Total 5 job vacancies by Stats Chippac Management Pte. Ltd.

As a Senior/Staff LithographyProcess Engineer, you will lead the development and optimization of lithographyprocesses for both Fan-In and Fan-Out eWLB (Embedded Wafer Level Ball GridArray) packaging technologies. You will be responsible for driving keyengineering projects such as yield improvement, cost reduction, and processtransfers across global manufacturing sites.

Key Responsibilities:

• Own and optimize lithography processes for PI, PR, and other patterning layers in both FO and FI eWLB.
• Manage photolithography tools (GHI/i-line stepper, coat/develop tracks, etc.), including recipe setup and troubleshooting.
• Lead cross-functional projects focused on cost reduction, process robustness, and NPI transfer.
• Lead process improvements to enhance yield, throughput, and cost efficiency.
• Evaluate and implement new lithography materials (PSPI, PR) and tools.
• Define and maintain process documentation (SOP, OCAP, FMEA, SPC) and training programs.
• Collaborate with equipment vendors, materials suppliers, and internal engineering teams to evaluate and qualify new tools or materials.
• Design and perform DOE, root cause analysis, and statistical data analysis (e.g., JMP, Camline, etc.).
• Support daily fab operations with issue resolution and yield improvement initiatives.
• Mentor junior engineers and provide technical direction to the litho team.
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Qualifications:

• Bachelor’s or Master’s degree in Engineering (Materials, Chemical, EE, or related field).
• 5+ years hands-on experience in photolithography process, preferably in advanced packaging (eWLB, WLP, FO-PLP).
• Strong knowledge of lithography tooling, including exposure systems and coater/developer tracks.
• Skilled in project management, process transfer, and cost/yield improvement.
• Familiar with SPC, FMEA, and problem-solving methodologies.
• Excellent communication skills, with proven ability to engage with both internal stakeholders and external customers.
• Fluent in both English and Chinese. (This role will need to liaise with customers and counterpart from China)

Purpose of the Job (Why the job exists):

• Responsible for the overall WLCSP Manufacturing organization to drive production output, quality and cycle time for WLCSP Manufacturing.

• Responsible for the cost, productivity and people & asset effectiveness for WLCSP Manufacturing.

• Manage adhoc projects.

Key Job Accountabilities (Actual daily deliverables):

• Lead and manage semiconductor backend manufacturing operations across Backgrind, Laser Mark, , Laser groove, Wafer Saw, AOI, and Tape & Reel processes to achieve safety, quality, delivery, cost, and productivity targets.

• Drive operational excellence through continuous improvement initiatives focused on yield enhancement, cycle time reduction, equipment utilization, and cost optimization.

• Lead multiple production shifts through supervisors and engineers, ensuring effective manpower planning, workforce development, and operational discipline.

• Manage customer escalations, production risks, and quality excursions, ensuring timely containment, root cause analysis, and corrective actions.

• Partner with Process, Equipment, Quality, Planning, and Maintenance teams to resolve complex manufacturing issues and improve process robustness.

• Monitor and drive key manufacturing KPIs including OEE, yield, UPH, cycle time, on-time delivery, scrap, and labor productivity.

• Support New Product Introduction (NPI), process transfers, and manufacturing readiness activities to meet customer and business requirements.

• Champion Lean Manufacturing, Six Sigma, automation, and Industry 4.0 initiatives to improve factory performance and scalability.

• Ensure compliance with quality systems, customer requirements, EHS standards, and audit expectations.

• Develop and execute manufacturing strategies, organizational capability, and succession plans to support long-term business growth.

Required Experience and Qualifications :

• Minimum Degree in any disciplines.

• Preferably 10 years experience in semiconductor industry.

• Experience managing manufacturing operations for minimum of 5 years

Purpose of the Job

• To perform technical maintenance and optimization of advanced packaging equipment (Bump, RDL, CoW, MEOL) to ensure high-precision processing, maximize tool uptime, and support stable mass production.

Key Job Accountabilities:

• Execute scheduled PM and emergency repairs (BM) on diverse toolsets including PVD (Sputter), ECD (Plating), Lithography (Stepper), and TCB/Hybrid Bonders.
• Calibrate high-precision sensors and actuators to maintain critical process parameters (e.g., bonding force, temperature uniformity, and alignment accuracy).
• Diagnose and resolve complex mechanical and electrical failures using schematics, diagnostic software, and measurement tools.
• Track the consumption of critical components and suggest improvements for part lifetime extension.
• Maintain detailed logs of equipment history, repair procedures, and safety checklists.

Required Experience and Qualifications

• Bachelor’s degree in Electrical, Electronic, Mechanical Engineering, or a related field.
• Understanding of the Wafer Level Packaging (WLP) process flow and equipment hardware architecture.
• Ability to read/interpret mechanical drawings and electrical schematics. Proficiency in using multimeters, oscilloscopes, and precision gauges.
• Comfort working in a cleanroom environment and flexibility for shift rotations.

Purpose of the Job:

• To continuously improve Wafer processes and capabilities to attain the highest quality and productivity through work simplifications and standardization, implementation of best-known methods and controlled operating procedures

Key Job Accountabilities:

• Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of quantity, yield and cycle time. 
• To provide interim and long-term corrective actions for any discrepancies.
• Liaise with customers & potential customers on development & improvement of process, material and equipment capabilities.

Scope of the Job:

• In-charge of photo resist coat, exposure, develop and curing process for PI (e.g. HD4100) and PR (Positive, Negative).  Different photo sensitive material is coated in different machines and different exposure machine types (steppers & aligners).
• Setup recipe for new devices.  Process characterization for every new device: coating thickness, exposure recipe and CD after develop. 
• Working closely with mask designer to continuously update wafer process design rules so to improve process capability and productivity.
• Perform continuous improvement activities for top defects, process simplification and throughput improvement.
• Monitor process capability in terms of input parameter control and SPC monitoring

Required Experience and Qualifications:

• Requires Degree in Engineering, Material Sciences, Chemistry or equivalent
• Minimum 2 years of relevant experience in wafer bumping or wafer fabrication
• Minimum 5 years of experience in relevant area is an added advantage

Key Responsibilities:

• Conduct thorough reviews and analysis of capital expenditure (CAPEX) proposals, ensuring alignment with strategic objectives and financial feasibility.
• Develop and implement initiatives to optimize CAPEX utilization, enhancing operational efficiency and driving CAPEX avoidance
• Collaborate with cross-functional teams to standardize the internal cost model, establish pricing strategies that maximize profitability while remaining competitive in the market.
• Monitor market trends and conduct regular pricing analysis to identify opportunities for pricing optimization and revenue growth.
• Identify low-load production lines, provide order guidance, and accelerate the development progress of new products.
• Evaluate new product introduction (NPI) pipeline and provide recommendations for further investment based on market potential and strategic fit.
• Collaborate with finance and other stakeholders to review the annual operating plan (AOP)by setting realistic targets, defining key performance.
• Monitor business performance by pipeline tracking.
• Provide leadership, guidance, and mentorship to the team, fostering a culture of collaboration, continuous improvement, and accountability.
  

Qualification and requirements:

• Bachelor's degree in business administration, finance, or a related field. MBA or equivalent advanced degree is preferred.
• Strong financial acumen and the ability to analyze complex financial data.
• Solid understanding of pricing strategies, cost management, and investment planning.
• Exceptional communication and interpersonal skills, with the ability to collaborate effectively with cross-functional teams
• Results-oriented mindset with a focus on driving continuous improvement and achieving targets.