of structural uniformity.

• Own and advance product integration programs and loop‑level domain expertise, maintaining deep technical knowledge across node transitions. Proactively drive node‑over‑node “shift‑left” integration, including early implementation of uniformity, bevel, and backside best‑known‑methods (BKMs) during development phases to accelerate whole‑wafer (centre-to-edge) yield and quality ramp.

• Drive worldwide technical alignment and execution excellence by leading global projects, standardising and leveraging network BKMs, and scaling proven solutions across sites. Identify efficiency and performance gaps, and lead business process creation, optimisation, and re‑engineering to improve benchmark performance, cycle time, and development productivity.

Job Requirements:

• Bachelor's/Master's/PhD. in EE, Materials Engineering, Materials Science, Physics and Chemical but optional if candidates have more than 10 years' experience in process related role in the semiconductor industry.

• With more than 7 years of relevant industry experience/knowledges.

• Good logical thinking and knowledge in Semiconductor Fabrication process flows, interaction of different processes and how changes affect yield, device performance and reliability. Understanding of DRAM and NAND operation and structure to decipher parametric, probe and qual data from both front-end and backend assembly processes.

• Good model-based problem solving, together with data-driven decision making, and presentation skills. Proven ability to troubleshoot and solve structure and device-related issues, and address root cause.

• Good organisational capabilities and ability to work effectively. Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities. Travel to Micron sites as necessary for face-to-face collaboration.

• Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.

• Good multi-tasking, verbal and written communication skills.

• Well Established Company
• Basic $4300 - $4800 + AWS + Variable Bonus
• Excellent Welfare and Benefits + Career progression
• Working location : Tuas (Transport Provided)
• Working days : Monday to Friday
• Working hours : 8am to 5pm

Job Responsibilities:

• Develop technical studies towards the implementation of processes in the plant, evaluating plant capacity, process conditions, and other variables which can affect the process.
• Champion a culture of Process Safety excellence at the company based on the PSM 14 elements.
• Develops the Process Engineering Package (P&ID, PFD specification of process equipment, specification of electrical process equipment, material balances, energy balances, and DCS control logics) for the plant processes.
• Reviewing Risk Assessment Screenings and Involve in Management of change procedure and be a team player.
• Involve in design safety review procedure for all processes and be a team player.
• Manage and conduct the PHA - HAZOP program, as well as track, assist and follow up with the resulting recommendations.
• Assist with data collection for Quantitative Assessment (QRA) tools.
• Organizing and delivering effective and efficient Process Safety studies (PSI, MOC, Mechanical integrity, Operating procedures & etc. for all plant processes as needed for stewardship of processes.
• Develop Pre Start-up Safety Review (PSSR) for plant processes and follow up with the design review.
• Perform risk analysis and coach others on the use of risk analysis techniques.
• Collaborate with the teams to discover and implement long-term process improvement efforts.
• Perform audit of process safety management systems and execute risk mitigation corrective actions.
• Assisting Incident Investigation teams in investigating and classifying process safety incidents, as well as providing support in the development of process tools and action plans to close identified Process Safety gaps.
• Utilizes process simulation software to test and find the most appropriate PSM strategies.
• Other ad-hoc duties as assigned

Requirements:

• Minimum of Bachelor’s degree in Chemical Engineering and/or Equivalent.
• Minimum of 2 – 5 years of engineering experience supporting Operations, Engineering and/or Projects, such as plant or process engineering, project safety design, execution, engineering and/or technical service roles.

Candidates are encouraged to apply this position via Apply Now button with the following information in the resume

• Work experiences and job responsibilities
• Current and Expected salary
• Reason for leaving
• Date of availability
• Education background

We regret that only shortlisted candidates will be contacted.

LIONG ZHAO GUAN (R22107632)

EA Recruitment Pte Ltd

EA License No: 21C0492

DRIVER

• Ensuring the smooth running of ceremonial services.
• Able to communicate effectively with Agents and Customers.
• Ensuring adequate safety precautions on site.
• Attending site meetings, if any.
• Liaising with vendors on deceased photograph printings and name tag printing on niche cover.
• Ensuring cleanliness and tidiness of site.
• Any other jobs assigned by HOD/ Supervisor from time to time.
• Implementation of calling and confirming with Agents / Customers on services booking (1 day before service date).
• Coaching and mentor team mate
• Standardize all procedures like check-in, Anling, Bone picking etc.

QUALIFICATION

• Primary / Secondary / NITEC in any discipline.
• Minimum 1 year working experience.
• Excellent interpersonal and communication skills.
• Valid Class 3 license with good driving records

EXPERIENCE / SKILL REQUIRED

• Positive Attitude.
• Willing to learn.
• Able to work independently as well as in a team
• Able to communicate effectively in bilingual.
• Able to work shift, weekends and public holidays.

• Define, implement, and maintain quality standards for our fresh food categories

• Initiate​ ​pilot​ programs​ ​for​ ​new​ ​processes,​ ​packaging​ ​solutions,​ ​or​ shelf​-life​ improvements​

• Address and resolve any quality-related complaints in collaboration with store teams​

• ​Develop and enforce SOPs for storage, handling, and display of fresh foods

• ​Work​ ​with​ ​Category​ ​Managers​ ​to​ ​ensure​ ​suppliers​ ​meet​ ​technical​ ​specifications​ ​and​ ​safety standards

• ​Drive continuous improvement initiatives for Fresh Produce

• Monitor​ ​and​ ​optimize​ ​the​ ​cold​ ​chain​ ​process​ ​from​ ​supplier​ ​to​ ​store​ ​to​ ​ensure​ ​product​ freshness

• Support store teams with technical knowledge, training, and operational improvements

• Monitor​ ​and​ ​guide​ ​fresh​ ​food​ ​merchandising,​ ​stock​ ​rotation,​ ​and​ ​waste​ ​control​ ​processes

• ​Collaborate​ ​with​ ​visual​​ merchandising ​​and​​ operations ​​teams​​ to​​ maintain ​​fresh​​ category​ presentation standards​

• Track​ ​key​ ​metrics​ ​including​ ​spoilage​ ​rates,​ ​customer​ ​complaints,​ ​audit​ ​scores,​ ​and​ ​waste percentages

• Analyze trends to identify issues and recommend corrective/preventive actions

Job Requirements

• Diploma / Bachelor in Business, Food Science Food Technology, or related field

• 3+​​ years​​ of​​ retail operations, supply chain, supplier management experience​​ in​​ a​​ fresh​​ produce (Seafood & Fish) - quality​​ or ​​food​​ safety ​​role,​​ preferably ​​in ​​a ​​retail or wholesale​​ environment​ 

• Ability to​​ train​​ and​​ influence​​ cross​-functional​ teams (Suppliers / Retail)    

• Good technical knowledge and how to handle cutting for fresh Fish & Seafood

• Strong​ analytical and problem-solving skills with data-driven mindset      

• Able to multitask and work well in a fast-paced environment

• Positive, proactive, and adaptable mindset.

• Direct and monitor all terminal activities including product transfers, loading/unloading, and related field operations.
• Plan shift resources, align daily work assignments, and maintain clear communication across teams.
• Uphold safety, quality, and statutory requirements, ensuring readiness for inspections or compliance checks.
• Coach, train, and evaluate staff to build technical competency and promote a culture of operational excellence.
• Serve as the point of contact during shift incidents, coordinating responses and ensuring swift recovery actions.

Requirements:

• Diploma in Chemical Process, Mechanical, or related Engineering discipline.
• At least 3 years of operational experience in terminals, oil & gas, or petrochemical industries.
• Strong knowledge of safety systems, permit-to-work procedures, and emergency response.
• Good communication and leadership skills with the ability to work under pressure.

If you are keen to apply for the position, kindly email your detailed resume in MS Word to hr@recruit-expert.com

Please note that only shortlisted candidates will be notified.

For more job opportunities, please visit our website at www.recruit-expert.com

EA Licence: 19C9701

Registration: R1326740

The Senior Operations Executive plays a key role in overseeing and optimizing freight forwarding operations, ensuring smooth execution across all modes of transportation. The role is responsible for delivering exceptional service, maintaining regulatory compliance, and driving efficiency to support the continued growth and success of DP World’s logistics business.

Key Accountabilities

• Responsible for freight-forwarding operations and day-to-day activities including import/export processes comprising all modes of transportation (sea, air, road, train), warehousing.
• Prepare the full set of clearance documents required for shipping, such as customs declarations.
• Monitoring of shipment status and provide “best in class” customer experience to our Cargoes Logistics customers on all product and service offerings
• Responsible for the operational results of all containers services, provide the highest level of service at the lowest cost.
• Managing vendor invoices and closing job files.
• Engagement with Regional teams for major Requests for Information (RFIs) and Requests for Quotations (RFQs).
• Manage and provide a proactive approach to addressing customer claims, complaints, and queries, to enhance customer satisfaction, build trust, and establish a positive reputation.
• Work together with the sales team for customer relationship management and new service implementation.
• Ensure compliance with local and international trade regulations.
• Optimize the effective use of freight forwarding systems (e.g. Cargoes Runner) and support technology upgrades and enhancements
• Assist in managing the Operations Team to ensure daily tasks are executed effectively and efficiently.
• Mentor, train, and guide new staff members on operational systems and day-to-day responsibilities, promoting teamwork and continuous development.

Qualifications, Skills and Experience

• Tertiary qualifications with minimum 6 years’ experience in Logistics/Freight-forwarding operations.
• Excellent service mindset with ability to connect with customers and extend an extra mile in resolving their issues /concerns.
• Well versed with shipping processes and related services in international logistics business.
• Ability to communicate with clients, carriers, other forwarders, vendors.
• Effective verbal and written communications in English and interpersonal skills.
• Ability to thrive in ambiguous and new set-up environment. Requires a combination of skills in adaptability, problem-solving, communications, and a positive attitude.
• Ability to work independently, manage priorities, be organised, methodical and deal well under pressure.
• Proficiency in using MS Office and IT applications.
• Knowledge of Cross Trade will be beneficial.

EEO Statement

DP World is committed to the principles of Equal Employment Opportunity (EEO). We strongly believe that employing a diverse workforce is central to our success and we make recruiting decisions based on your experience and skills. We welcome applications from all members of society irrespective of gender, disability, race, religion or belief. By submitting your resume and application information, you authorize DP World to transmit and store your information in the world-wide recruitment database, and to circulate that information as necessary for the purpose of evaluating your qualification for this or other job vacancies.

About DP World

DP World is reshaping the future of global trade to improve lives everywhere. Operating across six continents with a team of over 125,000 employees, we combine global infrastructure and local expertise to deliver seamless supply chain solutions.

From Ports and Terminals to Marine Services, Logistics and Technology, we leverage innovation to create better ways to trade, minimising disruptions from the factory floor to the customer’s door.

In Asia Pacific, DP World employs over 15,000people across 22 geographies. We operate 17 ports and terminals, complemented by a comprehensive suite of end-to-end supply chain solutions - to connect the region to the rest of the world.

WE MAKE TRADE FLOW

TO CHANGE WHAT'S POSSIBLE FOR EVERYONE.

*GOV* Service Delivery Manager| EUC

• Working arrangement: Hybrid working arrangements
• Working location: Central
• Salary Package: Up to $9,000 + AWS

Join our dynamic team and play a pivotal role in shaping the future of enterprise-level end-user computing services. You'll have the opportunity to lead innovative initiatives, drive standardization across desktop services, and enhance user satisfaction within a supportive and collaborative work environment.

Job Responsibilities

• Provide essential enterprise-level end-user computing services, ensuring high availability and reliability.
• Plan and execute new initiatives and enhancements that leverage innovative endpoint technologies to drive organizational efficiency and user satisfaction.
• Collaborate with team leaders and outsourced service providers to plan, manage, and deliver projects aimed at maintaining, enhancing, or developing new desktop services.
• Lead projects to standardize desktop services across the organization, reducing operational overhead and improving service delivery and user satisfaction.
• Supervise and maintain desktop services, ensuring alignment with organizational standards and service level agreements with outsourced providers.

Requirements

• Degree in Computer Science, Computer or Electronics Engineering or Information Technology or equivalent
• Minimum 5 years of relevant working experience in designing, planning, deploying and leading enterprise level ICT infrastructure for end point services
• Good technical knowledge of end point technologies as primary practice area, with knowledge in supporting technologies such as network and servers
• Proactive and dedicated individual with good leadership and multi-tasking capabilities
• Good interpersonal skills, both oral and written, with the ability to present ideas and influence stakeholders
• An adaptable and bold individual who dares to innovate and take smart risks

By submitting your resume, you consent to the collection, use, and disclosure of your personal information per ScienTec’s Privacy Policy (scientecconsulting.com/privacy-policy).

This authorizes us to:

Contact you about potential opportunities.

Delete personal data as it is not required at this application stage.

All applications will be processed with strict confidence. Only shortlisted candidates will be contacted.

Aloysius Tan Sheng Rong - R22110441
ScienTec Consulting Pte Ltd - 11C5781

About the role

Global Legal operates across multiple products, markets, and regulatory environments, and we are building the operational infrastructure that enables Legal to operate efficiently and consistently across teams. We are looking for a Legal Delivery & Transformation Lead to help shape how legal work is delivered and improved across the Global Legal function.

This role will lead the teams responsible for coordinating and delivering major legal initiatives, as well as designing and continuously improving how legal workflows operate at scale. The role sits within Legal Operations and will partner closely with Legal leadership, Legal Technology, and AI teams to ensure the Legal function operates efficiently, transparently, and effectively.

The role has opportunity to manage a team of program managers, building a capability that enables legal initiatives to be delivered effectively while continuously improving how legal work flows across the organization.

Responsibilities

• Lead the Legal Delivery & PMO capability, coordinating and delivering major initiatives across the Global Legal function, driving improvements to how legal work flows across teams
• Establish clear delivery frameworks and operating rhythms for managing cross-pillar initiatives
• Partner with Legal leadership to prioritise and deliver strategic legal programs and operational improvements
• Identify opportunities to streamline legal workflows and reduce operational friction across teams
• Design and implement scalable processes that enable the Legal function to operate effectively as the organization grows
• Partner closely with Legal Technology and AI teams to ensure process improvements are supported by appropriate systems and automation
• Lead and develop a lean team of program managers, project managers, and process/change management professionals
• Establish metrics and reporting to track delivery progress and operational efficiency across legal initiatives
• Support the Head of Legal Operations in executing the broader Legal Operations strategy

Minimum Qualifications:

• BA, BBA, LLB, LLM or MBA degree
• 10+ years of total experience, with at least 5+ years in legal operations
• 3+ years leading regional or global initiatives across multiple jurisdictions and business units
• Experience managing teams of program manager, project managers or operations professionals
• Experience working in matrixed organizations, with exposure to Legal, Compliance, Technology and Business teams
• Strong stakeholder management and communication skills, with the ability to work effectively with senior leadership
• Familiarity with legal and compliance workflow tools, project management frameworks, or operational systems

Preferred Qualifications:

• Demonstrated ability to translate strategic priorities into structured execution plans and deliverables
• Experience supporting and advising C-suite or executive-level leaders.

• Well Established Company

• Basic $4200 - $4700 + Variable Bonus

• Excellent Welfare and Benefits + Career progression

• Working location: Tuas (Company Transport Provided)

• Working Days: Monday to Friday

• Working Hours: 8am to 5pm
  

Job Responsibilities:

• Manage and supervise all production activities at the assigned yard.

• Oversee cut and bend operations and steel fabrication services to ensure quality and compliance with specifications.

• Monitor and track steel stock levels, ensuring optimal availability and accurate inventory records.

• Work closely with other managers and stakeholders to define objectives, clarify requirements and support operational alignment.

• Prepare cost estimates, assist in budget planning and monitor production expenses.

• Plan, organize and optimize workflow to meet production schedules, quality standards and project deadlines.

• Identify process improvements to enhance productivity, safety and operational efficiency.

• Ensure adherence to workplace safety regulations and organizational policies.
  

Job Requirements:

• Proven experience in production management, preferably in steel fabrication or related industries.

• Strong understanding of production processes, materials and workflow planning.

• Competency in budgeting, cost estimation and inventory management.
  

Candidates are encouraged to apply this position via Apply Now button with the following information in the resume

• Work experiences and job responsibilities

• Current and Expected salary

• Reason for leaving

• Date of availability

• Education background
  

We regret that only shortlisted candidates will be contacted.

LIONG ZHAO GUAN (R22107632)

EA Recruitment Pte Ltd

EA License No: 21C0492

Job Description

• Industry/ Organization Type: Workplace Safety/ Training & Consultancy
• Position Title: Chief Operating Officer (COO)
• Working Location: Kallang (walk distance from MRT)
• Working Hours: 5 Days, Monday – Friday (9am – 6pm)
• Salary Package: Basic Salary + Variable Bonus
• Duration: Permanent

Key Responsibilities

• Oversee and manage all operational functions across multiple departments and training divisions.
• Design, develop, and introduce new high-value training courses and advanced certification programs.
• Manage a broad portfolio of courses, including WSQ framework and SkillsFuture/SSG-funded training programs.
• Lead the recruitment, training, and performance management of trainers across various disciplines.
• Maintain current accreditations and pursue additional certifications with regulatory bodies (MOM, WSH Council, SSG, NEA, IRCA, NEBOSH, SCDF, NRC).
• Ensure full compliance with SSG audit requirements and uphold quality standards across all training delivery processes.
• Promote operational efficiency and drive continuous improvement initiatives throughout the organization.
• Manage and strengthen partnerships with SkillsFuture Singapore, regulatory authorities, and industry partners.
• Support business development initiatives and ensure high levels of client satisfaction.
• Work closely with regional teams to maximize the use of global resources and expertise.

APPLY NOW!!!

• Bachelor’s degree from a recognized university (Engineering or a related field).
• Minimum 8–10 years of experience in the education or training industry in senior operational leadership roles (COO, Director of Operations, VP Operations, etc.).
• Proven leadership experience managing operations across multiple departments and large trainer networks across diverse subject areas.
• Demonstrated success in managing large-scale operations (organizations with 50+ employees or revenue exceeding $10 million).
• Extensive operational knowledge across key areas including course development, training delivery, quality assurance, trainer management, and accreditation processes.
• Strong expertise in course development, with a proven track record in launching high-value and advanced certification programs.
• Strong understanding of accreditation requirements, regulatory compliance (e.g., SSG, MOM, and related bodies), and WSQ frameworks.
• Solid commercial awareness with a good understanding of the economics of training businesses.

Kindly apply through ANY of the following methods:

• Submit your application by clicking the APPLY button;
• Email your resume to Job@anradus.com.sg. Please indicate #83073 on the email subject.

Anradus Application Policy: We value each application and ensure every resume is reviewed. Our process is efficient, typically concluding within 3 working days. If you do not receive communication from us within this timeframe, it's likely that your application has not been shortlisted by our client. In such cases, we recommend continuing your job search to maximize your opportunities.

Anradus Pte Ltd | EA License No. 20C0161 | Angel Lim | EA Reg No.: R1769781