Total 7 Science / R&D / Research job vacancies

Department Overview:

The stage R&D department develops new technologies and products for the stage business unit. We work on a wide range of products ranging from ultraprecision systems that achieve nanometer-level precision for semiconductor applications, to large format and highly dynamic gantry systems capable of accelerating hundreds of kilograms of mass in excess of 4 g's. The R&D team comprises members with diverse technical specialities working in an interdisciplinary setting on some of the most challenging technical problems in the company.

Job Description

• Carry out mechanical design of multi-axis stages and motion systems.
• Carry out basic engineering analysis & computation to validate preliminary design concepts.
• Carry out finite element analysis to optimise and validate mechanical static and dynamic characteristics.
• Prepare engineering drawing packages (2D and 3D) for manufacturing.
• Prepare manufacturing documentation of new products (e.g. assembly drawings, work instructions, test plans) to prepare for transfer to manufacturing.
• Conduct hands-on assembly and mechatronics debugging of prototype stages or motion systems.
• Design and conduct experiments to address gaps in knowledge and mitigate technical risk of design.
• Work with local and overseas teams (such as Sales, Applications, Manufacturing) within the organisation to support the entire product lifecycle (i.e. from conceptualisation to commercialisation).

Qualifications

• Candidate must possess at least Bachelor's Degree / Master's Degree and/or equivalent, preferably in Electrical/Electronics Engineering, Mechatronics Engineering, Mechanical Engineering and/or any other relevant course of study.
• We will consider If applicants with alternative background with strong interest and motivation to learn.
• Preferably with 1-2 Year(s) of working experience in relevant engineering industry.
• Applicants without experience but with good learning ability are welcome to apply, undergraduate training in Mechanical / Mechatronics engineering or related field, prefer GPA better than 4/5.

Other Information

Skillset(s) Requirement:

• Knowledge of CAD tools.
• Understanding of basic mechanical engineering analysis and design calculations for precision design.
• Experience with Finite Element Analysis of Mechanical static and dynamic modelling/simulation would be a plus.
• Ability to design and conduct simple experiments, and to draw meaningful conclusions from the results.
• Hands-on experience in performing mechanical assembly and testing validation.
• Experience and/or knowledge in basic technical documentation preparation (e.g. assembly work instructions)

Attributes:

1. High willingness to learn and commitment to developing as proficient practicing engineer
2. Strong and clear communicator
3. Conscientious worker with ability to perform under dynamic high-stress situations
4. Basic time management skills to handle assigned tasks independently with limited supervision
5. Meticulous attention to quality, detail and reliability

[Internship Period: June to December]
We are seeking a motivated and meticulous laboratory intern to join our dynamic team. This internship will provide you with valuable hands-on experience in a laboratory setting and the opportunity to contribute to our ongoing research and development projects.

• Conduct bench scale extraction and purification experiments as a feasibility check before pilot testing
• Perform characterization analysis of samples before and after extraction, using various analytical equipment such as GC, GC-MS, Headspace GC, ICP-MS, HPLC, Karl Fischer titrator, UV-vis spectrophotometer, density meter, etc
• Follow safety protocols and maintain a clean and organized laboratory environment

Requirements

• Students from Chemical Engineering preferred but any chemistry Major welcomed.
• Student application preferred
• No experience required

Job Description

Do you demand the best from your professional career? Are you inspired by excellence? At Hewlett Packard Enterprise, you will have the power to make the most out of your career. Hewlett Packard Enterprise is one of the world’s largest and most successful IT Companies. We are successful not just because of the technology solutions that we deliver, but also because of our core values and the amazing people that we have. We invest in our employees’ personal growth & development in an environment that will challenge and reward them. Hewlett Packard Enterprise is filled with energetic people, sparking technology revolutions and creating the future to help improve the lives of every customer.

Networking is one of the fastest growing businesses within Hewlett Packard Enterprise and offers opportunities to gain experience with leading edge technologies. Aruba, a Hewlett Packard Enterprise company, offers a comprehensive open and standards-based portfolio designed to address a broad range of customer segments, from small & medium businesses, to the largest enterprises with advanced requirements for leading branch, campus LAN and data center solutions. Aruba’s innovative technology and open, standards-based approach to networking is resonating with customers around the world, and Aruba revenue exceeds the sum of its next five competitors. Here, employees leverage new technologies and innovate to solve real world customer challenges.

We are currently looking for a dynamic, talented and innovative individual to be part of our high-speed digital circuit designer team developing state-of-the art networking products. Explore your career options with Aruba, together we will do something amazing!

http://www.arubanetworks.com/company/about-us

Sounds like you? Then we have the right opportunity for you!

HOW YOU WILL MAKE YOUR MARK:

As a Hardware Design Engineer, you will be part of a dynamic and highly skilled R&D team that create high quality products.

Responsibilities include being responsible for design, component selection, schematic implementation, hardware bring-up, debug and validation. You will collaborate with a multi-sited product development team to integrate your deliverables toward release of new products into production. You will also take part in conducting feasibility, design margin and validation analysis, and empirical testing on new and modified designs.

ABOUT YOU:

• Must have a Bachelor’s or Master’s degree in Electrical Engineering or related fields.
• Possess good knowledge and technical understanding of both digital and analog circuit design.
• Good analytical and problem solving skills.
• Familiar with Cadence CAD tools.
• Knowledgeable of programming languages such as Python, Perl and Matlab.

ADDITIONAL PREFERRED ABILITIES

• Outstanding interpersonal skills, with ability to work in teams, ability to work independently and make autonomous decisions when necessary, experience as a team player, and willing to take on a variety of projects.
• Capability to build relationships and self-motivator.
• Good oral and written communication skills, plus ability to read, comprehend, and explain engineering drawings and technical documents.

Job Description & Responsibilities:

• Design, develop, and test New CNC controller software and hardware.
• Select New CNC Controller from different makers.
• Integrate CNC controllers with various machine tools and equipment.
• Develop and optimize motion control algorithms for precision machining.
• Collaborate with cross-functional teams to ensure seamless integration and functionality.
• Troubleshoot and resolve issues related to CNC controllers and machine performance.
• Ensure compliance with industry standards and safety regulations.

Job Requirements:

• Minimum Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or relevant discipline.
• At least 5 years of experience in CNC controller development, programming, and integration.
• Experience with motion control, servo systems, and feedback devices.
• Hands‑on experience using NC cycles and providing technical solutions to users.
• Basic knowledge of electrical design and a solid understanding of electrical circuits.
• Specialized training or certification in CNC controller development is an advantage.
• Experience working with multi‑axis CNC machines and advanced motion control algorithms.
• Prior experience developing user interfaces for CNC controllers.
• Proficiency in programming languages such as C/C++/C# and PLC programming.
• Strong understanding of CNC machine architecture and control systems.
• Familiarity with communication protocols (e.g., Ethernet IP, Modbus).
• Excellent analytical and problem-solving skills.
• Strong communication and teamwork skills.
• Ability to work independently and collaboratively in a fast‑paced environment.
• Comfortable working in a manufacturing environment and performing hands‑on tasks when required
• Work experience with Fanuc controllers (both PLC and CNC) would be an added advantage.

Job Description

Description:

Join this team focused on RF Front End Modules for the Cellular and Wireless Data markets.  You will be part of the Business Unit Engineering organization and work directly with and support multiple product development teams.  

Position requires a senior technical specialist who can provide leadership in the development of new and sustainable technology platforms for the company using a solid background in materials, device physics, front end or back end processes, and supplier interactions.

Responsibilities:

• Exhibit skill and confidence in working cross-functionally across a matrix organization in a very dynamic and fast-paced environment.

• Support development of advanced technologies for Si / GaAs backend interconnect, passivation, RDL, bump and flip chip packaging (CPI).

• Monitor and improve existing processes to improve yield, quality, and throughput, thereby increasing efficiency and product reliability. Support new pioneering singulation development.

• Utilize expertise in process integration between Fabrication (FAB) facilities and Outsourced Semiconductor Assembly and Test (OSAT) companies to anticipate and address potential integration challenges.

• In-depth knowledge of Backend-of-the-Line (BEOL) processes, with an additional benefit on experience in photolithography techniques.

• Conversant with substrate and assembly packaging processes for RF-SiP (Radio Frequency-System in Package) applications.

• Formulate industry-leading design guidelines which involves a comprehensive approach that incorporates lessons from past failures and acknowledges manufacturing constraints.

• Create, conduct, and analyze Design of Experiments (DOE) for development activities, especially those that relate to bump/die sort quality, yield and impact on CPI.

• Interface with foundries and OSATs for direct project management of critical programs.

• Understand process details, SPC, Control plans, OCAPs, FMEAs, PCN, CARs and Quality metrics. Conduct audits, benchmarking and drive best practice methodologies to proactively prevent quality excursions as the technology ramps.

• Resolve quality, yield and manufacturing problems with structed methods of problem solving.

• Lead all aspects technology integration into products, perform technical risk assessment, launch mitigation plans and ensure yield and reliability metrics are met and are in line with product release schedules. 

• Team cross-functionally with, Design, Device process development, Packaging, FEA and global NPI teams to support technology readiness for new products

• Ideate, Sketch and Participate in value engineering and cost reduction plans along with Qualcomm Packaging and Sourcing teams.

• Ensure product readiness for ramp. Protect product integrity post ramp.

Qualifications:   

• Master’s Degree or equivalent in Mechanical / Materials / Chemical Engineering. PHD Preferred

• 10+ years of experience desired in electronics packaging in related environments, especially RF module industry

• At least 5 years direct experience in process engineering, product integration or quality management at tier 1 foundries, or assembly sub-contractors.

• Solid technical understanding of full range of Semiconductor packaging materials, material interactions, processes, dominant failure mechanisms and analytical techniques.

• Good knowledge of packaging industry standards (IPC, JEDEC, IEEE, ISO, ANSI).

• Understanding of package/product qualification and reliability methods and failure analysis is required.

• Familiarity with PCB design and layout tools preferred.

• Understanding of statistics, control methodology, FMEA, analytical trouble shooting in a factory environment is required.

• Excellent communication skills.

• Willingness to travel internationally, typically once per quarter.

Join our Actuarial Services team, where you will support in the provision of actuarial-related advice and services across our business units in Asia.

Responsibilities

• Quarterly reserve reviews and report writing
• Regular portfolio monitoring
• Data analytics
• Stress testing
• Yearly business planning
• Pricing projects whenever required
• Automation and streamlining of project workflows

Requirements

• Pursuing a degree in Actuarial Science, Computer Science, Engineering, Mathematics, Statistics, or any other related quantitative fields
• Internship experience in actuarial, risk management and/or finance roles in the general insurance industry will be an advantage
• Hands-on experience in Python and other programming languages
• Detail oriented, excellent problem-solving skills; comfortable with learning new concepts
• Excellent communication and interpersonal skills, ability to work as part of a team and comfortable with meeting new people
• Highly motivated, committed, and goal oriented

To apply, please submit your CV, (un)official transcript(s), and your internship availability period.

We represent a leading Taiwanese multinational, specializing in optoelectronic components and key electronic modules. Their R&D team in Singapore is dedicated to drive innovation in photonics, energy-efficient solutions, and smart technologies. As part of its expansion, our client is seeking talented professional to join them in an exciting new role.

Senior/Principal R&D Digital IC Design Engineer

Role overview:

·     Working on ASIC digital design, including RTL coding based on Verilog, simulation, RTL and gate-level verification, code coverage, test bench development, logic synthesis and design documentation.

Key Requirements:

·     Master/Degree in Electrical Engineering with 3years of ASIC design experience preferred. Candidates with more years of experience will be considered for senior roles.

·     Familiar with ASIC design flow, Cadence digital implementation & verification tools

·     Experience in RTL coding based on Verilog. Familiar with the digital simulation debugging environment

·     Familiar with UNIX/Linux environment and scripting

·     A team player with good communication skills

·     Able to work independently, flexible, and creative

·     Strong analytical and problem solving