Total 6 Information Technology job vacancies

Overview

Weare seeking an experienced and dynamic Head of NPI Engineering & Project Management to lead our New Product Introduction (NPI) and project management functions. This role is critical in driving seamless product industrialization, from concept through qualification to high-volume manufacturing (HVM) while ensuring operational excellence, customer satisfaction, and alignment with strategic business objectives.

The ideal candidate brings strong technical depth, proven leadership in complex manufacturing environments, and a track record of successfully delivering high-impact NPI programs.

Responsibilities:

Strategic Leadership

• Define and execute the NPI strategy aligned with overall business goals and growth plans
• Establish scalable NPI frameworks, governance models, and best practices across the organization
• Drive continuous improvement initiatives to enhance efficiency, speed-to-market, and quality

NPI & Program Management

• Lead end-to-end execution of NPI programs, ensuring delivery on time, within scope, and within budget
• Oversee project planning, milestone tracking, risk management, and stakeholder communication
• Ensure robust transition from NPI phase to high-volume manufacturing (HVM)

Engineering & Team Leadership

• Lead, mentor, and develop a high-performing NPI engineering and project management team
• Foster a culture of accountability, collaboration, and continuous learning
• Drive cross-functional alignment across engineering, manufacturing, supply chain, sales, and customer support

Customer & Stakeholder Management

• Act as the primary interface for key customers on NPI programs
• Build and maintain strong relationships with customers, suppliers, and strategic partners
• Communicate project status, risks, and achievements effectively to senior leadership and stakeholders

Operational Excellence

• Ensure successful product and process qualification in compliance with company and industry standards
• Implement data-driven decision-making using KPIs, metrics, and analytics
• Identify risks proactively and deploy mitigation strategies to minimize project impact

Commercial & Financial Oversight

• Support RFQ activities, including cost estimation, pricing strategy, and project planning
• Develop and manage NPI budgets, ensuring optimal resource allocation
• Monitor project financials and provide regular reporting to senior management

Requirements:

• Bachelor’s degree or higher in Mechanical Engineering, Electrical & Electronics Engineering, or a related field
• Minimum 10 years of experience in parts and assembly manufacturing, with strong exposure to NPI environments.
• At least 5 years in program/project management leadership roles
• Proven experience in semiconductor or high-tech contract manufacturing is highly preferred
• Strong leadership with the ability to inspire and manage cross-functional teams
• Excellent communication and stakeholder management skills across global and local environments
• Deep understanding of NPI processes, product development cycles, and manufacturing scale-up
• Proficiency in project management methodologies and tools (e.g., PMP, Agile, Stage-Gate)
• Strong analytical mindset with the ability to leverage data for decision-making
• Proactive problem-solver with a results-driven approach
• High energy, resilience, and a strong sense of ownership

Overview

Weare seeking an experienced and dynamic Head of NPI Engineering & Project Management to lead our New Product Introduction (NPI) and project management functions. This role is critical in driving seamless product industrialization, from concept through qualification to high-volume manufacturing (HVM) while ensuring operational excellence, customer satisfaction, and alignment with strategic business objectives.

The ideal candidate brings strong technical depth, proven leadership in complex manufacturing environments, and a track record of successfully delivering high-impact NPI programs.

Responsibilities:

Strategic Leadership

• Define and execute the NPI strategy aligned with overall business goals and growth plans
• Establish scalable NPI frameworks, governance models, and best practices across the organization
• Drive continuous improvement initiatives to enhance efficiency, speed-to-market, and quality

NPI & Program Management

• Lead end-to-end execution of NPI programs, ensuring delivery on time, within scope, and within budget
• Oversee project planning, milestone tracking, risk management, and stakeholder communication
• Ensure robust transition from NPI phase to high-volume manufacturing (HVM)

Engineering & Team Leadership

• Lead, mentor, and develop a high-performing NPI engineering and project management team
• Foster a culture of accountability, collaboration, and continuous learning
• Drive cross-functional alignment across engineering, manufacturing, supply chain, sales, and customer support

Customer & Stakeholder Management

• Act as the primary interface for key customers on NPI programs
• Build and maintain strong relationships with customers, suppliers, and strategic partners
• Communicate project status, risks, and achievements effectively to senior leadership and stakeholders

Operational Excellence

• Ensure successful product and process qualification in compliance with company and industry standards
• Implement data-driven decision-making using KPIs, metrics, and analytics
• Identify risks proactively and deploy mitigation strategies to minimize project impact

Commercial & Financial Oversight

• Support RFQ activities, including cost estimation, pricing strategy, and project planning
• Develop and manage NPI budgets, ensuring optimal resource allocation
• Monitor project financials and provide regular reporting to senior management

Requirements:

• Bachelor’s degree or higher in Mechanical Engineering, Electrical & Electronics Engineering, or a related field
• Minimum 10 years of experience in parts and assembly manufacturing, with strong exposure to NPI environments.
• At least 5 years in program/project management leadership roles
• Proven experience in semiconductor or high-tech contract manufacturing is highly preferred
• Strong leadership with the ability to inspire and manage cross-functional teams
• Excellent communication and stakeholder management skills across global and local environments
• Deep understanding of NPI processes, product development cycles, and manufacturing scale-up
• Proficiency in project management methodologies and tools (e.g., PMP, Agile, Stage-Gate)
• Strong analytical mindset with the ability to leverage data for decision-making
• Proactive problem-solver with a results-driven approach
• High energy, resilience, and a strong sense of ownership

Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement.  

Key responsibilities and duties include:  

Process Development:  

• Establish and improve Wafer level process conditions and technologies (wafer thinning, backside metal interconnect)  

• Upgrade process capabilities and reduce production costs  

• Establish and improve process management projects to deliver technology node requirements and scaling for next node.  

Equipment and Materials:  

• Evaluate and promote new equipment and materials to enhance process capabilities  

• Set up process parameters for a variety of semiconductor equipment  

• Evaluate, promote, and plan for new equipment and materials  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities  

Job Requirements: 

• Bachelor’s or advanced degree in Engineering or Science is required 

• Strong analytical, logical, and critical thinking skills 

• Effective communicator, able to collaborate across all levels 

• Growth mindset with a passion for continuous learning 

• Internship or experience in the semiconductor industry is a plus 

• Demonstrated leadership and a track record of impact are highly desirable 

• Interest in and knowledge of the semiconductor industry and Micron is preferred 

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred. 

• Experience with Visual Basic for automation and tool integration is preferred. 

Embody Micron’s core values: 

• People – Respect, develop, and empower others 

• Innovation – Drive continuous improvement and breakthrough thinking 

• Tenacity – Show grit and determination 

• Collaboration – Build trust and foster teamwork 

• Customer Focus – Deliver excellence and value  

What to Expect 
Micron is proud to be an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other protected factor. 

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement.  

Key responsibilities and duties include:  

Process Development:  

• Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.  

• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity  

• Establish and improve process management projects to deliver technology node requirements 
   

Equipment and Materials:  

• Evaluate and promote new equipment and materials to enhance process capabilities  

• Set up process parameters for a variety of semiconductor equipment  

• Evaluate, promote, and plan for new equipment and materials  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities  

Job Requirements: 

• Bachelor’s or advanced degree in Engineering or Science is required 

• Strong analytical, logical, and critical thinking skills 

• Effective communicator, able to collaborate across all levels 

• Growth mindset with a passion for continuous learning 

• Internship or experience in the semiconductor industry is a plus 

• Demonstrated leadership and a track record of impact are highly desirable 

• Interest in and knowledge of the semiconductor industry and Micron is preferred 

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred.

• Experience with Visual Basic for automation and tool integration is preferred. 

Embody Micron’s core values: 

• People – Respect, develop, and empower others 

• Innovation – Drive continuous improvement and breakthrough thinking 

• Tenacity – Show grit and determination 

• Collaboration – Build trust and foster teamwork 

• Customer Focus – Deliver excellence and value  

What to Expect 
Micron is proud to be an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other protected factor. 

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.  

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.  
 

Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.  

Key responsibilities and duties include:  

Process Development:  

• Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.  

• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity  

• Establish and improve process management projects to deliver technology node requirements  

Equipment and Materials:  

• Evaluate and promote new equipment and materials to enhance process capabilities  

• Set up process parameters for a variety of semiconductor equipment  

• Evaluate, promote, and plan for new equipment and materials  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities 

Requirements 

• B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields  

• 2 or more years of semiconductor process development or equipment evaluation in semiconductor, preferably in wafer bonding, die stacking and packaging field  

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics. 

• Experience with Visual Basic for automation and tool integration. 

• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control. 

• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding. 

• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability  

• Tenacity to work effectively under timelines and limited resources  

• Consistent track record to solve problems and address root causes  

Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.  

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.  

Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post-fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.  

Key responsibilities and duties include:  

Process Development:  

• Establish and improve Wafer level process conditions and technologies (wafer thinning, backside metal interconnect)  

• Upgrade process capabilities and reduce production costs  

• Establish and improve process management projects to deliver technology node requirements and scaling for next node.  

Equipment and Materials:  

• Evaluate and promote new equipment and materials to enhance process capabilities  

• Set up process parameters for a variety of semiconductor equipment  

• Evaluate, promote, and plan for new equipment and materials  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities  

Requirements: 

• B.S/M.S./Ph.D. (or equivalent education) in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields  

• 2 or more years of semiconductor process development, preferably in wafer bonding, plating, warpage control and packaging field  

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics. 

• Experience with Visual Basic for automation and tool integration. 

• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control. 

• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding. 

• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability  

• Tenacity to work effectively under timelines and limited resources  

• Consistent track record to solve problems and address root causes