Total 10 job vacancies by United Test And Assembly Center Ltd

Responsibilities:

• To support day to day shift duties, facility system operation, and preventive/predictive maintenance programs for facilities system, ensuring good system reliability and optimum efficiency
• Conduct routine monitoring of all the Building Facilities and systems such as cooling towers, vacuum pumps, condenser water pumps, AHU, air compressors, air dryers, electrical system, plumbing and temperature & RH monitoring system
• Respond to feedback/issues and perform troubleshooting to restore/resume the operation back to normal
• Assist the Engineer in system improvement and modification projects
• Maintain proper records of maintenance-related documentation
• Assist the Engineer in the development and implementation of maintenance programs
• Coordinate contractor services for equipment maintenance, housekeeping activities
• Coordinate with Vendors to conduct mandatory servicing of facilities system and equipment
• Carry out all daily work activities complying with the applicable local government regulations, applicable corporate directives and applicable standards
• Inspect, identify and resolve issues of facilities system
• Assist the Engineer for inventories tracking such as appropriate spares, consumables, and other resources necessary for the day-to-day operation
• Provide administrative support to upkeep ISO or auditable documentation (i.e. ISO, IATF, RBA, VDA, EAL6, Customers, etc)
• Keep abreast of changes to the applicable local government regulations and applicable corporate directives

Requirements:

• NITEC / Higher NITEC / Diploma in Electrical or Mechanical Engineering
• At least 2 years of relevant experience in a semiconductor or manufacturing environment
• Able to work 12-hour shifts

Responsibilities: 

• Responsible for maintaining optimal machine performance through downtime troubleshooting including diagnosis and resolve of machine issues efficiently, implement long-term solutions for recurring problems, collaborate with vendors and assist in updating ISO documentation to minimize downtime.
• Perform preventive maintenance by identifying potential part failures and recommend improvements to extend component life, ensuring smooth and efficient equipment operation.
• Support new machine qualification (PAC/buy-off) and ensure machines meet safety standards and verify parts against specifications.
• Assist engineers in preparing work point instructions (WPI) to facilitate smooth product introductions and business growth.
• Manage machine-related spare parts, including stock checks and order placements.
• Recommend cost-saving measures through localization or vendor changes to reduce cost.

Requirements: 

• Diploma in Engineering, specializing in Electrical / Mechatronics / Mechanical

Responsibilities;

• Line sustaining for dry process (i.e. Sputter, Photolithography and Descum)
• Support lot dispositions and OCAP executions
• Involve in Continuous Improvement Projects
• Working with QM Dept. to response customer inquires and issues
• Execute CIP or project handling that contributes yield & cost efficiency improvement
• Ensure SPC is maintain and in control
• Support new material evaluation and new tool set up

Requirements;

• Diploma in electronics or related disciplines
• Preferably with minimum 2 years' experience in Wafer bumping process running high volume
• Knowledge in: Statistic Process Control (SPC), Out Of Control Procedure (OCAP)

Responsibilities:

• Introduce WLCSP new devices into mass production(concept, design, verification, validation, and manufacturing releases of new products)
• Lead and manage new product, ensure on time delivery as committed with the customer
• Works and communicates with customers to understand qualification requirements and expectations of the new product
• Translate customer's engineering build instructions to Special Work Request
• Review and delegate external specifications from customers pertaining to each device/product to relevant team
• Coordinate with Design and Process Engineering Team on the action items to ensure product is within the site capability and manufacturing flow
• Publishes and reviews engineering reports, including all issues found and resolved during developments, as well as yield reports and analysis.
• Makes smart and sound decisions to support quick turn around on sample and engineering builds
• Maintains lifecycle/document management from Qualification to Production lifecycle phase thru eNPI system.
• Attends daily meeting to check NPI builds movement and issues encountered during processing and coordinate with Support Group for help needed on execution

Requirements:

• Degree/Diploma in Electrical/Electronic Engineering or equivalent
• Minimum 5 years’ experience in WLCSP/Backend Process/Product/Package Engineering in Semiconductor industry or equivalent preferably from OSAT
• Strong project coordination, communication, and problem-solving skills

Responsibilities:

• Responsible for Production Planning and Scheduling
• Responsible for recovery planning to mitigate impact of line performance issue to customer
• Monitor forecasted plan, track and report on machine utilization and performance and drive operations to meet output and shipments and revenue to ensure timely delivery to customers and meet KPI such as cycle time and on time delivery
• Provides input to Customer Service department in term of forecast loading, revenue attainment, shipment and performance
• Collaborate with cross functional teams to ensure that customer requirements can be met for current and future demand
• Responsible for documentation of Processes and Procedure for continuity and training purposes
• Continuous Improvement and Innovation
• Address issues and exercise judgement within broadly defined practices and approaches to solve complex problems on production performance, outputs and requirement
• Participate in all continuous improvement and/or automation projects to fully optimize the manufacturing process, improving CT, improving flow and cost effectiveness
• Responsible to improve the planning processes

Requirements:

• Degree in any discipline
• Minimum 3 years of relevant experience in planning, preferably in semiconductor industry
• Good leadership, communication and interpersonal skills
• Able to work in a dynamic and fast-moving environment

Responsibilities

• Maintain and ensure stable communication between equipment and host systems - Tools: GPTC UFO-300, AMAT charger, Evatec Hexagon, LAM sabre, Althete BM-1310W
• Troubleshoot and resolve issues when equipment fails to connect or respond to host commands
• Perform sustaining activities to support daily manufacturing operations
• Ensure equipment capability and integration within PPC, RMS, and FDC systems
• Work with Inficon FDC system for fault detection and classification to improve process control
• Conduct Equipment Automation testing, including User Acceptance Testing (UAT)
• Collaborate closely with IT CIM teams to analyze tool output data, identify data linkages, and implement data-driven solutions/innovations
• Monitor system performance and implement corrective actions when necessary

Requirements:

• Degree in Engineering/ Information Technology/ Computer Science or equivalent
• 2-3 years of experience in the semiconductor industry or in a manufacturing plant with automation
• Good understanding of SECS/GEM communication protocol in semiconductor equipment
• Familiarity with factory automation systems such as PPC, RMS, and FDC
• Experience with Inficon FDC system for fault detection and classification
• Basic programming knowledge (e.g., Python, C++, scripting) is an added advantage
• Basic knowledge of TCP/IP networking
• Experience in equipment automation or CIM environment is an advantage
• Strong troubleshooting and problem-solving skills

Responsibilities:

• Responsible for overseeing the manufacturing, production planning, scheduling and controlling of a12" bumping fab to ensure that production targets are met, and the fab operates efficiently and effectively
• Manage high-demand customer orders and ensure that manufacturing operations run smoothly, safely, and efficiently on a shift-by-shift basis
• Develop and implement production plans to meet customer demand, ensuring on-time delivery and optimal fab utilization
• Create and manage production schedules, considering equipment capacity, material availability, and labour resources
• Oversee inventory management, ensuring that materials and WIP (Work-In-Progress) are properly tracked and managed
• Analyze and optimize fab capacity to meet production demands, identifying opportunities for improvement
• Track and analyze key performance indicators (KPIs), such as cycle time, throughput, and yield, to identify areas for improvement
• Work closely with cross-functional teams, including manufacturing, engineering, and supply chain, to ensure alignment and effective production planning
• Identify and resolve production-related issues, working with teams to implement corrective actions and prevent future occurrences
• Drive initiatives to improve production efficiency, reduce costs, and enhance overall fab performance

Requirements:

• Degree in Engineering, Manufacturing, Industrial Engineering or related field
• Minimum 8–10 years of experience in semiconductor manufacturing or wafer fab operations
• Strong knowledge of production planning, scheduling, and factory operation
• Leadership, communication, and stakeholder management skills
• Excellent communication and collaboration skills, with ability to work with cross-functional teams

Responsibilities:

• Provide strategic direction and leadership for the 12" bumping engineering team, aligning with company goals and objectives
• Oversee the development, optimization, and qualification of 12" bumping processes, ensuring high yield, quality, and reliability
• Develop and execute a technology roadmap for 12" bumping, staying ahead of industry trends and requirements
• Collaborate with cross-functional teams, including manufacturing, quality, equipment engineering and RnD, to ensure seamless integration of bumping processes
• Manage resources, including personnel, equipment, and budget, to achieve departmental goals and objectives
• Foster a culture of innovation and continuous improvement, identifying opportunities for process enhancements and implementing changes
• Identify and mitigate risks associated with bumping processes, ensuring minimal impact on production and quality

Requirements:

• Bachelor's or Master's degree in Engineering, Physics, Materials Science, or related field
• Minimum 8-10 years of experience in bumping engineering or a related field, with experience in 12" wafer processing
• Strong technical expertise in bumping processes, including process development, integration, and optimization
• Proven leadership experience, with a track record of managing teams and driving strategic initiatives
• Excellent communication and collaboration skills, with ability to work with cross-functional teams
• Strong analytical and problem-solving skills, with ability to identify and resolve complex technical issues

Responsibilities:

• To support day to day shift duties, facility system operation, and preventive/predictive maintenance programs for facilities system, ensuring good system reliability and optimum efficiency
• Conduct routine monitoring of all the Building Facilities and systems such as cooling towers, vacuum pumps, condenser water pumps, AHU, air compressors, air dryers, electrical system, plumbing and temperature & RH monitoring system
• Respond to feedback/issues and perform troubleshooting to restore/resume the operation back to normal
• Assist the Engineer in system improvement and modification projects
• Maintain proper records of maintenance-related documentation
• Assist the Engineer in the development and implementation of maintenance programs
• Coordinate contractor services for equipment maintenance, housekeeping activities
• Coordinate with Vendors to conduct mandatory servicing of facilities system and equipment
• Carry out all daily work activities complying with the applicable local government regulations, applicable corporate directives and applicable standards
• Inspect, identify and resolve issues of facilities system
• Assist the Engineer for inventories tracking such as appropriate spares, consumables, and other resources necessary for the day-to-day operation
• Provide administrative support to upkeep ISO or auditable documentation (i.e. ISO, IATF, RBA, VDA, EAL6, Customers, etc)
• Keep abreast of changes to the applicable local government regulations and applicable corporate directives

Requirements:

• NITEC / Higher NITEC / Diploma in Electrical or Mechanical Engineering
• At least 2 years of relevant experience in a semiconductor or manufacturing environment
• Able to work 12-hour shifts

Responsibilities:

• Manages internal and customer projects from engagement until project closure through proper planning and timely execution by working with internal cross-functional teams and customer
• Maintains documentation of customer projects starting from Kick-off, Engineering build, Qualification and Off-load to full production
• Reviews and analyses customer’s specifications and requirements in terms of material, process and assembly specification
• Initiates team discussion/ review on customer document gaps/ discrepancies and recommend proposals to customer
• Plan and generate detailed customer project activity timeline, track progress and anticipate potential issues and resolve it with internal stakeholders
• Ensures that customer indices are monitored and reviewed by having regular meet-up and review of team performance
• Develop and grow people project management skills, adopting on dynamic changes and crisis management
• Drive for productivity improvement and cost reduction in process integration
• Work with TPM/ Sales/ customer for new design win and handle NPI engineering activities- reliability / Yield and Quality issue

Requirements:

• Degree/Diploma in Electrical/Electronics, Engineering or equivalent
• Minimum 3 years of Engineering experience in Semiconductor manufacturing industry
• Preferably with Project Management Certification
• Knowledge of how bumping, assembly material interact with package workmanship and reliability would be preferred
• Knowledge on WLCSP bumping process of 2P2M; DOE/SPC/ FMEA /JMP/ APQP standard
• Bumping process knowledge on (Lithography, Sputter, Etching, Plating, Descum & Ball drop process preferred