1. Be the subject matter expert of MEDs microelectronic assembly team and advise Design Engineering early in new product development to ensure designs are manufacturable.
2. Operate and supervise, including setup, die attachment and wirebonding equipment for all microelectronics assembly processes.
3. Responsible to develop, design, and test standards and guidelines for developing microelectronics packaging solutions for MEDs customer products in aerospace and defense applications.
4. Responsible to define, develop and qualify new packages such as leadframe/substrate layout, bonding diagram, package outline drawing.
5. Develop assembly processes and establish process documentation that are stable, repeatable, and reliably meet design requirements.
6. Take a leading role in the build of prototypes, first articles, and pre-production assemblies.
7. Support customer products throughout their life cycle, developing and implementing changes as needed.
8. Consistently complete quality work in a timely manner meeting established deadlines.
9. Work with hybrid technology including RF ICs, capacitors, inductors, substrates, and other micro components.
10. Analyse and work to both prototype and released assembly drawings and process documents.
11. To ensure products manufactured in accordance with MEDs quality standards.
12. Train new personnel on all microelectronics assembly processes as required.
