Total 379 Senior Executive job vacancies

Responsibilities

• Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part type

• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement Prioritize within Singapore based manufacturing Wet Etch team on the key technology issues that need TD breakthroughs.

• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement Participate with Boise TD peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements

• Identify disruptive processes early on and work with manufacturing and Boise TD to identify viable path forward

• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.

• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions

• Identify process simplification opportunities and drive cross functional teams in implementation Incorporate best known manufacturing methods into early development phase of upcoming nodes.

• Design and implement advanced process monitoring and control methodologies.

• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.

• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings

• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.

• This position requires communications and collaboration with partners both locally and globally. 

• Strict adherence to Micron Intellectual Property protection policy is a must.

• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.

Requirements

• Bachelors/Masters/PhD graduates in Materials Science, Chemical/Microelectronic Engineering or Chemistry and related

• A deep understanding of chemistry, chemical kinetics, thermodynamics and  mass transport

• Opportunity to travel overseas for an extended period of time for collaborative R&D work assignment.

• 2-3 years of experience in Semiconductor Equipment/Process development is preferable

• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular.

• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data

• Working knowledge of Design of Experiments (DoE)

• Proven ability to collaborate with local and overseas teams on projects

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.

• Ability to be a self-motivated individual and be adaptable

• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously

• Display Micron Value of People. Innovation, Tenacity, Collaboration and Customer Focus

This position will have responsibility for providing process support and installation of new plasma etch / clean / deposition systems at customer sites. This includes design, evaluation and documentation of process window for new installations or Lam recommended field hardware modifications / upgrades.

1. Work closely with Account team and customers to understand customer technology roadmaps, process flow, inflection points, requirements and business issues / challenges. Identify areas where Lam is able to value-add.
2. Work with Account team and customers to execute to penetration and defense strategy, including coordinating with Global Product Group on product demonstration
3. Perform startup of “capacity add” Lam systems i.e. match results to existing systems and applications
4. Design and complete simple DOE evaluations to characterize process window for new installations or Lam recommended field hardware modifications / upgrades
5. Conduct experiments and tests, collect and analyze data and generate reports for both internal and external distribution
6. Develop new processes to new and/or existing customer applications
7. Professionally represent the company to the customer. Utilize knowledge of company’s product lines and service to keep existing / potential customers informed when new/additional needs are identified
8. Develop good customer relations during start-up and trouble-shooting
9. Maintain company’s assigned equipment (computer, tool kit, diagnostic test equipment, spare parts etc) in good working condition, secure and accounted for
10. Ensure safe working condition at work site
11. Any other duties as assigned by the Immediate Supervisor

Job Requirements:

1. Engineering degree or Bachelor of Science (in Chemistry / Physics) or equivalent
2. Systematic and has an analytical mind
3. Good communication and interpersonal relations skill
4. Able to actively engage customers on technical solutions
5. Able to work in Fab environment and perform standby duties

Job Description:

• Analyse SPC chart. Know all the PR rules and their significance. Do proper annotation to maintain quality troubleshooting rate for SPC OOC. Understand Cp and Cpk indices.
• Monitor critical SPC charts daily. Perform process window study and provide improvement plan to reduce OOC and improve CPK
• Analyse split lot, DOE data, ET, sort yield using JMP, Klarity ACE.
• Create SPC charts, DCOP and modify SLDB using PROMIS (Si-View).
• Upload recipe, check recipe and ensure recipe content compliance using RMS.
• Follow up on SPSR, MRB, 8D, TECN, or spec update with ECN.
• Setup and troubleshoot in recipes/ job files in all metrology tools within the Module.
• Follow up on pass down to troubleshoot process issues. Establish CAS / procedures to be followed and work with other departments for resolution if required.
• Startup and qualify new process and new equipment within scheduled timeline. Work closely with the Equipment Engineer on new equipment acceptance. Know the concept of repeatability and reproducibility (R&R) run.
• Work on reducing process constraint so that Manufacturing can have more flexibility.
• Perform process matching between equipment to reduce variation and analysis / DOE to find factors for better tool matching.
• Participate in CIP programs to optimize process window, cost, yield, and productivity.
• Work as a team with both Equipment and Manufacturing Engineers to meet Module objectives. Work to meet the key indices of Uptime and OEE goals.
• Represent own Module to attend cross-functional task team to address yield improvement/ excursion issues. Follow up with cross-fab benchmarking activities to engage the best-in-campus practices across fabs.
• Self-audit and update specifications/ documentation to meet TS16949 Quality Standard requirements.
• Follow good housekeeping and safety rules in office and FAB.
• Provide feedback/ training to AEs or Techs on their troubleshooting skills, understanding of processes, decision making, risk assessment.

Requirements:

• Degree in Electrical / Electronics /Microelectronics / Chemical Process Engineering / Chemistry / Physics related major
• Min 2 years working experience in Diffusion (implant, Furnace and WET/Clean Tech) Process.
• Good interpersonal skills and is an excellent team player
• Logical thinking capability and good analytical skill
• Highly level of integrity with good ownership and accountability
• Passion for the semiconductor / manufacturing industry

Roles and Responsibilities:

•  Ensure timely submission of process deliverables, including PFDs, P&IDs, hydraulic profiles, equipment sizing, HAZOP study reports, etc

•  Lead in the P&ID (Piping and Instrumentation Diagrams) drawings submissions utilizing Bentley OPPID, PFD (Process Flow Diagrams), and mass balance calculations

•  Lead in RO Membrane design selection and process.

·   Participate and coordinate in HAZOP (Hazard and Operability) studies for the overall plant and its systems/sub-systems.

•  Integrate equipment and material capabilities to meet process module and technology specifications.

•  Taking the lead in discussion with clients on planning and execution of the testing and commissioning for successful project completion.

•   Analyze and review current processes to streamline them for improvement, productivity enhancement, sequence optimization, unit improvement, and troubleshooting of the plant during testing and commissioning.

•   Attend technical meetings with clients, vendors, sub-contractors, and internal project teams.

•  Collaborate with various disciplines engineers to ensure all interfacing issues are aligned and resolved to mitigate engineering rework.

·   Any other ad-hoc engineering duties to support the Project Manager for successful execution of the project.

We are seeking a highly skilled Senior Process Integration Engineer to lead the development and optimization of Indium Phosphide (InP) based Edge Emitting Lasers (EELs). In this role, you will be the bridge between design and manufacturing, ensuring that our high-performance optoelectronic devices transition from concept to high-volume production with world-class reliability and yield.

You’ll be working at the frontier of photonics, handling complex material systems and sophisticated fabrication sequences to power the next generation of optical communications and sensing technologies.

Core Responsibilities

• Process Flow Ownership: Design, implement, and manage the full end-to-end fabrication flow for InP-based EELs (e.g., Fabry-Pérot, DFB, and DBR lasers).
• Yield & Performance Optimization: Identify and resolve integration bottlenecks. Use Statistical Process Control (SPC) and Design of Experiments (DOE) to improve device electro-optical performance (threshold current, wall-plug efficiency, and slope efficiency).
• Cross-Functional Collaboration: Partner with Epitaxy (MOCVD) teams to optimize regrowth interfaces and with the Design team to ensure Layout-to-Mask integrity.
• Advanced Fabrication Management: Oversee critical steps including dry/wet etching (ICP/RIE), dielectric deposition (PECVD/ALD), metallization etc.
• Failure Analysis: Coordinate Root Cause Analysis (RCA) on fabrication failures using SEM, TEM, and FIB diagnostics to drive continuous improvement.

Key Technical Requirements

• Materials Expertise: Deep understanding of III-V compound semiconductors, specifically the GaAs/InP/InGaAsP/material systems.
• Device Physics: Strong grasp of semiconductor laser physics
• Fabrication Proficiency: Hands-on experience or good understanding on photolithography, etching, thin film
• Characterization:  Understanding laser characterization data and correlating results back to specific process modules.

Qualifications

• Education: PhD or Master’s degree in Electrical Engineering, Physics, Materials Science, or a related field.
• Experience: 5+ years of direct experience in III-V semiconductor processing
• Software: Proficiency in JMP, or Python for data analysis;
• Mindset: A methodical troubleshooter who thrives in a cleanroom environment and enjoys the "detective work" of process integration.

About STMicroelectronics

At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products,solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027.

Further information can be found at www.st.com

YOUR ROLE 

1. Set-up process recipe of newly setup process equipment.
2. Perform qualification for new process equipment and new process recipe.
3. Evaluate the new processes and make a series of process characterization.
4. Perform inline troubleshooting and qualification in daily operation.
5. Follow Gemba activity to identify opportunity of improvement in operation and quality aspects.

YOUR SKILLS & EXPERIENCES

• Degree in engineering of materials, chemistry
• Knowledge of excel, office suite.
• English language proficiency
• at least 5 years experience in wafer fab process engineering, and having at least 3 years experience in DCVD process; preferred experienced in DCVD process tool type in Applied materials Centura and Producer.
• Strong CVD process technical knowledge background, with experience to develop and optimize new process recipe
• Master SPC, FMEA and 8D problem solving methodology.

As a Senior/Staff LithographyProcess Engineer, you will lead the development and optimization of lithographyprocesses for both Fan-In and Fan-Out eWLB (Embedded Wafer Level Ball GridArray) packaging technologies. You will be responsible for driving keyengineering projects such as yield improvement, cost reduction, and processtransfers across global manufacturing sites.

Key Responsibilities:

• Own and optimize lithography processes for PI, PR, and other patterning layers in both FO and FI eWLB.
• Manage photolithography tools (GHI/i-line stepper, coat/develop tracks, etc.), including recipe setup and troubleshooting.
• Lead cross-functional projects focused on cost reduction, process robustness, and NPI transfer.
• Lead process improvements to enhance yield, throughput, and cost efficiency.
• Evaluate and implement new lithography materials (PSPI, PR) and tools.
• Define and maintain process documentation (SOP, OCAP, FMEA, SPC) and training programs.
• Collaborate with equipment vendors, materials suppliers, and internal engineering teams to evaluate and qualify new tools or materials.
• Design and perform DOE, root cause analysis, and statistical data analysis (e.g., JMP, Camline, etc.).
• Support daily fab operations with issue resolution and yield improvement initiatives.
• Mentor junior engineers and provide technical direction to the litho team.
•  

Qualifications:

• Bachelor’s or Master’s degree in Engineering (Materials, Chemical, EE, or related field).
• 5+ years hands-on experience in photolithography process, preferably in advanced packaging (eWLB, WLP, FO-PLP).
• Strong knowledge of lithography tooling, including exposure systems and coater/developer tracks.
• Skilled in project management, process transfer, and cost/yield improvement.
• Familiar with SPC, FMEA, and problem-solving methodologies.
• Excellent communication skills, with proven ability to engage with both internal stakeholders and external customers.
• Fluent in both English and Chinese. (This role will need to liaise with customers and counterpart from China)

Micron’s Singapore Process Development (PD) group in Technology Development (TD) is looking for Plasma-CVD / Diffusion PD engineer to support Plasma-CVD/DIFF process development of advanced technology nodes. You will design and optimize Plasma-CVD or Diffusion for Micron’s innovative NAND Flash products.

As a PD Engineer, you will take ideas from conception through process development then implementation in our manufacturing facilities. In addition to your technical responsibilities, you will also run the projects of highly technical nature. This role is essential to the success of Micron’s products and may require business-related travel. Primary areas of responsibility include Plasma-CVD or Thermal Diffusion process and film characterization, optimization, design, troubleshooting, process transfer and fundamental research.

Advanced Thin Films PD Engineer will interact with groups such as Process Integration, Metrology, Surface characterization labs, Electrical Failure Analysis, Yield Enhancement, Manufacturing and Equipment vendors/suppliers, to ensure robust thin film processes that meet the precise physical and electrical requirements for Micron Products.

As an Advanced Thin Films PD Engineer at Micron, you will be required to travel for brief business purposes. This position requires that you have an aptitude for a research and development (R&D) environment, good organizational skills and ability to work independently as well as in a team environment. This position may often require weekend support to R&D Pilot Line, for example, in case of pilot/manufacturing line excursions/downs and monitoring program-critical lots thought various modules as deemed necessary.

Your responsibilities will include, but are not limited to:

• Process Development

• Design and develop and deliver process package to meet product specification requirements as per program targets and timelines

• Characterize the processes using appropriate techniques (SEM, TEM, XPS, SIMS, AFM, etc.)

• Design and execute experiments, analyze data and present it in the appropriate forums.

• R&D Pilot Line in the Fab

• Improve process maturity, capability and sustain processes in the fab under your ownership

• Updating the Fab engineers on customer issues and technology needs.

• Supporting root cause defect and unique fail mode analysis.

• Process Integration

• Delivering advanced technology to meet future product nodes.

• Developing recipes to meet structural & electrical requirements.

• Managing wafers though Thin Film levels in support of special requirements.

• Other Process Areas

• Working in cross-functional teams to jointly develop Array and CMOS structures.

• Supporting cross-functional failure analysis and yield improvement.

• Advanced Thin Film peers

• Maintaining or developing expertise in multiple process, hardware, or technology areas.

• Serving as a resource for peers in recipe & process development.

Successful candidates must have:

• Education requirements

• PhD in Physics, Materials Science, Chemical Engineering, Electrical Engineering, Chemistry, or related fields

• BS/MS+5 years equivalent industry or research experience may substitute for a PhD.

• Understanding in one or more of the following topics Transport phenomena, Electromagnetics, Atomic/Molecular physics, and Surface phenomena.

• Solid troubleshooting, experimental design and data analysis skills.

• Strong computer skills, including MS Office.

• Plasma physics background and understanding of plasma sources used in plasma CVD is highly preferred.

• Understanding of CVD and Diffusion deposition processing principles.

• Rudimentary understanding of process control and Statistical Process Control (SPC).

• An understanding of solid state devices.

• An understanding of semiconductor process.

• Knowledge of advanced data analysis techniques and scripting is highly preferred

• Open to work off shift and weekends if necessary

• Open to domestic and international travel

Responsibilities

• Day to Day monitoring and ownership to timely address in-line SPC/defect/Equipment abnormality, handling and disposition

• Manage projects in productivity improvement, particularly for new processes, using process characteristic analytical tool to improve process condition and technology

• Establish process parameters for a variety of semiconductor equipment to ensure line stability

• Evaluation and development of new equipment/materials/process

Qualifications

• Minimum requirement of a Bachelor's Degree in Electronic Engineering , Electrical Electronic Engineering, Chemical Engineering, Materials Science, Mechanical Engineering and Physics

• Demonstrated experience of at least 5-7 years in semiconductor foundry dry etch module process

• 22/28 nanometer and below advance technology nodes experience is highly desirable

• Strong understanding of process development, optimization and troubleshooting.

• Proven leadership skills in leading cross-functional teams and managing projects related to process improvement or technology transfer

• Ability to analyze complex process issues, identify root causes, and implement effective solutions

• Experience skills including SPC, 8D reporting, DOE, FMEA and PMO is preferred

• Able to commit shift work

Introduction:

Process integration in development, optimization, and qualification of semiconductor devices/processes to meet performance requirements.

Your Job:

• Process integration in development, optimization, and qualification of semiconductor devices/processes to meet performance requirements.

• DOE design, execution, and analysis of results.

• Partner process module engineers to improve device/yield performance.

• Own and drive technical process problem solving.

• Interact with internal & external customers and respond to technical queries.

• Establish new technology design rules, test structures and test methodologies.

• Innovate new methods of continuous process/device improvement.

Other Responsibilities:

Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

Required Qualifications

• Education - Degree/master's in electrical, Electronics Engineering or equivalent.

• 4 year’s relevant experience for Degree.

  Wafer Fab process integration experience is required.

Preferred Qualifications:

• Knowledge of semiconductor device physics and/or RF fundamentals (e.g. S-parameters) is a plus.

• Independent, resourceful, with a positive attitude toward continuous learning & knowledge acquisition.

• Excellent analytical and optimization skills.

• Great interpersonal skills and ability to work with cross-functional teams.

GlobalFoundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.

As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.

All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.

Responsibilities

• Lead the development of mass balances, hydraulic profiles (P&IDs) and process flow diagrams for water treatment plants.

• Conducting process modelling, simulations and pilot testing to validate new technologies and process improvements

• Size and specify process equipment, such as pumps, blowers, tanks and etc. to meet system performance and reliability requirements

• Evaluate supplier proposals, quotations to ensure compliance with technical and commercial requirements

• Collaborate with cross-functional teams to plan and execute projects

• Provide onsite technical support during project execution and lead troubleshooting of operational issues

• Lead plant testing and commissioning.

• Prepare commissioning plans, SOPs, O&M manuals and training materials.

• Support proposal development and tender preparation.

• Mentor junior engineers and designers.

• Execute other ad-hoc tasks as assigned to support project and team objectives

Requirement

• Degree in Chemical Engineering, Environmental, Civil Engineering or a related technical discipline

• 8+ years' experience as a Process Engineer or Senior Process Engineer, preferably in the water treatment industry

• Proficient in AutoCAD

• Strong problem-solving, analytical and critical thinking skills

• Excellent interpersonal and communication skills

The Process engineer plays a vital role in D2W hybrid bonding process optimization, yield improvement and to develop innovating process flow or path finding. PE Works closely between internal Hybrid team, partner and Customers.

• Responsible for process development & CIP’s to improve the product yield
• To conduct DOE’s and experimental process trails and data analysis
• Define new process flow for customer products and run internal feasibilities
• Provides technical subject matter expertise in the area process developments
• Understands the Hybrid bonding upstream & downstream process flow to relate actual Hybrid bonding or Fusion bonding yield related topics
• Process optimization and data analysis to improve the process responses hybrid bonding and annealing
• Supports SOP, technical documentation and product operating manual writing activities and publish BKM process flow
• Builds-up technical know-how on product/problem solving via structured knowledge transfer between the on-site support team
• Machine and Technical Support
• Machine operation and application/product setup
• Prepares and executes customer demo feasibilities and recommend the process flow
• Coordinates and provides technical solutions / problems solving on customer process related issues in collaboration with Field issues
• Investigates process issues at customer site and supports Engineering team

Education

• Master’s in mechanical/electrical/Electronics /Physics or PHD

Work experience

• Minimum 5 years relevant experience in C2W or W2W hybrid bonding and Front end wafer fab/backend process
• Significant practical experience in solving process issues and process optimizations including new process setup
• Hands-on experience in semiconductor front end or backend Process and equipment’s including defectivity & yield engineering

Expertise and methodology

• Good in MS-Office, data analysis SW like JMP, Matlab
• Hands-on Process Development Expertise and able to share the Problem Statement in crystal clear

EA License : 02C3423

EA Personnel : R22108699

Job Description:

• Develops and optimizes BCD process technology and devices for power applications, involving TCAD simulations, device layout, characterization, and bench testing
• Develop and integrate new BCD device architectures and process modules for company BCD platforms.
• Conduct TCAD simulations to understand device behavior and calibrate simulation models to match experimental results.
• Design and lay out device test structures and new BCD device platforms.
• Analyze device performance and reliability through bench testing and data collection.
• Work with cross-functional teams, including the modeling team, to satisfy customer needs and develop advanced device models.

Job Requirement:

• Min Degree in Physics or Electrical Engineering.
• Min 3 year of expereince in TCAD (Technology Computer-Aided Design) tools for simulation and calibration.
• Experience with device layout, design rule checks, and test structure generation.
• Knowledge of BCD process development and device characterization techniques.

To submit your application, please apply online to apply@rn-care.com or call +(65) 6513 5697 for private and confidential discussion.

Your interest will be treated with the strictest of confidence. We regret that only shortlisted candidates will be notified or contacted.

RN Care Pte. Ltd
EA License No: 17C8900

Job Description:

• Develops and optimizes BCD process technology and devices for power applications, involving TCAD simulations, device layout, characterization, and bench testing
• Develop and integrate new BCD device architectures and process modules for company BCD platforms.
• Conduct TCAD simulations to understand device behavior and calibrate simulation models to match experimental results.
• Design and lay out device test structures and new BCD device platforms.
• Analyze device performance and reliability through bench testing and data collection.
• Work with cross-functional teams, including the modeling team, to satisfy customer needs and develop advanced device models.

Job Requirement:

• Min Degree in Physics or Electrical Engineering.
• Min 3 year of expereince in TCAD (Technology Computer-Aided Design) tools for simulation and calibration.
• Experience with device layout, design rule checks, and test structure generation.
• Knowledge of BCD process development and device characterization techniques.

To submit your application, please apply online to apply@rn-care.com or call +(65) 6513 5697 for private and confidential discussion.

Your interest will be treated with the strictest of confidence. We regret that only shortlisted candidates will be notified or contacted.

RN Care Pte. Ltd
EA License No: 17C8900

Role Summary

As a Senior Member of Technical Staff (SMTS), you are a module‑level CMP technical authority, responsible for defining CMP technical direction, leading FOAK developments, and driving cross‑functional execution across NAND nodes. As a SMTS (Senior Member of Technical Staff), you will be a part of revolutionary Next Generation NAND research & development CMP team driving Advanced NAND and CMP technology forward. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with Next Generation NAND. A SMTS CMP Engineer is a senior individual contributor responsible for defining, developing, and transferring advanced CMP processes for Micron NAND technologies. You will work directly with process integration and other process areas such as Wet Etch, CVD, Diffusion, Metals, Lithography & Dry Etch. You will work on state of the art and best in class CMP chambers & own the process roadmap to meet program and yield goals.

Main Responsibilities

• Own and lead key NAND CMP process modules, translating technology challenges into executable roadmaps across current and future nodes

• Drive cross‑functional execution across Technology Development, Process Integration, Manufacturing, and Equipment teams

• Lead FOAK CMP process development, including recipe architecture, control strategies, and integration alignment

• Ensure process robustness and manufacturability through run‑to‑run controls, SPC, qualification execution, and risk mitigation

• Resolve complex yield, defectivity, and integration issues using model‑based and data‑driven problem solving

• Define and execute process‑level hardware strategies in collaboration with equipment suppliers

• Act as a CMP technical leader, mentoring engineers, influencing adjacent process roadmaps, and communicating technology status and plans to senior stakeholders

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Other Responsibilities

• Mentor engineers through structured development; build SME pipelines; publish internal papers/BKMs and present to senior leadership; uphold Micron’s technical leadership expectations

• Integrates AI assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI enabled enhancements within one’s scope of work.

Candidate Profile

Minimum Qualifications / Experience

• PhD ≥12 yrs, or Master’s ≥15 yrs, of relevant experience in
  Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field,

• Experience in CMP Process Development

• Deep expertise in CMP chemistry, physics, and integration

• Publications/patents and strong record of technical contributions.

Must-Have Technical Skills

• In‑depth expertise in CMP fundamentals, including pad–slurry–wafer interactions, slurry chemistry at a mechanistic level, and pattern density/layout effects

• Strong understanding of multiple CMP process types (e.g., metal, dielectric, barrier/hardmask, poly‑Si/Si CMP)

• Extensive hands‑on experience with advanced 300 mm CMP OEM platforms, including driving hardware capability, throughput, and cost improvements

• Proven expertise in statistical process control (SPC), data analysis, and qualification methodologies

• Ability to independently drive complex technical execution, resolve yield and defectivity issues, and influence cross‑functional teams

Must-Have Soft Skills

• Demonstrated technical leadership in problem solving, with experience leading complex or multi‑disciplinary technical projects

• Strong ability to influence without authority across process integration, equipment, and manufacturing teams

• Clear and structured technical communication skills, including written documentation and stakeholder updates

• Strong analytical mindset with disciplined, data‑driven decision making

Embody Micron’s core values:

• People – Respect, develop and empower others

• Innovation – Drive continuous improvement and breakthrough thinking

• Tenacity – Show grit and determination

• Collaboration – Build trust and foster teamwork

• Customer Focus – Deliver excellence and value

Job Responsibilities:

• 2.5D/3DIC platform development.
• New unit module development and devices development.
• New process verification and qualification.
• New platform DSM setup
• Customer engagement and new product verification

Capability

• Solid semiconductor process integration and device characterization skills
• Semiconductor device physics and analysis skill.
• Experienced in 2.5D and 3DIC process development are plus.
• Skill on FMEA, control plan, DOE (design of experiment) and problem solving.
• Good communication, self-motived and avid learner

Qualification

• At least bachelor degree in microelectronics/electronics/electrical/physics/Materials engineering or other relevant fields.
• At least 10 years working experience in semiconductor R&D or related foundry experience of integration/process/device engineer.
• Working experience: 2.5D and 3DIC integration and device background are plus.
• Proficient English oral and writing skill.

Job Description:

• Develops and optimizes BCD process technology and devices for power applications, involving TCAD simulations, device layout, characterization, and bench testing
• Develop and integrate new BCD device architectures and process modules for company BCD platforms.
• Conduct TCAD simulations to understand device behavior and calibrate simulation models to match experimental results.
• Design and lay out device test structures and new BCD device platforms.
• Analyze device performance and reliability through bench testing and data collection.
• Work with cross-functional teams, including the modeling team, to satisfy customer needs and develop advanced device models.

Job Requirement:

• Min Degree in Physics or Electrical Engineering.
• Min 3 year of expereince in TCAD (Technology Computer-Aided Design) tools for simulation and calibration.
• Experience with device layout, design rule checks, and test structure generation.
• Knowledge of BCD process development and device characterization techniques.

To submit your application, please apply online to apply@rn-care.com or call +(65) 6513 5697 for private and confidential discussion.

Your interest will be treated with the strictest of confidence. We regret that only shortlisted candidates will be notified or contacted.

RN Care Pte. Ltd
EA License No: 17C8900

Job Description:

• Develops and optimizes BCD process technology and devices for power applications, involving TCAD simulations, device layout, characterization, and bench testing
• Develop and integrate new BCD device architectures and process modules for company BCD platforms.
• Conduct TCAD simulations to understand device behavior and calibrate simulation models to match experimental results.
• Design and lay out device test structures and new BCD device platforms.
• Analyze device performance and reliability through bench testing and data collection.
• Work with cross-functional teams, including the modeling team, to satisfy customer needs and develop advanced device models.

Job Requirement:

• Min Degree in Physics or Electrical Engineering.
• Min 3 year of expereince in TCAD (Technology Computer-Aided Design) tools for simulation and calibration.
• Experience with device layout, design rule checks, and test structure generation.
• Knowledge of BCD process development and device characterization techniques.

To submit your application, please apply online to apply@rn-care.com or call +(65) 6513 5697 for private and confidential discussion.

Your interest will be treated with the strictest of confidence. We regret that only shortlisted candidates will be notified or contacted.

RN Care Pte. Ltd
EA License No: 17C8900

Job Description:

• Develops and optimizes BCD process technology and devices for power applications, involving TCAD simulations, device layout, characterization, and bench testing
• Develop and integrate new BCD device architectures and process modules for company BCD platforms.
• Conduct TCAD simulations to understand device behavior and calibrate simulation models to match experimental results.
• Design and lay out device test structures and new BCD device platforms.
• Analyze device performance and reliability through bench testing and data collection.
• Work with cross-functional teams, including the modeling team, to satisfy customer needs and develop advanced device models.

Job Requirement:

• Min Degree in Physics or Electrical Engineering.
• Min 3 year of expereince in TCAD (Technology Computer-Aided Design) tools for simulation and calibration.
• Experience with device layout, design rule checks, and test structure generation.
• Knowledge of BCD process development and device characterization techniques.

To submit your application, please apply online to apply@rn-care.com or call +(65) 6513 5697 for private and confidential discussion.

Your interest will be treated with the strictest of confidence. We regret that only shortlisted candidates will be notified or contacted.

RN Care Pte. Ltd
EA License No: 17C8900

Job Responsibilities:

• Develop, validate, and maintain special process procedures (e.g., heat treatment, surface treatment, coatings, welding, brazing)
• Perform process capability studies and continuous improvement initiatives
• Ensure compliance with aerospace standards and customer requirements
• Assist the Manager in day-to-day process monitoring and production requirement
• Perform other duties and responsibilities, as assigned

Job Requirements:

• Minimum 3 years of relevant experience in an Aerospace or Manufacturing environment

Interestedapplicants can send their detailed resumes to janelui@recruitexpress.com.sgor call JANE @ 6735 1955.

JANE LUI JIE'EN

CEI: R1104482

Company Reg.No. 199601303W || EA Licence No. 99C4599

Step into a career with ASM, where cutting edge technology meets collaborative culture. ​

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.  

Job's mission

As Global Manufacturing Process Lead, you will define and standardize ASM’s end-to-end manufacturing processes and MES capabilities to enable scalable, high-performance operations. You will translate business needs into robust digital solutions that improve safety, quality, throughput, and traceability while enabling real-time, data-driven decision making on the shop floor. 

Working across Manufacturing, Quality, EHS, Supply Chain, Finance, and IT, you will align stakeholders on process standards, metrics, and system requirements, and lead the design and deployment of MES solutions that deliver measurable operational and financial outcomes. 

What you will be working on

• Lead cross site process mapping to simplify, standardize, and document equipment manufacturing workflows and translate business requirements into scalable MES tool capabilities. 
• Own the global MES process standard and business capability roadmap from process definition through sustainment across manufacturing sites. 
• Define business requirements for MES design, configuration, integration, testing, and deployment in partnership with IT, vendors, and site teams. 
• Establish and govern MES master data, transaction rules, process controls, measurements, and traceability requirements to support safety, quality, delivery, cost, and productivity outcomes. 
• Partner with Planning and Logistics teams to improve demand to build signal flow, production readiness, and manufacturing visibility through MES enabled processes. 
• Ensure MES capabilities align with enterprise process standards, platform strategy, and end to end business process design. 
• Work with global process owners and IT to continuously enhance MES functionality, improve user adoption, and support ongoing platform maturity. 
• Ensure MES processes and controls comply with corporate policies, trade regulations, and audit requirements. 
• Provide business insights and recommendations to leadership on process performance, standardization opportunities, and MES capability improvements. 

What we are looking for

• Minimum Bachelor’s degree in Engineering, or a related field; semiconductor industry experience, or equivalent complex high-tech manufacturing experience
• Minimum 5 years of experience leading business process improvement, digital transformation, or operational excellence initiatives in a manufacturing or corporate environment. 
• Strong analytical skills with the ability to interpret complex data, identify trends, and drive measurable improvements in quality, cost, and efficiency. 
• Comfortable in a fast-paced and dynamic environment; able to manage multiple priorities while maintaining strong attention to detail. 

What sets you apart

• Excellent stakeholder management and communication skills, with the ability to influence at all levels, including senior leadership. 
• Results-driven mindset with a passion for continuous improvement and delivering high-quality outcomes. 
• Proven program/project management capability, with a track record of leading cross-functional teams and delivering complex initiatives on time and within budget. 
• Working knowledge of process-improvement and problem-solving methodologies (e.g., Lean, Six Sigma); certification 

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

Responsibilities:

• In charge of establishing the process and work in the team to implement risk management best practices in projects
• Implement and maintain the office's ISO 13485 and IEC 62304 compliant quality management system processes and procedures across departmental work and projects.
• Responsible in providing guidance and development support to the projects handled
• Taking charge of validating and advising project teams on regulatory, quality and risk requirements
• In charge of implementing and maintaining ISO 13485 and IEC 62304-compliant quality management system processes and procedures
• Responsible in
• In charge of managing project tasks which includes ensuring of timely completion of project milestones and meeting KPIs
• In charge of compliance with quality, regulatory and organisational policies and systems while supporting required record-keeping and documentation.

Requirements:

• Min Degree in Engineering /Science or relevant
• Min 2 years of working experience in QMS, Risk Management and design & development in medical industry
• Experience in ISO13485 /IEC62304 audit is required

To submit your application, please apply online to apply@rn-care.com or call +(65) 6513 5697 for private and confidential discussion.

Your interest will be treated with the strictest of confidence. We regret that only shortlisted candidates will be notified or contacted.

RN Care Pte. Ltd
EA License No: 17C8900

Job Responsibilities:

• Develop, validate, and maintain special process procedures (e.g., heat treatment, surface treatment, coatings, welding, brazing)
• Perform process capability studies and continuous improvement initiatives
• Ensure compliance with aerospace standards and customer requirements
• Assist the Manager in day-to-day process monitoring and production requirement
• Perform other duties and responsibilities, as assigned

Job Requirements:

• Minimum 3 years of relevant experience in an Aerospace or Manufacturing environment

Interestedapplicants can send their detailed resumes to janelui@recruitexpress.com.sgor call JANE @ 6735 1955.

JANE LUI JIE'EN

CEI: R1104482

Company Reg.No. 199601303W || EA Licence No. 99C4599

Key Responsibilities:

• Lead the architecture design (e.g. memory cells, select transistors, and peripheral devices), process integration, electrical characterization, modeling and simulation, failure analysis for 3D NAND devices.
• Design and execute DoE, analyze the impact of process variations on device performance and reliability (such as durability and data retention), and propose improvement solutions.
• Collaborate with the process development team to assess new device architectures, driving technology iteration.
• Write detailed technical reports and support customers or internal teams in resolving related technical issues.

Required Qualifications:

1. Education: Master's degree or above
2. Major: Microelectronics, physics, material science & engineering, chemistry;
3. Other Requirements:

• 8+ years of semiconductor device work experience, 3+ years of 3D NAND work experience.
• In-depth knowledge of 3D NAND device physics, familiar with its principles, failure modes, and reliability mechanisms.
• Troubleshooting, and problem-solving capabilities, with experience in successfully improving device performance or yield.
• Familiar with advanced semiconductor manufacturing processes and integration flows.
• Strong cross-team communication and collaboration skills.

Job Description:

• Develops and optimizes BCD process technology and devices for power applications, involving TCAD simulations, device layout, characterization, and bench testing
• Develop and integrate new BCD device architectures and process modules for company BCD platforms.
• Conduct TCAD simulations to understand device behavior and calibrate simulation models to match experimental results.
• Design and lay out device test structures and new BCD device platforms.
• Analyze device performance and reliability through bench testing and data collection.
• Work with cross-functional teams, including the modeling team, to satisfy customer needs and develop advanced device models.

Job Requirement:

• Min Degree in Physics or Electrical Engineering.
• Min 3 year of expereince in TCAD (Technology Computer-Aided Design) tools for simulation and calibration.
• Experience with device layout, design rule checks, and test structure generation.
• Knowledge of BCD process development and device characterization techniques.

To submit your application, please apply online to apply@rn-care.com or call +(65) 6513 5697 for private and confidential discussion.

Your interest will be treated with the strictest of confidence. We regret that only shortlisted candidates will be notified or contacted.

RN Care Pte. Ltd
EA License No: 17C8900