Total 3,174 job vacancies in Singapore

• Minimum of 18+ years of operations experience managing a team covering derivatives operations 
• Some hands-on experience covering derivatives operations gained in a futures exchange and clearing house is essential
• Hands-on experience driving project management (in operations) and systems implementation is required

Our client is a growing firm in the FI industry. This is a hands-on Head of Operations role overseeing an operations team covering derivatives exchange operations and project management functions. This role will also be part of the senior executive team.

ROLE AND RESPONSIBILITIES

• Oversee an operations team covering derivative exchange operations.
• Drive project management and initiatives. Lead the implementation of enhanced capabilities and efficiency in the operations function
• Make recommendation and presentation to senior management 
• Spearhead and implement system transformation and implementation projects.
• Work on other strategic matters directed by senior management

QUALIFICATIONS/ ACADEMIC BACKGROUND/ SKILLS

• A seasoned operations professional with min of 18+ years of operations. Some hands-on experience covering derivatives operations gained in a futures exchange and clearing house is essential
• Hands-on experience driving project management (in operations) and systems implementation is required
• Very hands-on despite being senior
• Possess strong stakeholder management skills
• Driven, agile/adaptable and flexible.
• Possess good presentation and communication skills
• Driven with good people skills and team management skills

To apply, pl send your cv in word doc to resume@cap-cg.com. Pl also include details on your current salary, expected salary and notice period in your cv.

We regret to inform that only shortlisted candidates will be notified.

Posted by:

CAP Consulting (EA license: 14C7175)

Caroline Poh (EA Registration: R1105649)

Date ad is posted - 10 April 26

We are a fast-growing logistics and transportation company in Singapore, specializing in last-mile delivery solutions. We provide efficient and reliable delivery services across the island, supporting e-commerce and business distribution needs.

Key Responsibilities:

- Plan and coordinate daily last-mile delivery operations to ensure timely and efficient distribution

- Optimize delivery routes and schedules to improve productivity and reduce costs

- Monitor delivery performance and ensure service level agreements (SLA) are met

- Liaise with drivers, warehouse team, and external vendors to ensure smooth operations

- Handle operational issues, delays, and customer escalations professionally

- Analyze operational data and recommend process improvements

- Ensure compliance with company policies and safety regulations

- Prepare reports on delivery performance and operational efficiency

Requirements:

- Bachelor’s Degree in any discipline

- Minimum 1–2 years of experience in logistics, transportation, or operations-related roles

- Strong coordination and problem-solving skills

- Good communication and interpersonal skills

- Ability to work in a fast-paced environment

- Proficiency in Microsoft Excel or logistics systems is an advantage

• Direct and monitor all terminal activities including product transfers, loading/unloading, and related field operations.
• Plan shift resources, align daily work assignments, and maintain clear communication across teams.
• Uphold safety, quality, and statutory requirements, ensuring readiness for inspections or compliance checks.
• Coach, train, and evaluate staff to build technical competency and promote a culture of operational excellence.
• Serve as the point of contact during shift incidents, coordinating responses and ensuring swift recovery actions.

Requirements:

• Diploma in Chemical Process, Mechanical, or related Engineering discipline.
• At least 3 years of operational experience in terminals, oil & gas, or petrochemical industries.
• Strong knowledge of safety systems, permit-to-work procedures, and emergency response.
• Good communication and leadership skills with the ability to work under pressure.

If you are keen to apply for the position, kindly email your detailed resume in MS Word to hr@recruit-expert.com

Please note that only shortlisted candidates will be notified.

For more job opportunities, please visit our website at www.recruit-expert.com

EA Licence: 19C9701

Registration: R1326740

As an IT Infrastructure Operations & Support Engineer, you are responsible for ensuring the reliability, security, and efficiency of our clients' IT infrastructures. Your expertise will contribute to maintaining and enhancing complex network environments, fostering secure and resilient systems essential for business operations.

Key Responsibilities

• Perform preventive and corrective maintenance on IT infrastructure, including servers, networks, operating systems (Windows and RHEL), and related platforms to ensure high availability, stability, and reliability of services.
• Execute incident resolution and problem remediation in alignment with Incident Management and Problem Management processes, acting as an escalation point for infrastructure-related incidents to ensure timely service restoration within agreed Service Level Agreements (SLAs).
• Advise customers on performance and capacity improvement recommendations; and implement optimization initiatives
• Implement and maintain security controls for customers, including patch management, vulnerability remediation, access controls, and system hardening, in compliance with customer security policies and best practices.
• Ensure the timely application of security patches and updates in accordance with established Change and Release Management processes to maintain system integrity and security posture.
• Maintain accurate and up‑to‑date IT documentation, including system configurations and architecture, Standard Operating Procedures (SOPs), maintenance and recovery procedures, and incident and problem records; produce operational and security reports, including incident post‑mortems and root‑cause analyses (RCA), for management and customers; and improve service consistency while enhancing response and resolution times in alignment with customers’ SLAs.

• Collaborate closely with customers, internal teams, and external service providers to ensure seamless IT operations; coordinate audit, incident, and change activities; and communicate technical risks, service impacts, and recommendations clearly and effectively to non‑technical customer stakeholders. Demonstrate the ability to work independently, manage priorities effectively, and take ownership of assigned tasks and initiatives.

Skills and Qualifications

• Minimum 5-7 years of experience in IT infrastructure management and/or information security within enterprise or customer‑facing environments.
• Strong understanding of IT infrastructure, including hardware, software, operating systems, networking, and security principles.
• Proven experience in IT operations management, including system administration, patch management, and system health and performance monitoring. Excellent problem‑solving, communication, and stakeholder management skills, with the ability to articulate technical concepts clearly to both technical and non‑technical audiences.
• Proficiency in Microsoft technologies, including Active Directory, Certificate Authority (PKI), Group Policy, and other related Microsoft infrastructure services.
• Willing to be on 24x7 standby
• Possess valid class 3 license is a plus point.

Work location: Jurong East

As a Special Operations Crew at Anywheel, your primary mission is to ensure that our bicycles are available where users need them most. You will focus on clearing excessive bikes from overcrowded stations and topping up bikes at high-demand or critical locations to maintain smooth service for our riders on the weekdays (Monday, Wednesday, Friday), weekends and Public Holidays.

Key Responsibilities

• Identify and clear excessive bikes from overstocked stations.
• Top up and arrange bicycles at high-demand stations to ensure user availability.
• Monitor station conditions and adjust bicycle distribution accordingly.
• Perform basic operational checks to ensure bicycles are safe and ready for use (training provided).
• Support urgent operational needs and special clearance tasks when required.
• Consolidate damaged or faulty bicycles at designated pickup points for repair collection.

No prior experience is required—comprehensive training will be provided to equip you with the necessary skills and tools. If you enjoy working outdoors and contributing to a sustainable urban mobility system, this role is for you!

Requirements

• Outgoing and friendly attitude.
• Able to ride a bicycle.
• Comfortable working in an outdoor environment.
• Physically able to move / carry a 20KG bicycle.
• Able to commit to weekdays (Monday, Wednesday, Friday) and/or weekend shifts.
• Independent and responsible to work unsupervised.
• Owns a mobile device with data plan.

Working Details

• Work Location for Weekdays (Monday, Wednesday, Friday): Central area
• Work Location for Weekends: East Coast Park / Central area
• Work Duration for Weekdays (Monday, Wednesday, Friday): 5pm - 11pm (no break)
• Work Duration for Weekends: 4.30pm - 10.30pm (no break) / 1pm - 8pm (1 hour unpaid break from 4pm - 5pm) / 3pm - 10pm (1 hour unpaid break from 4pm - 5pm)
• Work Days: Weekdays (Monday, Wednesday, Friday) and/or Weekends only
• Hourly Rate: $12/hr
• Public Holiday Rate: 1.5× hourly pay
• Minimum Commitment Period: 3 months
• Uniform: Provided (covered shoes required)

Interested in growing your career in IT operations? Join a government project where you’ll gain hands-on experience with enterprise tools, system upgrades, and end-user support.

• Location: Pasir Panjang
• Working Hour: Office Hour, Mon - Fri
• Salary: Up to $3200
• Contract Duration: 10 months (Renewable) 
• Perks: Annual leave + Medical Coverage 

Job Scope:

• Configure and maintain operating systems, software, drivers, firmware, and endpoint devices
• Perform PC imaging, patch management, and deployment
• Conduct testing and quality assurance for system updates, security patches, and software upgrades
• Evaluate and support hardware/software upgrades (tech refresh)
• Troubleshoot issues and support users across different locations when required
• Ensure smooth day-to-day IT operations and system performance

Requirements

• Singaporean only 
• Diploma in IT or related discipline, or equivalent hands-on experience

By submitting your resume, you consent to the collection, use, and disclosure of your personal information per ScienTec’s Privacy Policy (scientecconsulting.com/privacy-policy).

This authorizes us to:

• Contact you about potential opportunities.
• Delete personal data as it is not required at this application stage.
• All applications will be processed with strict confidence. Only shortlisted candidates will be contacted.

Thong Jia Qian (Joyce) - R1981781

ScienTec Consulting Pte Ltd – 11C5781

Job Description

• Understand and comply to all warehouse related safety, quality & operating processes.
• Perform 5S in warehouse.
• Perform warehousing activities including inbound, outbound and cycle count, in a timely and orderly manner.
• Conduct visual inspection and report any non-conformity / exception from shipment
• Support Supervisor to achieve all required KPI.
• Perform general warehousing duties including maintaining database integrity, stocktaking, material handling, documentation control, etc.
• Ensure all documentation are accurate and submitted timely.
• Participate in process improvement initiatives and implementation.
• Continuously striving for higher level of performance efficiency.

Requirements

• Minimum 4 years of related experience
• PC literate, preferably familiar with Warehouse Management System
• Forklift license and/or Reach Truck license is an advantage

Company Overview

Island Catering Services Pte Ltd is a group of restaurants established since 1996. They seek dedicated individuals for roles including chefs, service staff, kitchen helpers, drivers, and admin assistants. All age groups and experience levels are welcome.

Job Summary

You will assist in food preparation, serve food and beverages, maintain cleanliness, support catering event setup and clearing, and follow food safety standards to ensure smooth daily operations.

Responsibilities

• Prepare and pack food items accurately to support kitchen operations
• Serve food and beverages efficiently during daily operations and events
• Maintain cleanliness and hygiene in kitchen and work areas to meet safety standards
• Assist in setting up and clearing catering events to ensure smooth service
• Follow food safety protocols and company procedures consistently
• Support general daily operations as assigned to contribute to team effectiveness

Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement.  

Key responsibilities and duties include:  

Recipe Development and Optimization:  

• Develop and optimize metrology recipes for various semiconductor processes  

• Ensure that the recipes are accurate and efficient for production needs  

• Develop and execute strategies for process monitoring, sampling, and continuous improvement (CIP)  

Inspection and Characterization:  

• Establish inspection methodologies and best-known methods (BKM) for metrology processes  

• Perform in-line characterization and validation of metrology recipes  

Data Analysis and Reporting:  

• Utilize data analysis tools like Power BI to summarize and report on metrology recipe status and project progress  

• Continuously analyze data to identify improvement opportunities and ensure process efficiency  
   

Quality and Performance Indicators:  

• Own and manage metrology tools, ensuring they meet performance indicators and quality standards  

• Drive the defense line readiness and set up control plans, OCAP (Out of Control Action Plans), and SPC (Statistical Process Control) charts  

Collaboration and Coordination:  

• Engage in early involvement with Advanced Packaging Technology Development (APTD) to ensure seamless integration of new technologies  

• Work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

Job Requirements: 

• Bachelor’s or advanced degree in Engineering or Science is required 

• Strong analytical, logical, and critical thinking skills 

• Effective communicator, able to collaborate across all levels 

• Growth mindset with a passion for continuous learning 

• Internship or experience in the semiconductor industry is a plus 

• Demonstrated leadership and a track record of impact are highly desirable 

• Interest in and knowledge of the semiconductor industry and Micron is preferred 

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred.

• Experience with Visual Basic for automation and tool integration is preferred. 

Embody Micron’s core values: 

• People – Respect, develop, and empower others 

• Innovation – Drive continuous improvement and breakthrough thinking 

• Tenacity – Show grit and determination 

• Collaboration – Build trust and foster teamwork 

• Customer Focus – Deliver excellence and value  

What to Expect 
Micron is proud to be an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other protected factor. 

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement.  

Job Summary 

The Package Health Engineer will contribute to the development and execution of package health monitoring, simulation, and characterization activities. This role involves hands-on engineering work in DFT, data analysis, and reliability testing to ensure robust packaging solutions. 

Key Responsibilities 

• Develop and implement DFT strategies for advanced packaging. 

• Conduct simulations for mechanical, thermal, and electrical performance. 

• Perform electrical and mechanical characterization of packages. 

• Analyze test and field data to identify early indicators of package degradation. 

• Collaborate with data scientists to build predictive models for package health. 

• Support root cause analysis and corrective actions for reliability issues. 

Job Requirements: 

• Bachelor’s or advanced degree in Engineering or Science is required 

• Strong analytical, logical, and critical thinking skills 

• Effective communicator, able to collaborate across all levels 

• Growth mindset with a passion for continuous learning 

• Internship or experience in the semiconductor industry is a plus 

• Demonstrated leadership and a track record of impact are highly desirable 

• Interest in and knowledge of the semiconductor industry and Micron is preferred 

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred. 

• Experience with Visual Basic for automation and tool integration is preferred. 

Embody Micron’s core values: 

• People – Respect, develop, and empower others 

• Innovation – Drive continuous improvement and breakthrough thinking 

• Tenacity – Show grit and determination 

• Collaboration – Build trust and foster teamwork 

• Customer Focus – Deliver excellence and value  

What to Expect 
Micron is proud to be an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other protected factor.

Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.  

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.  
 

Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.  

Key responsibilities and duties include:  

Process Development:  

• Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.  

• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity  

• Establish and improve process management projects to deliver technology node requirements  

Equipment and Materials:  

• Evaluate and promote new equipment and materials to enhance process capabilities  

• Set up process parameters for a variety of semiconductor equipment  

• Evaluate, promote, and plan for new equipment and materials  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities 

Requirements 

• B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields  

• 2 or more years of semiconductor process development or equipment evaluation in semiconductor, preferably in wafer bonding, die stacking and packaging field  

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics. 

• Experience with Visual Basic for automation and tool integration. 

• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control. 

• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding. 

• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability  

• Tenacity to work effectively under timelines and limited resources  

• Consistent track record to solve problems and address root causes  

Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.  

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.  

We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team! 

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will also be required to identify, diagnose, and propose yield related breakthroughs. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.  

Key responsibilities and duties include:   

Technology Development:  

• Develop and enable advanced package technology for various post-fab wafer finish and assembly processes  

• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity  

• Integrate semiconductors while partnering with process and product engineering teams  

Yield Improvement:  

• Achieve and improve yields through silicon package integration innovation, not limited to layout/design or process margin improvements  

• Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes  

• Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the PWF Engineering, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities  

Requirements  

• B.S/M.S./Ph.D. (or equivalent education) in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material, or other related technical fields  

• 2 or more years of semiconductor process integration experience, preferably with know-how to develop and enable advanced package technology for post-fab wafer finish and assembly processes 

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics. 

• Experience with Visual Basic for automation and tool integration. 

• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control. 

• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding. 

• Strong understanding of process flows, process interactions, and ability to integrate semiconductors while partnering with process and product engineering team  

• Ability to resolve complex issues through root-cause or model-based problem solving  

• Tenacity to work effectively under timelines and limited resources  

• Consistent track record to solve problems and address root causes  

Job Summary 

The Package Health Manager/Senior Manager will lead a team of engineers focused on developing and implementing solutions for package health monitoring, simulation, and characterization. This role ensures alignment with product requirements and supports the deployment of scalable engineering and data science solutions. 

Key Responsibilities 

• Manage engineering teams responsible for package health monitoring and diagnostics. 

• Drive implementation of DFT methodologies and test coverage strategies. 

• Lead simulation studies for mechanical stress, thermal behavior, and electrical performance. 

• Coordinate development of engineering solutions for failure detection and prevention. 

• Collaborate with IT and data science teams to deploy analytics dashboards and models. 

• Support qualification and reliability testing for new packaging technologies. 

Qualifications 

• Master’s or Bachelor’s degree in Electrical Engineering, Materials Science or related field. 

• 7+ years of experience in semiconductor packaging, test, or reliability engineering (complex products preferred). 

• Experience defining test architectures, coverage, and managing test/probe yield. 

• Experience in package simulation and characterization (mechanical, thermal, electrical). 

• Strong knowledge of DRAM or ASIC product testing, test architecture, and packaging fail modes. 

• Strong knowledge of semiconductor packaging process, material interaction and properties. 

• Experience managing technical teams and cross-functional projects. 

• Knowledge of simulation tools and data analytics platforms. 

Additional/Preferred Qualifications 

• Familiarity with AI/ML applications in manufacturing or reliability. 

• Experience with package characterization techniques and standards. 

• Proven problem-solving and multitasking skills. 

• Strong communication and stakeholder management skills. 

Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement.  

Key responsibilities and duties include:  

Process Development:  

• Establish and improve Wafer level process conditions and technologies (wafer thinning, backside metal interconnect)  

• Upgrade process capabilities and reduce production costs  

• Establish and improve process management projects to deliver technology node requirements and scaling for next node.  

Equipment and Materials:  

• Evaluate and promote new equipment and materials to enhance process capabilities  

• Set up process parameters for a variety of semiconductor equipment  

• Evaluate, promote, and plan for new equipment and materials  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities  

Job Requirements: 

• Bachelor’s or advanced degree in Engineering or Science is required 

• Strong analytical, logical, and critical thinking skills 

• Effective communicator, able to collaborate across all levels 

• Growth mindset with a passion for continuous learning 

• Internship or experience in the semiconductor industry is a plus 

• Demonstrated leadership and a track record of impact are highly desirable 

• Interest in and knowledge of the semiconductor industry and Micron is preferred 

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred. 

• Experience with Visual Basic for automation and tool integration is preferred. 

Embody Micron’s core values: 

• People – Respect, develop, and empower others 

• Innovation – Drive continuous improvement and breakthrough thinking 

• Tenacity – Show grit and determination 

• Collaboration – Build trust and foster teamwork 

• Customer Focus – Deliver excellence and value  

What to Expect 
Micron is proud to be an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other protected factor. 

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement.  

Key responsibilities and duties include:  

Process Development:  

• Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.  

• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity  

• Establish and improve process management projects to deliver technology node requirements 
   

Equipment and Materials:  

• Evaluate and promote new equipment and materials to enhance process capabilities  

• Set up process parameters for a variety of semiconductor equipment  

• Evaluate, promote, and plan for new equipment and materials  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities  

Job Requirements: 

• Bachelor’s or advanced degree in Engineering or Science is required 

• Strong analytical, logical, and critical thinking skills 

• Effective communicator, able to collaborate across all levels 

• Growth mindset with a passion for continuous learning 

• Internship or experience in the semiconductor industry is a plus 

• Demonstrated leadership and a track record of impact are highly desirable 

• Interest in and knowledge of the semiconductor industry and Micron is preferred 

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred.

• Experience with Visual Basic for automation and tool integration is preferred. 

Embody Micron’s core values: 

• People – Respect, develop, and empower others 

• Innovation – Drive continuous improvement and breakthrough thinking 

• Tenacity – Show grit and determination 

• Collaboration – Build trust and foster teamwork 

• Customer Focus – Deliver excellence and value  

What to Expect 
Micron is proud to be an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other protected factor. 

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement.  

Key responsibilities and duties include:   

Technology Development:  

• Develop and enable advanced package technology for various post-fab wafer finish and assembly processes  

• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity  

• Integrate semiconductors while partnering with process and product engineering teams  

Yield Improvement:  

• Achieve and improve yields through silicon package integration innovation, not limited to layout/design or process margin improvements  

• Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes  

• Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the PWF Engineering, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities  

Job Requirements: 

• Bachelor’s or advanced degree in Engineering or Science is required 

• Strong analytical, logical, and critical thinking skills 

• Effective communicator, able to collaborate across all levels 

• Growth mindset with a passion for continuous learning 

• Internship or experience in the semiconductor industry is a plus 

• Demonstrated leadership and a track record of impact are highly desirable 

• Interest in and knowledge of the semiconductor industry and Micron is preferred 

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred.

• Experience with Visual Basic for automation and tool integration is preferred.

Embody Micron’s core values: 

• People – Respect, develop, and empower others 

• Innovation – Drive continuous improvement and breakthrough thinking 

• Tenacity – Show grit and determination 

• Collaboration – Build trust and foster teamwork 

• Customer Focus – Deliver excellence and value  

What to Expect 
Micron is proud to be an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other protected factor. 

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement.  

Key responsibilities and duties include:  

Equipment Development:  

• Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking  

• Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity  

• Establish and improve equipment management projects to deliver technode requirements  

Equipment Strategy:  

• Evaluate and promote new equipment and materials to enhance process capabilities  

• Establish hardware strategic roadmaps for 5+ years in post probe wafer and die processing  

• Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron’s products. cost, availability, and improve hardware and process capability  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

Job Requirements: 

• Bachelor’s or advanced degree in Engineering or Science is required 

• Strong analytical, logical, and critical thinking skills 

• Effective communicator, able to collaborate across all levels 

• Growth mindset with a passion for continuous learning 

• Internship or experience in the semiconductor industry is a plus 

• Demonstrated leadership and a track record of impact are highly desirable 

• Interest in and knowledge of the semiconductor industry and Micron is preferred 

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred.  

• Experience with Visual Basic for automation and tool integration is preferred. 

Embody Micron’s core values: 

• People – Respect, develop, and empower others 

• Innovation – Drive continuous improvement and breakthrough thinking 

• Tenacity – Show grit and determination 

• Collaboration – Build trust and foster teamwork 

• Customer Focus – Deliver excellence and value  

What to Expect 
Micron is proud to be an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other protected factor. 

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.  

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.  

We are looking for an Advanced Packaging Metrology-RDA Engineer to join our Advanced Packaging Technology Development (APTD) team! 

Your responsibilities include but are not limited to developing and enabling innovative inspection and metrology techniques to enable advanced packaging technologies. You will also be required to identify, diagnose, and propose yield related breakthroughs. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new metrology and RDA technologies for solutions that drive the future. Additional responsibilities include establishing equipment evaluation and long-range strategy to enable advanced packaging technology roadmap.  

Key responsibilities and duties include:  

Recipe Development and Optimization:  

• Develop and optimize metrology recipes for various semiconductor processes  

• Ensure that the recipes are accurate and efficient for production needs  

• Develop and execute strategies for process monitoring, sampling, and continuous improvement (CIP)  

Inspection and Characterization:  

• Establish inspection methodologies and best-known methods (BKM) for metrology processes  

• Perform in-line characterization and validation of metrology recipes  

Data Analysis and Reporting:  

• Utilize data analysis tools like Power BI to summarize and report on metrology recipe status and project progress  

• Continuously analyze data to identify improvement opportunities and ensure process efficiency  

Quality and Performance Indicators:  

• Own and manage metrology tools, ensuring they meet performance indicators and quality standards  

• Drive the defense line readiness and set up control plans, OCAP (Out of Control Action Plans), and SPC (Statistical Process Control) charts  

Collaboration and Coordination:  

• Engage in early involvement with Advanced Packaging Technology Development (APTD) to ensure seamless integration of new technologies  

• Work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

Requirements 

• B.S/M.S./Ph.D. (or equivalent education) in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, or other related technical fields  

• 2 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field  

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics. 

• Experience with Visual Basic for automation and tool integration. 

• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control. 

• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding. 

• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability  

• Hands on experience with wafer/assembly tools or metrology/RDA systems  

• Tenacity to work effectively under timelines and limited resources  

• Consistent track record to solve problems and address root causes 

Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.  

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.  

Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post-fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.  

Key responsibilities and duties include:  

Process Development:  

• Establish and improve Wafer level process conditions and technologies (wafer thinning, backside metal interconnect)  

• Upgrade process capabilities and reduce production costs  

• Establish and improve process management projects to deliver technology node requirements and scaling for next node.  

Equipment and Materials:  

• Evaluate and promote new equipment and materials to enhance process capabilities  

• Set up process parameters for a variety of semiconductor equipment  

• Evaluate, promote, and plan for new equipment and materials  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities  

Requirements: 

• B.S/M.S./Ph.D. (or equivalent education) in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields  

• 2 or more years of semiconductor process development, preferably in wafer bonding, plating, warpage control and packaging field  

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics. 

• Experience with Visual Basic for automation and tool integration. 

• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control. 

• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding. 

• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability  

• Tenacity to work effectively under timelines and limited resources  

• Consistent track record to solve problems and address root causes 

As an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development (APTD), your responsibilities include but are not limited to providing package development characterization and failure analysis support for development test vehicles, qualifications, customer returns, new product introduction, and general test failures. You are the domain expert on advanced packaging characterization methodology and is responsible for establishing relevant analysis methods needed to support technology development. You will also have a thorough understanding of the product package assembly and process flow, to work with Process Integration, Process Development, and Product Engineering groups ensuring failures are classified and root cause fixes implemented.

Responsibilities and Tasks

Conduct Electrical Characterization

• Understand PFA techniques available for de-processing failures

• Understand assembly and test process

• Perform electrical verification to confirm failures

• Establish best known method for de-processing package

Provide Data Analysis

• Understand backend test flows, qualification methodologies and be able to pull relevant information

Communicate with Internal/External Groups

• Document failure analysis techniques used to isolate failure for other groups

• Quick, responsive analysis and feedback of PFA results to Product, Process Integration, Reliability, Assembly, RMA, and QRA

• Ensure the PFA lab understands best method to obtain results and ensure lab is ready for analysis of new designs

Provide Technical Expertise

• Conduct TMO training and FA certification

• Serve as technical SME and mentor, contributing to the growth of technical capabilities within the team and fostering a culture of continuous learning.

• Participate actively in technical events such as conferences, workshops and forums to share knowledge and BKM across the network.

• Engage industry experts and vendors on cutting-edge FA tools and techniques required for Advanced Packaging development roadmap.

Maintain Equipment

• Coordinate calibrations (external to Micron)

• Procure parts as needed

• Coordinate host vendors to support equipment repair

Manage Laboratory

• Consistently upholds and promotes Micron’s safety standards, ensuring all activities are conducted in a safe and compliant manner.

• Manage laboratory to comply with TS, ISO14001 and OHSAS requirements.

• To manage the exhaust and scrubber systems of the FA Lab.

• To maintain records and procedures as per Micron GOPs

Education and Experience

• PhD, Master’s, or Bachelor’s degree in Materials Science, Chemical Engineering, Electrical/Electronics Engineering or related discipline. 

• 4+ years of experience in the semiconductor process, preferably in R&D or technology development or failure analysis field, with strong expertise in failure analysis methodologies and techniques.

• Hands-on proficiency with key analytical tools and methods, including: SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, Ion Milling, delayering, and decapsulation techniques.

• Strong communication skills with the ability to collaborate effectively across internal teams and external partners.

• A mindset that emphasizes customer focus, continuous improvement, and striving for excellence.

  Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

About the Company

Global professional services firm specializing in strategic business consulting.

About the Job

• Perform comprehensive quality assurance assessments on high-priority financial crime projects.

• Act as a critical checkpoint for KYC and remediation workflows to ensure operational excellence.

• Collaborate directly with remediation teams to identify process gaps and drive technical accuracy.

• Monitor business risk controls to safeguard the firm’s compliance integrity.

• Provide real-time feedback and guidance on complex regulatory documentation and case files.

Skills and Requirements

• Extensive professional background within a consultancy or professional services environment.

• Deep subject matter expertise in regulatory compliance and financial crime frameworks.

• Proven experience in Quality Assurance (QA) or risk monitoring functions.
  

To apply online please use the 'apply' function.(EA: 94C3609/ R24124496)

The FinOps Analytics Architect is a senior technical leader responsible for driving cloud cost optimization, building cost‑observability platforms, and enabling proactive cloud financial governance. In addition to core FinOps responsibilities, this role now incorporates Agentic AI architecture, governance, and cost‑control capabilities as organizations shift from traditional dashboards to autonomous optimization systems.
Agentic AI introduces autonomous AI agents capable of analyzing data, making decisions, and executing actions at scale—requiring new guardrails, real‑time cost management, and AI-centric FinOps frameworks.

Key Responsibilities

1. Cloud Architecture Optimization & Technical Advisory

• Conduct deep architectural reviews of high‑spend cloud services to identify inefficiencies.

• Recommend code‑level and infrastructure changes—including serverless patterns, right‑sizing, and storage tiering—to reduce spend.

• Ensure engineering teams adopt cost‑efficient design standards to prevent cloud and on-prem “tech debt.”

2. FinOps Data, Analytics & Cost Transparency

• Build cloud cost observability and on-prem analytics frameworks that provide real‑time usage and spend insights.

• Develop forecasting models, dashboards, anomaly‑detection systems, and financial models to support cloud budgeting.

• Integrate data from cloud providers, usage logs, telemetry, and AI agent activity streams.

3. Governance, Policy Automation & Cloud Financial Controls

• Develop automated governance scripts and IaC controls (Python, Bash, elasticsearch, etc) for proactive enforcement.

• Implement tagging standards, cost attribution, chargeback/showback frameworks, and compliance policies.

• Manage FinOps governance foundations promoting visibility, accountability, and cross‑team alignment.

4. Agentic AI Responsibilities

Agentic AI introduces autonomous, reasoning‑capable AI agents that perform tasks, invoke APIs, spin up compute, and make resource decisions independently—requiring a new layer of FinOps oversight.

Design & Integrate Agentic AI Workflows into FinOps

• Architect and integrate Agentic AI systems that autonomously analyze cloud usage, detect inefficiencies, and propose or execute optimizations.

• Incorporate multi‑agent systems capable of proactive anomaly detection, predictive optimization, and autonomous corrective actions within the cloud and on-prem ecosystem.

Real‑Time AI Agent Cost Visibility & Ownership

• Establish per‑agent cost attribution, including owner tags, budget identifiers, and full traceability of every model invocation or API call.

• Build telemetry pipelines (e.g., OpenTelemetry with cost metadata) capturing cost_per_call, decision logs, and tool usage for all agents.

Budgeting, Guardrails & Autonomous Spending Control

• Design dynamic and iterative budgeting models, replacing static annual budgets with daily/weekly limit enforcement for agentic workflows.

• Implement policy-driven controls (e.g., budget throttles, automated revocation, execution guardrails) to manage microtransaction-level spend driven by autonomous agents.

• Govern agent estates using enterprise-grade tooling (e.g., Microsoft’s Foundry Control Plane) to enforce identity, security, and auditability for AI agent actions.

AI Optimization Agents & Execution Automation

• Leverage or build Citi AI optimization agents (e.g., Azure Copilot Optimization Agent) that automatically analyze performance, compare SKU alternatives, and generate execution-ready automation scripts.

• Oversee the safe implementation of agent-suggested optimizations by validating performance impact and compliance before execution.

FinOps for LLM, Multi-Agent & RAG Architectures

• Manage the cost implications of LLM inference, multi-agent collaboration, and retrieval-augmented generation (RAG) workflows, where token usage and replication can multiply costs significantly.

• Optimize model selection, context length, inference endpoints, and caching strategies to reduce unnecessary LLM consumption.

5. Cross-Functional Collaboration & Stakeholder Leadership

• Partner with FinOps Champions, engineering teams, and business stakeholders to translate cloud and AI cost goals into actionable backlogs.

• Promote organizational alignment via shared ownership of cloud and and on-prem AI spending across finance, engineering, and operations.

• Communicate complex On-prem, cloud, and AI cost insights clearly to executives and product teams.

6. Continuous Cloud & AI Optimization Strategy

• Drive ongoing cloud and agent-driven optimization initiatives to reduce waste, prevent cost overruns, and maximize ROI.

• Develop long-term cloud, AI, and automation strategy including SKU optimization, licensing, GPU provisioning, and model lifecycle cost management.

Required Qualifications

• Expertise in cloud architecture (AWS, Azure, GCP) with hands‑on cost optimization experience.

• Strong mastery of FinOps principles, cost models, and cloud financial governance.

• Experience with Python, SQL, Terraform/IaC, cloud billing datasets, and telemetry instrumentation.

• Understanding of LLMs, multi-agent architectures, RAG workflows, and AI operational cost models.

• Ability to design secure, monitored, and budget‑controlled environments for autonomous agents.

• Location: Yishun Outlet (with weekly visits to Hougang/Midtown & Khatib)
• Working days: 5 day work week, including 1 weekend (Tues - Sun or Mon - Sat)
• Weekday Hours: 12:30 PM – 9:30PM (to cover afternoon/evening classes)
• Weekend Hours: 8:30 AM – 6:30 PM (1 weekend day required)
• Salary: $2000 - $2500

Job summary:

Be the first point of contact for parents and students at our Yishun outlet, manage enrolment and scheduling across all three outlets, coordinate monthly billing processes, and ensure each outlet is operationally ready through regular visits.

Job Responsible:

1. Outlet Operations — Yishun (Daily)

• Open and close the outlet; ensure the centre is clean, ready, and well-stocked daily
• Greet and attend to walk-in parents and students, handling enquiries with warmth and professionalism
• Manage student attendance records and update class registers
• Handle trial class bookings, follow-up calls, and enrolment onboarding
• Liaise with teachers on scheduling, class materials, and classroom needs
• Manage the centre's shared WhatsApp number — responding to parent queries from all three outlets in a timely manner

2. Multi-Outlet Coordination (Weekly Visits)

• Visit Hougang/Midtown and Khatib outlets once or twice weekly to conduct operational checks
• Ensure each outlet is operationally ready — supplies, schedules, signage, cleanliness
• Coordinate with part-time staff and teachers at each branch on any operational matters
• Flag and escalate any issues to the founders promptly

3. Enrolment & Scheduling

• Manage student enrolment, withdrawals, and level/class changes across all outlets
• Coordinate makeup class scheduling — matching student requests with available slots and informing all parties
• Maintain accurate and up-to-date student records in the management system

4. Billing & Finance Administration

• Prepare the monthly billing spreadsheet accurately (student fees, adjustments, makeup credits)
• Reconcile incoming payments against invoices in Xero using bank feeds
• Follow up with parents on outstanding payments via WhatsApp in a professional and courteous manner
• Flag overdue accounts to the founders; liaise with our outsourced accountant when required

5. Parent Communication & Relations

• Serve as the primary point of contact for parent enquiries across all channels (walk-in, phone, WhatsApp)
• Communicate class updates, schedule changes, and centre announcements to parents promptly
• Handle feedback and complaints with empathy; escalate where needed
• Solicit and encourage Google reviews from satisfied parents

Requirement:

• Minimum GCE O-Level / Diploma; any discipline
• At least 2 years of experience in admin, operations, customer service, or a related role

The Supreme HR Advisory Pte. Ltd || 14C7279

Chua Jie Ying (Cai Jie Ying), Evelynn || EA Personnel License R24120580

About audax 

audax means courage. To have the courage to change the banking scene, eliminating constraints caused by existing legacy infrastructure. Our mission is to empower banks and financial institutions to scale and modernise at speed, reaching new customers without breaking the bank. 

We began our journey supplying services to and powering Standard Chartered’s white-label plug and play Banking-as-a-Service (BaaS) solution, Standard Chartered nexus, through our technology capabilities. At audax, we seek go-getters who are hungry for growth and can bring fresh perspectives. 

Website - https://www.audax.io  

What You’ll Do:

1.     Firewall, Network Proxy, and EDR Management: 

• Firewall Management: Oversee the configuration, maintenance, and monitoring of firewall systems to enforce security policies and control network traffic effectively. 

• Network Proxy Management: Manage proxy servers to secure internet traffic, optimize performance, and troubleshoot issues as needed. 

• Endpoint Detection and Response (EDR) Management: Manage EDR tools across endpoints, configure policies for threat detection and response, and analyze endpoint data for security anomalies. 

2.     Threat Detection and Content Creation: 

• Write and refine rules, signatures, and queries to detect security threats effectively. 

• Develop and update security detection content for SIEM (Security Information and Event Management) systems. 

3.     Vulnerability and Threat Management: 

• Manage vulnerability assessment and remediation programs, prioritizing and mitigating security vulnerabilities. 

• Coordinate with technology operations teams to apply patches and updates to systems and applications. 

• Monitor and respond to emerging threats, implementing proactive measures to protect systems and data. 

4.     Incident Response: 

• Perform security monitoring and triaging for potential threats and SIEM alerts. 
• Develop and maintain incident response plans and procedures, coordinating responses during security incidents or breaches. 
• Lead incident response teams, ensuring timely resolution and post-incident analysis to prevent future occurrences. 

5.     Access Review and Security Exceptions: 

• Establish and maintain access review processes to ensure appropriate access rights and permissions. 
• Manage and review user requests for security exceptions, balancing business needs with security requirements. 
• Implement controls and monitor activities to detect unauthorized access attempts and policy violations. 

6.     Collaboration with Engineering Teams: 

• Work closely with engineering teams to integrate security best practices into the development lifecycle. 
• Conduct security reviews of infrastructure, applications, and new technologies, providing recommendations for security enhancements. 
• Collaborate on the design and implementation of secure architecture and solutions. 

7.     Service Management: 

• Provide oversight of security service delivery, ensuring SLAs (Service Level Agreements) are met. 
• Manage relationships with security service providers and vendors, evaluating services and negotiating contracts. 

8.     Compliance and Reporting: 

• Ensure compliance with relevant security standards, regulations, and best practices. 
• Generate regular reports on security metrics, incidents, vulnerabilities, and operational status. 
• Participate in audits and assessments related to security operations. 

9.     Audit Management: 

• Manage and coordinate security audits conducted internally or by external auditors. 
• Prepare audit responses and action plans, implementing corrective measures and tracking progress. 

Who You Are:

• Bachelor’s degree in Computer Science, Information Technology, or related field; advanced degree or certifications (e.g., CISSP, CISM) preferred. 
• Proven experience in a security operations role with hands-on experience in firewall management, network proxy, EDR, incident response, and threat detection. 
• Strong understanding of security principles, protocols, and technologies. 
• Experience with access control, vulnerability management, audit management, and compliance frameworks (e.g., PCI-DSS, GDPR). 
• Excellent communication skills and ability to collaborate effectively across teams and stakeholders. 
• Fresh graduates with the right skillet and aptitude may also be considered. 

Why Join Us? 

• Be Part of a Bold Vision – At audax, we’re not just building software – we’re transforming how financial institutions and businesses manage risk, compliance, and growth. Join a team that’s fearless in challenging the status quo.
• Flexible, People-First Workplace – We value the importance of Family, Team, Self. In that order.
• Competitive Rewards and Startup Perks – We offer competitive salaries and meaningful benefits that look after your well-being. 

Privacy Notice:
Please note: by submitting your application, you acknowledge that you have read and understood audax’s Privacy Policy for Employees, Freelancers, Contractors and Job Applicants (the “Policy”), and consent to the collection, use and disclosure of your personal data by audax for the purposes set out in the Policy. You may withdraw consent for such collection, use and disclosure, and make an access or correction request in respect of your personal data, in accordance with the Policy by emailing dpo@audax.io.

Note: This role is not open to recruitment agencies. Thank you.

Job Description

• To design, develop and implement software solutions for BMS system including chiller systems, HVAC, security, fire alarm and etc.
• To design P&ID diagram
• To collaborate with engineering team to gather requirements and specification of BMS
• To write, debug and test the code to control and integrate with the existing BMS system 
• To monitor, troubleshoot and resolve the BMS related issues
• To develop and maintenance manuals of the developed BMS system including codes, logic diagrams and system configurations

Job Requirements

• Bachelor's degree in Mechanical, Electrical, or Energy related Engineering
• Minimum 5 years experience in the development of BMS for Chiller plants
• Proven track record of the successful delivery of projects
• Strong technical skills and knowledge of industry best practices, standards, and regulations related to Chiller plants
• Excellent communication skills, both written and verbal, with the ability to present technical information to non-technical stakeholders
• Possess the ability to use data insights to drive system performance improvements
• Possession of Niagara N4 certification is an added advantage, and having experience in BMS programming with Niagara framework and PLC control