Total 168 job vacancies in Singapore

Step into a career with ASM, where cutting edge technology meets collaborative culture. ​

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.  

Job's mission

As a Senior Engineer, Electrical Engineering at ASM, you will act as a technical lead for electrical systems within advanced semiconductor equipment. You will drive system-level design decisions, ensuring robust architecture, seamless integration, and high-performance delivery. By combining deep technical expertise with strong ownership, you will guide the development of complex systems from concept through production while influencing cross-functional engineering outcomes.

What you will be working on

• Lead the design and development of electrical systems and sub-assemblies, setting technical direction and ensuring alignment with product architecture
• Lead fabrication and test of electrical test structures (ex. MOS capacitors, MIM capacitors, FETs) for semiconductor logic and memory applications
• Own system-level integration, ensuring electrical, mechanical, and control elements work cohesively to meet performance, safety, and reliability targets
• Define and validate digital and analog I/O architectures, enabling flexible, customer-specific configurations
• Drive technical decision-making across new product development, capital projects, and system improvements
• Review and approve engineering changes, ensuring technical integrity, risk mitigation, and adherence to timelines
• Act as a key contributor in design reviews, providing expert guidance and ensuring readiness for production release
• Define and oversee system validation strategies, including hardware testing, instrumentation, and performance verification
• Analyze, understand and interpret electrical test data (ex. CV, IV, Dit) to guide process development and integration of ASM's products such as ALD films
• Evaluate feasibility of new concepts and technologies, solving complex system-level challenges with a structured and innovative approach
• Influence and collaborate with global cross-functional teams, acting as the electrical domain expert
• Mentor and guide junior engineers, elevating technical capability within the team
• Drive high-quality technical documentation, reporting standards, and stakeholder alignment

What we are looking for

• Master’s or PhD in Electrical and Electronics Engineering
• Minimum 5 years of experience in system engineering within semiconductor equipment manufacturing
• Strong expertise in electrical hardware design, system architecture, and integration (e.g., reactors, plasma sources, or similar systems)
• Proven ability to lead technical problem-solving and make system-level design decisions
• Proficiency in AutoCAD and data analysis tools such as JMP
• Hands-on experience in hardware testing, instrumentation, and system validation
• Ability to operate effectively in a fast-paced, global engineering environment
• Strong communication skills in English, with the ability to influence technical discussions

What sets you apart

• Experience acting as a technical lead or subject matter expert on complex engineering projects
• Strong understanding of semiconductor processes and equipment architecture
• Experience defining or improving system validation strategies and test methodologies
• Familiarity with data analysis or scripting tools (e.g., Python)
• Proven track record of driving cost reduction, reliability improvements, or product innovation
• Experience working across regions or with international engineering teams
• Proactive, ownership-driven mindset with the ability to influence without formal authority

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

About GlobalFoundries

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Introduction:

The Sr Director of Module Engineering will lead the module engineering organization in one of Singapore’s Fabs. This role is responsible for driving operational excellence, technology development, and cross-functional collaboration across all other departments. As a key member of the local leadership team, the individual will also serve as a strategic interface with global counterparts to ensure alignment with corporate objectives, technology roadmaps, and customer requirements.

Your Job:

Site Leadership & Strategy

• Lead and manage the engineering modules across the designated Fab, including process and equipment engineering.

• Develop and execute engineering strategies that support site performance goals and align with global foundry objectives.

• Represent the engineering function in local leadership forums and contribute to site-wide decision-making.

Technology & Operational Excellence

• Drive continuous improvement in yield, cycle time, cost, and equipment efficiency.

• Lead technology transfer and ramp-up activities in collaboration with global R&D and manufacturing teams.

• Ensure robust process control and reliability across all technology nodes.

Global Collaboration

• Act as a key liaison between the Singapore site and global engineering, R&D, and customer teams.

• Participate in global forums to influence technology direction, share best practices, and align strategic initiatives.

Talent Development & Organizational Leadership

• Build and develop a high-performing engineering team through effective hiring, mentoring, and succession planning.

• Foster a culture of innovation, accountability, and collaboration.

• Champion diversity, equity, and inclusion within the engineering organization.

Other Responsibilities: 

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

Required Qualifications:

Education & Experience

• Bachelor's, Master’s or PhD in Electrical Engineering, Materials Science, Physics, or related field.

• Minimum 12 years of progressive technical and managerial experience in the semiconductor industry, with demonstrated expertise across multiple process modules.

• Proven track record in leading engineering teams in a high-volume foundry or advanced semiconductor manufacturing environment.

Technical & Leadership Competencies

• Deep understanding of semiconductor process technologies (e.g., CMOS, FinFET, RF, analog/mixed-signal).

• Strong knowledge of equipment engineering, yield improvement methodologies, and statistical process control.

• Demonstrated ability to lead cross-functional teams and manage complex projects across geographies.

• Strategic thinker with strong business acumen and ability to translate technical goals into operational outcomes.

• Excellent communication and stakeholder management skills, including experience working with global teams and customers.

Cultural & Organizational Fit

• Comfortable operating in a matrixed, multicultural environment.

• Strong alignment with values of integrity, innovation, and operational excellence.

• Ability to lead through influence and build trust across diverse teams.

You are responsible for new equipment introduction, risk assessment, equipment set-up, release, PM, Calibration, lab audits and as well as continuous improvement activities such as equipment reliability improvement, cost reduction, and equipment usage optimization. Through this role, you will enhance your technical skills in equipment management and improvement, project management, and strengthen your engagement and network with vendors and global GEL organizations across Micron sites.

Responsibilities

-Support GEL Equipment and lab operations including Internal and External audits, ESD and PM, Calibration, equipment troubleshooting, Safety and Chemical controls.

- Oversees the installation, modification, upgrade and maintenance of Engineering equipment.

- Maintains current records on equipment manufacturers’ technical notices, upgrades and safety issues. Studies equipment performance and reliability. - -- Establishes programs and solutions for increasing uptime and for equipment problems that affect the engineering process.

-Provides technical support to the engineering equipment repair and process engineering organizations. Defines and writes preventative maintenance schedules.

- Collaborate with cross functional teams on equipment requirements, space planning, facilitation, purchase and installation of equipment.
- Equipment inventory controls and critical spare parts planning.

- Coordinate external vendors on training, repair, and preventive maintenance of equipment.
- Manage external vendors expectation, set and assess goals and achievements.
- Analyze and support stakeholders’ requirements and expectations.
- Foster closer collaboration amongst cross functional teams.
- Focus on customer needs and provide timely solutions.

Requirement

• Bachelor's degree in engineering with experience with ESD checks

• At least 1 year of experience in Semiconductor Equipment or Tools PM, calibration, and troubleshooting.

• Knowledge with Automated Optical Inspection and ANSYS Simulation

You are responsible for new equipment introduction, risk assessment, equipment set-up, release, PM, Calibration, lab audits and as well as continuous improvement activities such as equipment reliability improvement, cost reduction, and equipment usage optimization. Through this role, you will enhance your technical skills in equipment management and improvement, project management, and strengthen your engagement and network with vendors and global GEL organizations across Micron sites.

Responsibilities

-Support GEL Equipment and lab operations including Internal and External audits, ESD and PM, Calibration, equipment troubleshooting, Safety and Chemical controls.

- Oversees the installation, modification, upgrade and maintenance of Engineering equipment.

- Maintains current records on equipment manufacturers’ technical notices, upgrades and safety issues. Studies equipment performance and reliability. - -- Establishes programs and solutions for increasing uptime and for equipment problems that affect the engineering process.

-Provides technical support to the engineering equipment repair and process engineering organizations. Defines and writes preventative maintenance schedules.

- Collaborate with cross functional teams on equipment requirements, space planning, facilitation, purchase and installation of equipment.
- Equipment inventory controls and critical spare parts planning.

- Coordinate external vendors on training, repair, and preventive maintenance of equipment.
- Manage external vendors expectation, set and assess goals and achievements.
- Analyze and support stakeholders’ requirements and expectations.
- Foster closer collaboration amongst cross functional teams.
- Focus on customer needs and provide timely solutions.

Requirement

• Bachelor's degree in engineering with experience with ESD checks

• At least 1 year of experience in Semiconductor Equipment or Tools PM, calibration, and troubleshooting.

• Knowledge with Automated Optical Inspection and ANSYS Simulation

Introduction

Device development for feature rich CMOS technologies (CMOS, NVM, sensors)

Your Role

• Design, development and characterization of MOSFETs, non-volatile memory cells or CMOS-based sensors to meet performance and reliability requirements

• Design of device test structures and detailed characterization of devices

• Working with TCAD engineers to predict device split results

• Working with Modeling engineers to produce good device models

• Detailed analysis of electrical test data and characterization results

​Required Qualifications

• Master's with at least 3 years relevant device experience or PhD  

• Familiarity with layout and design rules 

• Experience in detailed electrical characterization of devices 

• Process Integration experience preferred 

Preferred Qualifications

• PhD or Masters in Electrical / Electronics Engineering or equivalent

• Field of specialization: Microelectronics

Other Essential Attributes

• Strong understanding of device and process physics

• Aptitude for optimization and innovation

• Ability to work in a multi-disciplinary team in a fast-paced environment

• Good communication and interpersonal skills

Step into a career with ASM, where cutting edge technology meets collaborative culture. ​

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.  

Job's mission

Join ASM’s Advanced Packaging team and lead the design and development of next-generation semiconductor process equipment. In this role, you will shape system architecture, drive automation strategies, and collaborate across functions to deliver innovative solutions. Your expertise will ensure projects meet the highest standards of safety, quality, and performance.

What you will be working on

• Lead design and development of semiconductor vacuum systems, including equipment selection, process controls, and automation integration.
• Develop and implement automation strategies using PLCs, SCADA, and related tools to optimize efficiency.
• Manage project timelines, budgets, and resources while ensuring compliance with safety and quality standards.
• Collaborate with cross-functional teams in manufacturing, operations, and quality to align on goals and deliverables.
• Provide technical support and troubleshooting for equipment and automation systems, driving root cause analysis and resolution.
• Own BOM release and maintenance, ensuring accurate documentation and reporting for stakeholders.
• Drive continuous improvement initiatives and stay current with industry trends and emerging technologies.
• Apply engineering principles and research data to create designs for semiconductor systems and products.
• Perform engineering calculations for structural, thermal, and fluid dynamics challenges.
• Create and revise CAD models and detailed drawings using Creo Parametric for components and assemblies.
• Prepare comprehensive design documentation for manufacturing and testing of prototypes and production products.

What we are looking for

• Bachelor's, Master’s or PhD in Mechanical Engineering or related field.
• Minimum 8 years of experience in semiconductor equipment design, development, and automation.
• Expertise in complex mechanical systems such as reactors, vacuum chambers, gas delivery systems, pneumatics, and cooling circuits.
• Strong analytical and problem-solving skills with ability to lead innovative design concepts.
• Experience with PLC programming and revision control tools such as Git.
• Ability to work independently and collaboratively in a team environment.

What sets you apart

• Experience with semiconductor capital equipment and metal deposition products.
• Knowledge of CE, NFPA, Semi S2-95, and other relevant standards for semiconductor manufacturing equipment.
• Familiarity with materials including metals, plastics, coatings, and finishes.
• Proficiency in Microsoft applications, CREO, and AutoCAD.
• Knowledge of ASME Y14.5 and/or ISO 1101:2017 geometric dimensioning and tolerancing.
• Strong communication skills to present design concepts effectively to peers and management.
• Ability to manage multiple priorities and meet aggressive deadlines while maintaining quality standards.

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

Step into a career with ASM, where cutting edge technology meets collaborative culture. ​

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.  

Job's mission

As a Principal Engineer, Electrical Engineering at ASM, you will act as a technical lead for electrical systems within advanced semiconductor equipment. You will drive system-level design decisions, ensuring robust architecture, seamless integration, and high-performance delivery. By combining deep technical expertise with strong ownership, you will guide the development of complex systems from concept through production while influencing cross-functional engineering outcomes.

What you will be working on

• Lead the design and development of electrical systems and sub-assemblies, setting technical direction and ensuring alignment with product architecture
• Lead fabrication and test of electrical test structures (ex. MOS capacitors, MIM capacitors, FETs) for semiconductor logic and memory applications
• Own system-level integration, ensuring electrical, mechanical, and control elements work cohesively to meet performance, safety, and reliability targets
• Define and validate digital and5 analog I/O architectures, enabling flexible, customer-specific configurations
• Drive technical decision-making across new product development, capital projects, and system improvements
• Review and approve engineering changes, ensuring technical integrity, risk mitigation, and adherence to timelines
• Act as a key contributor in design reviews, providing expert guidance and ensuring readiness for production release
• Define and oversee system validation strategies, including hardware testing, instrumentation, and performance verification
• Analyze, understand and interpret electrical test data (ex. CV, IV, Dit) to guide process development and integration of ASM's products such as ALD films
• Evaluate feasibility of new concepts and technologies, solving complex system-level challenges with a structured and innovative approach
• Influence and collaborate with global cross-functional teams, acting as the electrical domain expert
• Mentor and guide junior engineers, elevating technical capability within the team
• Drive high-quality technical documentation, reporting standards, and stakeholder alignment

What we are looking for

• Master’s or PhD in Electrical and Electronics Engineering
• Minimum 5 years of experience in system engineering within semiconductor equipment manufacturing
• Strong expertise in electrical hardware design, system architecture, and integration (e.g., reactors, plasma sources, or similar systems)
• Proven ability to lead technical problem-solving and make system-level design decisions
• Proficiency in AutoCAD and data analysis tools such as JMP
• Hands-on experience in hardware testing, instrumentation, and system validation
• Ability to operate effectively in a fast-paced, global engineering environment
• Strong communication skills in English, with the ability to influence technical discussions

What sets you apart

• Experience acting as a technical lead or subject matter expert on complex engineering projects
• Strong understanding of semiconductor processes and equipment architecture
• Experience defining or improving system validation strategies and test methodologies
• Familiarity with data analysis or scripting tools (e.g., Python)
• Proven track record of driving cost reduction, reliability improvements, or product innovation
• Experience working across regions or with international engineering teams
• Proactive, ownership-driven mindset with the ability to influence without formal authority

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

Step into a career with ASM, where cutting edge technology meets collaborative culture. ​

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.

Job's mission

As a Principal Engineer in Software Engineering, you will shape the software that directly powers ASM’s advanced packaging and hybrid bonding equipment. Your work will have immediate, visible impact on highly complex semiconductor systems, combining robotics, motion control, thermal systems, and process intelligence. In this role, you will lead software architecture, roadmap definition, and execution across multiple products while growing strong engineering teams and influencing global software strategy.

What you will be working on

• Define and own software development plans and roadmaps for advanced packaging solutions, delivering software across multiple hybrid bonding products in parallel.
• Lead end‑to‑end software development with a strong focus on first‑time‑right quality and robust release execution.
• Drive software architecture decisions that support long‑term business, scalability, and product evolution.
• Plan, manage, and execute multiple software baselines, ensuring on‑time delivery across complex development cycles.
• Collaborate closely with software quality teams to embed quality throughout the development lifecycle.
• Work cross‑functionally with process engineering, hardware engineering, and system integration teams to deliver tightly integrated equipment software.
• Partner with global software engineering leaders to align on software strategy, best practices, and technology direction.
• Measure, maintain, and continuously improve internal customer satisfaction.
• Build, mentor, and grow a strong team of software engineers, fostering technical excellence, ownership, and collaboration.
• Promote disciplined software baseline management, build management, and version control practices.

What we are looking for

• Bachelor’s or Master’s degree in Computer Science or a related field.
• Minimum 10 years of experience in software development and software baseline management.
• Exposure to advanced packaging process flows such as CoWoS, SoIC, or InFO.
• Strong hands‑on software development expertise in C++.
• Proven experience with customer‑oriented software baseline management and release planning.
• Solid background in modern software technologies and development practices.
• Demonstrated ability to drive software architecture aligned with long‑term business needs.
• Strong ownership mindset with proactive leadership and a customer‑oriented approach.
• Ability to define clear priorities, set ambitious yet realistic goals, and deliver results.
• Experience managing projects, schedules, activities, and resources effectively.
• Hands‑on experience with Jira, build management tools, and Git version control.

What sets you apart

• Experience in the semiconductor process equipment industry.
• Experience working in fast‑paced, customer‑driven, and rapidly evolving environments.
• Ability to handle multiple concurrent projects while meeting demanding timelines.
• Strong prioritization skills across complex and competing technical demands.

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

About our group:

Media new product launch is to provide technical solutions to new product qualification, product yield, quality and reliability through developing new process and metrology. The team also needs to work closely with media R&D group and drive design center to continue optimize media process in order to meet product electrical recording performance as well as mechanical, tribology, manufacturability. Internally, the team need to work with different functional groups to deliver new mag design in very dynamic and challenging environment. 

About the role - you will:

Reporting to the Engineering Director, the incumbent will:

• Develop on HAMR sputter process to improve media ADC and mechanical performance to meet new product timeline.
• Design of experiment to understand the process window/margin.
• Good understanding of recording physics.
• Work with cross functional team on new alloys/process related defect issues.
• Transfer new product process into mass production and continue improve process to meet customer requirement.
• Technical lead of sputter projects.

About you:

Key characteristics defining outstanding candidates:

• Good understanding on magnetic recording materials, process and thin film technology.
• Teamwork and self-motivated.
• Fast learning capability.
• Strong communication and technical leadership skills.
• Ability to drive technical innovation into rapid product solutions.
• Flexibility and excellent time and task management capabilities.

Your experience includes:

• Master or Ph.D degree in Material science, magnetic recording physics or related engineering disciplines.
• Knowledge and skills in any of these areas – Material science, HAMR knowledge, thin film sputter process.
• R&D in magnetic recording media process, including process DOE, magnetic characterization tools, and data analysis techniques are all skills that will be beneficial in this role.
• Proficient in English speaking and writing.

Step into a career with ASM, where cutting edge technology meets collaborative culture. ​

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.  

Job's mission

As a Senior Manufacturing Engineer, you’ll play a critical role in turning breakthrough designs into real-world manufacturing solutions. From concept to customer delivery, you’ll drive new product industrialization by working cross-functionally to optimize for quality, cost, and lead time. You’ll be a strategic partner to both Global Operations and our Business Units, influencing design, improving processes, and supporting the full product lifecycle.

What you will be working on

• Provide first line engineering support in resolving daily operation issues in semiconductor equipment manufacturing, through collaboration with a team of multidisciplined manufacturing engineers, manufacturing supervisors and technicians.
• Achieve daily targets on product delivery to global customers in alignment with manufacturing engineering strategies, production schedules, quality and safety standards.
• Design and develop cost-effective testing methods with innovations for systems and equipment throughout product development and manufacturing in meeting manufacturing efficiency and customer quality.
• Prepare test and diagnostic programs according to product requirements, refine detailed test specifications, develop detailed procedures.
• Provide holistic technical solutions for highly complex problems from the suppliers, contract manufacturing, and internal manufacturing by liaising with cross functional teams in GOPS and Business Units (BU).
• Perform systematic troubleshooting and root cause analysis of manufacturing issues and deviations, provide immediate containment actions, and pursue long term corrective solutions.
• Partner with cross functional teams in Global Operations (Manufacturing, Production Planning, Procurement, and Quality Engineering), organize and lead internal and external review meetings, ensuring alignment and progress with focus on manufacturing processes, cycle time, assembly sequence, and quality.
• Lead the execution of continuous improvement projects on quality, cost, capacity, and efficiency enhancement with cross functional teams in GOPS and BU.

What we are looking for

• Bachelor’s degree in Electrical/Electronic Engineering, Automation engineering or equivalent.
• Minimum 8 years of experience in a manufacturing or engineering environment
• Minimum 5 years of relevant engineering experience in semiconductor capital equipment industry.
• Hands-on experience in electrical testing and troubleshooting.
• Working knowledge of testing methodology, C#, Python, or other scripting languages.
• Proven track record of managing technical projects to completion while accomplishing objectives and influencing cross-functional teams
• Experience with control systems utilized in testing automation, serial communication protocols, TwinCAT PLC, Device Net, Ethercat, RS 485, RS 232, etc.
• Proficient in operational excellence tools such as FMEA, 8D, SPC, DMAIC, GR&R, and Six Sigma

What sets you apart

• Strong cross-functional communication and stakeholder engagement skills
• Experience in project management for multiple NPI programs
• Background in supplier development or contract manufacturing environments
• Exposure to manufacturing digitization or data-driven process improvement

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

About our group:

The team is responsible for Drive Backend Assembly processes, including monitoring, controlling, maintaining, and improving product performance. This role applies engineering principles—such as Six Sigma and Lean—together with strong skills in data analysis, problem‑solving, and solution implementation to achieve performance metrics aligned with company goals.

About the role - you will:

• Perform process setup and buyoff for both Drive Backend Assembly, ensuring that yield, cycle time, and quality outcomes meet defined targets.
• Support product ID label buyoff to ensure compliance with product specifications and standards.
• Monitor production yield to detect any excursions, conduct process mapping, implement immediate containment (stop bleeding), establish hypotheses, design experiments to identify root causes, propose corrective actions, and report findings to engineers. Escalate issues appropriately per PMP requirements.
• Conduct basic data queries and analysis to provide relevant information and insights for engineering teams.
• Ensure process sustainability by monitoring KPIVs/KPOVs and managing Fast Triggering systems to maintain stable and controlled operations.
• Collaborate closely with engineers to achieve aggressive goals while upholding high-quality standards.
• Lead or participate in continuous improvement projects aimed at enhancing production efficiency in a consistent and sustainable manner.
• Perform additional tasks and responsibilities as assigned to support team, department, and company Objectives and Key Results (OKRs).

About you:

• Diploma in Engineering and related disciplines.
• Able to perform effectively under pressure, meet deadlines, and maintain a positive and professional attitude.
• Enjoys taking on challenging assignments and demonstrates strong resilience and adaptability.
• Open‑minded with a consistently positive work attitude.
• Strong data querying and analytical capabilities.
• Proficient in English with strong verbal and written communication skills.

Your experience includes:

• Experience in the manufacturing process is preferable.
• Process setup, buyoff, process mapping, and control.
• Failure analysis experience is preferable.
• Strong verbal and written communication.

About Group:

We are a dynamic process team to provide sputter engineering support to hard disk media production with the objective of ensuring compliance and conformance to process procedures.

About the Role:

• Provide engineering support to production line by ensuring process flow, specification, procedure and documentation
• Monitor any variables within the process and make the adjustments when required
• Quick and effective diagnosis and troubleshooting of routine or minor problems
• Perform process buy-off after equipment preventive maintenance or breaks down
• Document routine manufacturing processes and report data for shift duty pass-down
• Conduct or assist the process engineer in carrying out experiments with the objectives of process improvement
• Continuous improvement on OEE
• Training and certification for MS and new EA personnel
• Assist in Audit preparation

About you:

• Self-motivated and positive working attitude.
• Team player with good problem-solving skill.
• Willing to work in clean room environment.
• Willing to work on 12hr (7.30pm to 7.45am) nightshift pattern

Your Experience Includes:

• Relevant experience in the manufacturing industry will be an added advantage
• Possess of Sputter knowledge will be an added advantage

Step into a career with ASM, where cutting edge technology meets collaborative culture. ​

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.  

Job's mission

As a Principal / Senior Engineer, Electrical Engineering at ASM, you will act as a technical lead for electrical systems within advanced semiconductor equipment. You will drive system-level design decisions, ensuring robust architecture, seamless integration, and high-performance delivery. By combining deep technical expertise with strong ownership, you will guide the development of complex systems from concept through production while influencing cross-functional engineering outcomes.

What you will be working on

• Lead the design and development of electrical systems and sub-assemblies, setting technical direction and ensuring alignment with product architecture
• Lead fabrication and test of electrical test structures (ex. MOS capacitors, MIM capacitors, FETs) for semiconductor logic and memory applications
• Own system-level integration, ensuring electrical, mechanical, and control elements work cohesively to meet performance, safety, and reliability targets
• Define and validate digital and analog I/O architectures, enabling flexible, customer-specific configurations
• Drive technical decision-making across new product development, capital projects, and system improvements
• Review and approve engineering changes, ensuring technical integrity, risk mitigation, and adherence to timelines
• Act as a key contributor in design reviews, providing expert guidance and ensuring readiness for production release
• Define and oversee system validation strategies, including hardware testing, instrumentation, and performance verification
• Analyze, understand and interpret electrical test data (ex. CV, IV, Dit) to guide process development and integration of ASM's products such as ALD films
• Evaluate feasibility of new concepts and technologies, solving complex system-level challenges with a structured and innovative approach
• Influence and collaborate with global cross-functional teams, acting as the electrical domain expert
• Mentor and guide junior engineers, elevating technical capability within the team
• Drive high-quality technical documentation, reporting standards, and stakeholder alignment

What we are looking for

• Master’s or PhD in Electrical and Electronics Engineering
• Minimum 5 years of experience in system engineering within semiconductor equipment manufacturing
• Strong expertise in electrical hardware design, system architecture, and integration (e.g., reactors, plasma sources, or similar systems)
• Proven ability to lead technical problem-solving and make system-level design decisions
• Proficiency in AutoCAD and data analysis tools such as JMP
• Hands-on experience in hardware testing, instrumentation, and system validation
• Ability to operate effectively in a fast-paced, global engineering environment
• Strong communication skills in English, with the ability to influence technical discussions

What sets you apart

• Experience acting as a technical lead or subject matter expert on complex engineering projects
• Strong understanding of semiconductor processes and equipment architecture
• Experience defining or improving system validation strategies and test methodologies
• Familiarity with data analysis or scripting tools (e.g., Python)
• Proven track record of driving cost reduction, reliability improvements, or product innovation
• Experience working across regions or with international engineering teams
• Proactive, ownership-driven mindset with the ability to influence without formal authority

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

About our group:

The team is responsible for Drive Backend Assembly processes, including monitoring, controlling, maintaining, and improving product performance. This role applies engineering principles—such as Six Sigma and Lean—together with strong skills in data analysis, problem solving, and solution implementation to achieve performance metrics aligned with company goals.

About the role - you will:

• Sustain critical backend manufacturing processes—monitor daily yield, Test time, scrap, and key process indicators.
• Use programming and scripting capabilities such as Python, C, or C++ and SQL for automated testing, control and scripting, data crunching.
• Perform structured root cause analysis (5 Why, Fishbone, DMAIC) to resolve process excursions and chronic issues.
• Develop and release Test Process Documentation, work instructions, PFMEA, and control plans aligned with Seagate’s quality system.
• Capability to analyze test data, perform failure analysis, and trace defects back to the root cause.
• Partner with equipment and automation teams to drive process equipment optimization, recipe refinement, and failure mode analysis/reduction.
• Collaborate closely with engineers to achieve aggressive goals while upholding high-quality standards.
• Lead or participate in continuous improvement projects aimed at enhancing production efficiency in a consistent and sustainable manner. 
• Perform additional tasks and responsibilities as assigned to support team, department, and company Objectives and Key Results (OKRs)

About you:

• Diploma in Engineering or a related discipline.
• Strong analytical and problem-solving skills. 
• Able to work well under pressure and meet deadlines. 
• Positive, adaptable, and open-minded team player.

Your experience includes:

• Experience in manufacturing process environments is preferred.
• Exposure to process setup, buyoff, process mapping, and process control. 
• Experience in failure analysis is preferred.
• Strong data querying, analytical, and troubleshooting capabilities. 
• Working knowledge of Python, C, C++, or SQL for automation, scripting, or data analysis would be an added advantage.
• Experience supporting documentation such as work instructions, PFMEA, or control plans would be beneficial for success in this position.

As Frontend Central Product Integration Engineering and transformative (CPIE) team at Micron Technology, Inc., you will be leading new initiatives to deliver pioneering process capability, best-in-class bits per wafer (Yield) with the highest quality and fastest speed through innovation and collaboration with multi-functional teams. Your primary focuses include but not limited to:

Initiate new data solutions and methodologies to:

• identify process, test, and design improvement opportunities, specialized in UE_ROW & all quality index, Front End-PTS integration, and high-value-bits (PG2+) yield;

• modeling, monitoring and aiming for tool performance benchmarking;

• Process equipment prognostics and process integration optimization;

• Identity test optimization opportunities for high product grade yield improvement.

• Collaborate with site Process & Equipment Engineering, Manufacturing(MFG), Product Integration Engineering (PIE) and Data Science (DS) team to establish feasibility of new initiatives, demonstrate business values, and prototype solution mock-ups;

• Partner with Global Quality (GQ), Product Engineering (PE), Central PEE(CPEE), Smart Mfg Artificial Intelligent (SMAI), Technology Development (TD), and Suppliers to deliver end to end solutions, implement BKM development and deployment to production.

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness,exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabledenhancements within one’s scope of work.

Collaboration

• Partner closely with multi-functional teams to ensure successful communication and collaboration for project implementation.

• Detail oriented with the ability to work independently

• Dependability and able to work effectively in multi-functional teams.

• Facilitate and lead activities in designing and optimizing current system, methods, tool, skill to be Best In industry.

• Manage priorities and enhancements to improve business processes and existing systems that are global in nature.

• Willing to work during non-standard hours when needed to provide support to engineering teams at any Micron site.

• Strong growth mindset and willing to continue to learn, unlearn, relearn.

Communication

• Effective communication skills in verbal/written.

• Self-motivated. Able to work independently with minimal supervision.

• Able to travel as required to support department and company objectives.

Requirement and Technical Competency:

• Experience in PIE, Test solution team, product engineering and circuit design engineering. Understanding of Process/Product Integration will be advantageous;

• In depth knowledge of processes, equipment and control system;

• Proficiency in data analytical tools such as Y3, JMP, Python to perform numerical experiment. Proficiency in Statistical/Machine Learning will be additional advantageous; 

• Proven track record to make decisions, multi-task, and solve problems and address root causes.

• Exhibit critical thinking to find opportunities.

• PhD/Masters/Bachelors with relevant course of study and experience

• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.

Technical Leadership & Strategy

• Set technical direction for CPIE initiatives in UE_ROW, quality indices, Frontend–PTS integration, and high‑value bits (PG2+) yield, aligned to business priorities and technology roadmaps.
• Architect new data solutions, methodologies, and frameworks to:
• Identify and prioritize yield, quality, and reliability improvement opportunities across process, test, and design
• Model, monitor, and benchmark tool performance and process capability at scale

• Enable equipment prognostics and advanced process integration optimization

• Define test and screening optimization strategies that materially improve product grade yield without quality escape

• Drive end‑to‑end problem solving on complex, cross‑module issues that cannot be addressed within a single function or site.

Cross‑Functional & Organizational Influence

• Partner deeply with Process & Equipment Engineering, Manufacturing (MFG), Product Integration Engineering (PIE), and Data Science (DS) teams to:

• Establish feasibility and technical soundness

• Quantify business impact

• Rapidly prototype and mature solutions

• Act as a technical integrator across Global Quality (GQ), Product Engineering (PE), Central PEE (CPEE), Smart Manufacturing AI (SMAI), Technology Development (TD), and suppliers, ensuring solutions are scalable, manufacturable, and production‑ready.

• Influence technical and strategic decisions beyond direct ownership, including across sites, nodes, and organizations.

Execution, Scale, and BKM Deployment

• Lead the development, validation, and global deployment of BKMs, ensuring sustained performance and learning‑rate acceleration.

• Balance long‑term architectural thinking with near‑term execution, driving measurable improvements in yield, quality, and cycle time.

• Anticipate risks and tradeoffs (technical, schedule, cost, quality) and provide clear decision frameworks for leadership and stakeholders.

• Support global engineering teams, including engagement across time zones and non‑standard hours when required.

Collaboration & Leadership Expectations

• Function as a go‑to expert and mentor within CPIE and the broader FE engineering community.

• Lead by influence rather than authority, enabling alignment across diverse technical disciplines.

• Champion continuous improvement in systems, methods, tools, and skill sets to keep Micron best‑in‑class.

• Demonstrate a strong growth mindset—continuously learning, unlearning, and evolving technical approaches.

Communication

• Communicate complex technical concepts clearly and concisely to both technical and executive audiences.

• Produce high‑quality written artifacts (technical proposals, design reviews, decision memos).

• Represent CPIE effectively in cross‑org reviews and executive forums.

• Willing to travel as needed to support global objectives.
  

  Requirements & Technical Competency

  • PhD, Master’s, or Bachelor’s degree in Engineering or related discipline.

  • 8+ years of semiconductor industry experience, with deep exposure to product integration, process engineering, test solutions, product engineering, or circuit design.

  • Recognized depth in semiconductor manufacturing processes, equipment, and control systems.

  • Strong proficiency in data analysis and modeling tools (e.g., Y3, JMP, Python).

  • Demonstrated application of statistical methods and/or machine learning to real manufacturing problems.

  • Proven track record of technical leadership, decision‑making, multi‑tasking, and root‑cause resolution on ambiguous problems.

Technical Leadership & Strategy

• Set technical direction for CPIE initiatives in UE_ROW, quality indices, Frontend–PTS integration, and high‑value bits (PG2+) yield, aligned to business priorities and technology roadmaps.

• Architect new data solutions, methodologies, and frameworks to:

  Identify and prioritize yield, quality, and reliability improvement opportunities across process, test, and design

  Model, monitor, and benchmark tool performance and process capability at scale

  Enable equipment prognostics and advanced process integration optimization

  Define test and screening optimization strategies that materially improve product grade yield without quality escape

• Drive end‑to‑end problem solving on complex, cross‑module issues that cannot be addressed within a single function or site.

Cross‑Functional & Organizational Influence

• Partner deeply with Process & Equipment Engineering, Manufacturing (MFG), Product Integration Engineering (PIE), and Data Science (DS) teams to:

• Establish feasibility and technical soundness

• Quantify business impact

• Rapidly prototype and mature solutions

• Act as a technical integrator across Global Quality (GQ), Product Engineering (PE), Central PEE (CPEE), Smart Manufacturing AI (SMAI), Technology Development (TD), and suppliers, ensuring solutions are scalable, manufacturable, and production‑ready.

• Influence technical and strategic decisions beyond direct ownership, including across sites, nodes, and organizations.

Execution, Scale, and BKM Deployment

• Lead the development, validation, and global deployment of BKMs, ensuring sustained performance and learning‑rate acceleration.

• Balance long‑term architectural thinking with near‑term execution, driving measurable improvements in yield, quality, and cycle time.

• Anticipate risks and tradeoffs (technical, schedule, cost, quality) and provide clear decision frameworks for leadership and stakeholders.

• Support global engineering teams, including engagement across time zones and non‑standard hours when required.

Collaboration & Leadership Expectations

• Function as a go‑to expert and mentor within CPIE and the broader FE engineering community.

• Lead by influence rather than authority, enabling alignment across diverse technical disciplines.

• Champion continuous improvement in systems, methods, tools, and skill sets to keep Micron best‑in‑class.

• Demonstrate a strong growth mindset—continuously learning, unlearning, and evolving technical approaches.

Communication

• Communicate complex technical concepts clearly and concisely to both technical and executive audiences.
• Produce high‑quality written artifacts (technical proposals, design reviews, decision memos).
• Represent CPIE effectively in cross‑org reviews and executive forums.
• Willing to travel as needed to support global objectives.

Requirements & Technical Competency

• PhD, Master’s, or Bachelor’s degree in Engineering or related discipline.

• 8+ years of semiconductor industry experience, with deep exposure to product integration, process engineering, test solutions, product engineering, or circuit design.

• Recognized depth in semiconductor manufacturing processes, equipment, and control systems.

• Strong proficiency in data analysis and modeling tools (e.g., Y3, JMP, Python).

• Demonstrated application of statistical methods and/or machine learning to real manufacturing problems.

• Proven track record of technical leadership, decision‑making, multi‑tasking, and root‑cause resolution on ambiguous problems.

Job's mission

As a Senior Process Engineer in Advanced Packaging, you will bring your PhD research experience into an industrial R&D environment, contributing to the development of semiconductor process technologies used in next-generation devices. Working closely with experienced engineers and scientists, you will translate scientific insight into scalable, manufacturable solutions. Your work will directly support ASM’s mission to enable the chips that power today’s most advanced technologies.

What you will be working on

• Contribute to the research, development, and optimization of semiconductor processes for Advanced Packaging, including thin-film deposition (ALD, PECVD, PVD, ECP) and surface preparation technologies.
• Design, execute, and analyze experiments using DOE-based approaches, supported by senior technical experts.
• Perform materials and process characterization to evaluate film quality, reliability, and performance.
• Analyze experimental data and clearly document results in technical reports and internal presentations.
• Collaborate with cross-functional teams across R&D, process engineering, and applications.
• Support troubleshooting of process or equipment issues in laboratory and pilot environments.
• Participate in technology reviews and contribute ideas to process improvement and innovation initiatives.
• Learn industry best practices for transitioning processes from development into customer and manufacturing environments.

What we are looking for

• PhD in Chemical Engineering, Materials Science, Physics, Mechanical Engineering, Electrical Engineering,
• Hands-on research experience with thin-film deposition processes such as ALD, CVD, PECVD, or PVD.
• Strong experimental background, including designing experiments and analyzing complex data sets.
• Solid problem-solving and analytical skills, with a structured approach to research challenges.
• Clear written and verbal communication skills, with the ability to explain technical concepts to diverse audiences.
• Curiosity, initiative, and motivation to apply academic research in an industrial setting.
• Strong understanding of electro/mechanical equipment and software systems

What sets you apart

• Research experience related to advanced packaging, interconnects, or semiconductor manufacturing
• Familiarity with statistical methods, DOE tools, or data modeling techniques.
• Experience with materials characterization methods such as SEM, TEM, XRD, or ellipsometry.
• Exposure to cross-disciplinary or collaborative research environments.
• Interest in long-term growth within semiconductor technology development and process engineering.

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

Inspect, diagnose, and troubleshoot mechanical, electrical, and electronic faults in vehicles.

Perform preventive maintenance, servicing, and repair work on engines, transmissions, braking systems, suspension systems, and other vehicle components.

Use diagnostic equipment and computerized testing tools to identify vehicle performance issues.

Conduct vehicle inspections and ensure compliance with safety and regulatory standards.

Repair or replace defective parts and components according to manufacturer specifications.

Assist in testing and evaluating vehicle performance after repairs and maintenance.

Maintain accurate service records, inspection reports, and repair documentation.

Interpret technical manuals, engineering drawings, and service bulletins to perform repair and maintenance tasks.

Support engineering teams in vehicle testing, product improvements, and technical investigations when required.

Ensure proper use of workshop tools, equipment, and safety procedures.

Coordinate with supervisors, engineers, and customers regarding technical issues and repair recommendations.

Keep up to date with new automotive technologies, diagnostic systems, hybrid vehicles, and electric vehicle (EV) developments

Job's mission

As a Principal Engineer, Electrical Engineering at ASM, you will act as a technical lead for electrical systems within advanced semiconductor equipment. You will drive system-level design decisions, ensuring robust architecture, seamless integration, and high-performance delivery. By combining deep technical expertise with strong ownership, you will guide the development of complex systems from concept through production while influencing cross-functional engineering outcomes.

What you will be working on

• Lead the design and development of electrical systems and sub-assemblies, setting technical direction and ensuring alignment with product architecture
• Lead fabrication and test of electrical test structures (ex. MOS capacitors, MIM capacitors, FETs) for semiconductor logic and memory applications
• Own system-level integration, ensuring electrical, mechanical, and control elements work cohesively to meet performance, safety, and reliability targets
• Define and validate digital and analog I/O architectures, enabling flexible, customer-specific configurations
• Drive technical decision-making across new product development, capital projects, and system improvements
• Review and approve engineering changes, ensuring technical integrity, risk mitigation, and adherence to timelines
• Act as a key contributor in design reviews, providing expert guidance and ensuring readiness for production release
• Define and oversee system validation strategies, including hardware testing, instrumentation, and performance verification
• Analyze, understand and interpret electrical test data (ex. CV, IV, Dit) to guide process development and integration of ASM's products such as ALD films
• Evaluate feasibility of new concepts and technologies, solving complex system-level challenges with a structured and innovative approach
• Influence and collaborate with global cross-functional teams, acting as the electrical domain expert
• Mentor and guide junior engineers, elevating technical capability within the team
• Drive high-quality technical documentation, reporting standards, and stakeholder alignment

What we are looking for

• Master’s or PhD in Electrical and Electronics Engineering
• Minimum 5 years of experience in system engineering within semiconductor equipment manufacturing
• Strong expertise in electrical hardware design, system architecture, and integration (e.g., reactors, plasma sources, or similar systems)
• Proven ability to lead technical problem-solving and make system-level design decisions
• Proficiency in AutoCAD and data analysis tools such as JMP
• Hands-on experience in hardware testing, instrumentation, and system validation
• Ability to operate effectively in a fast-paced, global engineering environment
• Strong communication skills in English, with the ability to influence technical discussions

What sets you apart

• Experience acting as a technical lead or subject matter expert on complex engineering projects
• Strong understanding of semiconductor processes and equipment architecture
• Experience defining or improving system validation strategies and test methodologies
• Familiarity with data analysis or scripting tools (e.g., Python)
• Proven track record of driving cost reduction, reliability improvements, or product innovation
• Experience working across regions or with international engineering teams
• Proactive, ownership-driven mindset with the ability to influence without formal authority

Job's mission

As a Senior Process Engineer at ASM, you will drive the development of high‑thermal‑conductivity thin films that enable next generation high‑performance computing (HPC) and advanced packaging. You’ll lead a team of experts working on advanced thermal films compatible with rapidly evolving demands of advanced packaging and heterogenous integration, leveraging ALD/PEALD, CVD/PECVD, and related technologies to turn forward looking roadmaps into manufacturable solutions. By translating demanding customer requirements into breakthrough materials and processes, you’ll help position ASM at the forefront of thermal management for heterogenous integration of advanced logic, foundry, and memory devices.

What you will be working on

• Contribute to research development areas focused on high thermal conductivity thin films for advanced packaging and HPC applications, fostering innovation, technical excellence, and collaboration
• Own the roadmap to develop thermal films or materials aligned to customer performance and integration requirements.
• Leverage ASM’s ALD/PEALD, CVD/PECVD, and surface preparation expertise to design, optimize, and qualify high thermal conductivity materials and stacks for use in advanced devices and packages.
• Drive high thermal conductivity thin film development, including process optimization for deposition rate, uniformity, materials properties, morphology and bondability.
• Define, influence, and drive new hardware requirements and development in close collaboration with hardware and software engineering teams to meet advanced on high thermal conductivity process specifications and integration schemes.
• Collaborate closely with customers, Account Technology Directors, Product Management, and Business Development to align on high thermal conductivity materials roadmaps with customer device and packaging strategies.
• Partner with corporate and global R&D organizations to deliver new materials, surface preparation schemes, and applications that support critical technology inflections in thermal management and advanced packaging.
• Ensure generation and protection of intellectual property and technical publications.
• Stay at the forefront of state‑of‑the‑art semiconductor processing and thermal management technologies, maintaining strong technical communication with industry peers and key customers.
• Communicate at a highly technical level with end customers to build trust in ASM’s ability to solve their most advanced thermal and device challenges.

What we are looking for

• Ph.D. degree in Physics, Physical Chemistry, Chemical Engineering, Materials Science, or a related field
• Minimum 10 years of experience in the semiconductor or semiconductor capital equipment industry
• Proven track record of developing and delivering new semiconductor process technologies to customers
• Strong working knowledge of semiconductor device physics and manufacturing processes
• Demonstrated credibility working with semiconductor fab managers, senior engineers, and executive stakeholders
• Ability to operate effectively in a fast-paced, results-oriented, and highly competitive environment
• Excellent communication skills in English; ability to collaborate in a global R&D environment
• Willingness to travel approximately 10–20%

What sets you apart

• Deep expertise in ALD/PEALD, CVD/PECVD, including RF and/or microwave based
• Experience developing high‑thermal‑conductivity materials
• Track record generating patents or publications in thin‑film or thermal‑materials innovation
• Strong reputation for building high-performance, collaborative engineering cultures
• Experience influencing product direction through process innovation, materials engineering, and hardware collaboration
• Recognized thought leadership through patents, publications, or industry contributions
• Ability to balance technical innovation, customer satisfaction, and business priorities

As a PDE Central Yield Enhancement (YE) Engineer within Package Development Engineering (PDE), you will own and execute yield learning and improvement activities across advanced package technologies during HBM and NCG New Product Introduction (NPI). Your scope includes yield monitoring, excursion response, and yield stabilization, with an emphasis on rapid learning, early risk identification, and scalable solutions. 

This role plays a key part in driving robust yield performance from first silicon through NPI ramp and early HVM, partnering closely with Process Integration (PI), MRDA, Process Engineering, Assembly/Test Manufacturing and Quality teams. You will act as a hands‑on yield owner for NPI builds, translating data into actionable insights, driving fast learning cycles, early risk detection, and leading disciplined yield recovery. 

Job Responsibilities 

Yield Loss Accounted For 

• Account for HBM NPI builds across PWF, Assembly, and test through defect breakdown and PFA submission to understand fail mode 

• Own and execute assigned Central YE responsibilities for HBM NPI program, work closely with PI to identify defects that is coming from their area to brainstorm for CIP 

• Learn NPI processes, phase gates, and yield best practices 

• Assist in maintaining yield dashboards and trackers. Support PI/PE/RDA in identifying and transforming processing data to account/ breakdown a yield loss 

Yield Deviation Control 

• Analyze and report on yield deviation issue and trigger action from PI, PE or RDA 

• Support block run and partial conversion build yield analysis to early detect any impact on yield 

• Work closely with PCS team to identify SPC or FDC charts to put into YLR dashboard for shift left monitoring 

Yield Improvement Opportunities 

• Brainstorm with staff from other departments for improvement opportunities and propose to PI 

• Design and implement new solutions, including hotspot analytics, to improve the effectiveness of the automated defense line system. 

• Utilize software tool like Auto-diagnostics to find yield improvement opportunities 

Integrating Artificial Intelligence 

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgement and complying with organizational standards and legal requirements 

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work 

Job Requirements 

• Bachelor's or Master's degree in Electrical/ Electronics Engineering/ Computer Engineering / Computer Science with 2 to 5 years of experience in semiconductor industry, specifically involving yield analysis, defect/root cause investigation, or data-driven process optimization in advanced memory (HBM, DRAM, NAND) or high-volume semiconductor packaging. 

• Proficiency in Python (e.g., Pandas, NumPy) and SQL for semiconductor manufacturing data analysis, with hands-on experience developing interactive dashboards and visual reports using tools (including Spotfire and Power BI/Tableau) to translate large manufacturing datasets into actionable yield and process improvement insights. 

• Demonstrated experience building automated reporting workflows, data pipelines, or process automation solutions using Python scripting or RPA tools within a semiconductor manufacturing environment, with the ability to drive cross-functional decisions across manufacturing, process integration, and engineering teams in the semiconductor industry. 

• Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and achieving business outcomes 

Embody Micron’s Core Values 

• People – Respect, develop, and empower others. 

• Innovation – Drive continuous improvement and breakthrough thinking. 

• Tenacity – Show grit and determination. 

• Collaboration – Build trust and foster teamwork. 

• Customer Focus – Deliver excellence and value 

As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating.

Responsibilities:

• Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects.

• Reliability Test Plan and Execution: Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution.

• DPM reduction: Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI’s Quality, Cost and Cycle Time

• Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration.

• Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products, which are key components in many modern technologies.

• Risk Management: The role requires communication with Product Managers/Leads to manage risks associated with DPM process conversions. This is crucial in ensuring that the conversions move at an appropriate pace, balancing the need for innovation with the need for stability and reliability.

• Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron’s competitive edge in the market.

• Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.

• Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.

• Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.

• Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.

Requirements

• Bachelors/Masters Electrical and Electronics Engineering Degree with 3 years of experience in the semiconductor industry. Product Engineering experience is preferred.

• Demonstrating Strong Leadership Skills and Technical Skills, especially in problem solving with root cause understanding and solution space through in depth circuit analysis.

• Good knowledge of statistics and data analysis tools and scripting.

• Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).

• Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.

• Strong sense of responsibility and accountability towards assigned role with professional work ethic.

• Excellent communication and presentation skills.

• Passionate about people leadership, with a drive toward ongoing learning and development in this area.

• Work on site in Singapore with international travel to US, Taiwan and Japan.

1) Carry out production, packaging and machine operation duties

2) Ensuring the smooth and efficient running of machines with target

3) Feed raw material or parts to machines

4) Inspect parts with precision and measuring tools

5) Keep records of approved and defective units or final products

6) Maintain activity logs

7) Maintain and clean machines periodically

8) Follow established safety rules and regulations

9) Perform any other assignments assign by HOD

1) Carry out production, packaging and machine operation duties

2) Ensuring the smooth and efficient running of machines with target

3) Feed raw material or parts to machines

4) Inspect parts with precision and measuring tools

5) Keep records of approved and defective units or final products

6) Maintain activity logs

7) Maintain and clean machines periodically

8) Follow established safety rules and regulations

9) Perform any other assignments assign by HOD