Total 13,522 job vacancies in Singapore

Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement.  

Key responsibilities and duties include:  

Recipe Development and Optimization:  

• Develop and optimize metrology recipes for various semiconductor processes  

• Ensure that the recipes are accurate and efficient for production needs  

• Develop and execute strategies for process monitoring, sampling, and continuous improvement (CIP)  

Inspection and Characterization:  

• Establish inspection methodologies and best-known methods (BKM) for metrology processes  

• Perform in-line characterization and validation of metrology recipes  

Data Analysis and Reporting:  

• Utilize data analysis tools like Power BI to summarize and report on metrology recipe status and project progress  

• Continuously analyze data to identify improvement opportunities and ensure process efficiency  
   

Quality and Performance Indicators:  

• Own and manage metrology tools, ensuring they meet performance indicators and quality standards  

• Drive the defense line readiness and set up control plans, OCAP (Out of Control Action Plans), and SPC (Statistical Process Control) charts  

Collaboration and Coordination:  

• Engage in early involvement with Advanced Packaging Technology Development (APTD) to ensure seamless integration of new technologies  

• Work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

Job Requirements: 

• Bachelor’s or advanced degree in Engineering or Science is required 

• Strong analytical, logical, and critical thinking skills 

• Effective communicator, able to collaborate across all levels 

• Growth mindset with a passion for continuous learning 

• Internship or experience in the semiconductor industry is a plus 

• Demonstrated leadership and a track record of impact are highly desirable 

• Interest in and knowledge of the semiconductor industry and Micron is preferred 

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred.

• Experience with Visual Basic for automation and tool integration is preferred. 

Embody Micron’s core values: 

• People – Respect, develop, and empower others 

• Innovation – Drive continuous improvement and breakthrough thinking 

• Tenacity – Show grit and determination 

• Collaboration – Build trust and foster teamwork 

• Customer Focus – Deliver excellence and value  

What to Expect 
Micron is proud to be an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other protected factor. 

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement.  

Job Summary 

The Package Health Engineer will contribute to the development and execution of package health monitoring, simulation, and characterization activities. This role involves hands-on engineering work in DFT, data analysis, and reliability testing to ensure robust packaging solutions. 

Key Responsibilities 

• Develop and implement DFT strategies for advanced packaging. 

• Conduct simulations for mechanical, thermal, and electrical performance. 

• Perform electrical and mechanical characterization of packages. 

• Analyze test and field data to identify early indicators of package degradation. 

• Collaborate with data scientists to build predictive models for package health. 

• Support root cause analysis and corrective actions for reliability issues. 

Job Requirements: 

• Bachelor’s or advanced degree in Engineering or Science is required 

• Strong analytical, logical, and critical thinking skills 

• Effective communicator, able to collaborate across all levels 

• Growth mindset with a passion for continuous learning 

• Internship or experience in the semiconductor industry is a plus 

• Demonstrated leadership and a track record of impact are highly desirable 

• Interest in and knowledge of the semiconductor industry and Micron is preferred 

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred. 

• Experience with Visual Basic for automation and tool integration is preferred. 

Embody Micron’s core values: 

• People – Respect, develop, and empower others 

• Innovation – Drive continuous improvement and breakthrough thinking 

• Tenacity – Show grit and determination 

• Collaboration – Build trust and foster teamwork 

• Customer Focus – Deliver excellence and value  

What to Expect 
Micron is proud to be an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other protected factor.

Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.  

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.  
 

Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.  

Key responsibilities and duties include:  

Process Development:  

• Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.  

• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity  

• Establish and improve process management projects to deliver technology node requirements  

Equipment and Materials:  

• Evaluate and promote new equipment and materials to enhance process capabilities  

• Set up process parameters for a variety of semiconductor equipment  

• Evaluate, promote, and plan for new equipment and materials  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities 

Requirements 

• B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields  

• 2 or more years of semiconductor process development or equipment evaluation in semiconductor, preferably in wafer bonding, die stacking and packaging field  

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics. 

• Experience with Visual Basic for automation and tool integration. 

• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control. 

• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding. 

• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability  

• Tenacity to work effectively under timelines and limited resources  

• Consistent track record to solve problems and address root causes  

Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.  

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.  

We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team! 

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will also be required to identify, diagnose, and propose yield related breakthroughs. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.  

Key responsibilities and duties include:   

Technology Development:  

• Develop and enable advanced package technology for various post-fab wafer finish and assembly processes  

• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity  

• Integrate semiconductors while partnering with process and product engineering teams  

Yield Improvement:  

• Achieve and improve yields through silicon package integration innovation, not limited to layout/design or process margin improvements  

• Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes  

• Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the PWF Engineering, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities  

Requirements  

• B.S/M.S./Ph.D. (or equivalent education) in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material, or other related technical fields  

• 2 or more years of semiconductor process integration experience, preferably with know-how to develop and enable advanced package technology for post-fab wafer finish and assembly processes 

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics. 

• Experience with Visual Basic for automation and tool integration. 

• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control. 

• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding. 

• Strong understanding of process flows, process interactions, and ability to integrate semiconductors while partnering with process and product engineering team  

• Ability to resolve complex issues through root-cause or model-based problem solving  

• Tenacity to work effectively under timelines and limited resources  

• Consistent track record to solve problems and address root causes  

Job Summary 

The Package Health Manager/Senior Manager will lead a team of engineers focused on developing and implementing solutions for package health monitoring, simulation, and characterization. This role ensures alignment with product requirements and supports the deployment of scalable engineering and data science solutions. 

Key Responsibilities 

• Manage engineering teams responsible for package health monitoring and diagnostics. 

• Drive implementation of DFT methodologies and test coverage strategies. 

• Lead simulation studies for mechanical stress, thermal behavior, and electrical performance. 

• Coordinate development of engineering solutions for failure detection and prevention. 

• Collaborate with IT and data science teams to deploy analytics dashboards and models. 

• Support qualification and reliability testing for new packaging technologies. 

Qualifications 

• Master’s or Bachelor’s degree in Electrical Engineering, Materials Science or related field. 

• 7+ years of experience in semiconductor packaging, test, or reliability engineering (complex products preferred). 

• Experience defining test architectures, coverage, and managing test/probe yield. 

• Experience in package simulation and characterization (mechanical, thermal, electrical). 

• Strong knowledge of DRAM or ASIC product testing, test architecture, and packaging fail modes. 

• Strong knowledge of semiconductor packaging process, material interaction and properties. 

• Experience managing technical teams and cross-functional projects. 

• Knowledge of simulation tools and data analytics platforms. 

Additional/Preferred Qualifications 

• Familiarity with AI/ML applications in manufacturing or reliability. 

• Experience with package characterization techniques and standards. 

• Proven problem-solving and multitasking skills. 

• Strong communication and stakeholder management skills. 

Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement.  

Key responsibilities and duties include:  

Process Development:  

• Establish and improve Wafer level process conditions and technologies (wafer thinning, backside metal interconnect)  

• Upgrade process capabilities and reduce production costs  

• Establish and improve process management projects to deliver technology node requirements and scaling for next node.  

Equipment and Materials:  

• Evaluate and promote new equipment and materials to enhance process capabilities  

• Set up process parameters for a variety of semiconductor equipment  

• Evaluate, promote, and plan for new equipment and materials  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities  

Job Requirements: 

• Bachelor’s or advanced degree in Engineering or Science is required 

• Strong analytical, logical, and critical thinking skills 

• Effective communicator, able to collaborate across all levels 

• Growth mindset with a passion for continuous learning 

• Internship or experience in the semiconductor industry is a plus 

• Demonstrated leadership and a track record of impact are highly desirable 

• Interest in and knowledge of the semiconductor industry and Micron is preferred 

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred. 

• Experience with Visual Basic for automation and tool integration is preferred. 

Embody Micron’s core values: 

• People – Respect, develop, and empower others 

• Innovation – Drive continuous improvement and breakthrough thinking 

• Tenacity – Show grit and determination 

• Collaboration – Build trust and foster teamwork 

• Customer Focus – Deliver excellence and value  

What to Expect 
Micron is proud to be an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other protected factor. 

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement.  

Key responsibilities and duties include:  

Process Development:  

• Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.  

• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity  

• Establish and improve process management projects to deliver technology node requirements 
   

Equipment and Materials:  

• Evaluate and promote new equipment and materials to enhance process capabilities  

• Set up process parameters for a variety of semiconductor equipment  

• Evaluate, promote, and plan for new equipment and materials  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities  

Job Requirements: 

• Bachelor’s or advanced degree in Engineering or Science is required 

• Strong analytical, logical, and critical thinking skills 

• Effective communicator, able to collaborate across all levels 

• Growth mindset with a passion for continuous learning 

• Internship or experience in the semiconductor industry is a plus 

• Demonstrated leadership and a track record of impact are highly desirable 

• Interest in and knowledge of the semiconductor industry and Micron is preferred 

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred.

• Experience with Visual Basic for automation and tool integration is preferred. 

Embody Micron’s core values: 

• People – Respect, develop, and empower others 

• Innovation – Drive continuous improvement and breakthrough thinking 

• Tenacity – Show grit and determination 

• Collaboration – Build trust and foster teamwork 

• Customer Focus – Deliver excellence and value  

What to Expect 
Micron is proud to be an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other protected factor. 

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement.  

Key responsibilities and duties include:   

Technology Development:  

• Develop and enable advanced package technology for various post-fab wafer finish and assembly processes  

• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity  

• Integrate semiconductors while partnering with process and product engineering teams  

Yield Improvement:  

• Achieve and improve yields through silicon package integration innovation, not limited to layout/design or process margin improvements  

• Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes  

• Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the PWF Engineering, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities  

Job Requirements: 

• Bachelor’s or advanced degree in Engineering or Science is required 

• Strong analytical, logical, and critical thinking skills 

• Effective communicator, able to collaborate across all levels 

• Growth mindset with a passion for continuous learning 

• Internship or experience in the semiconductor industry is a plus 

• Demonstrated leadership and a track record of impact are highly desirable 

• Interest in and knowledge of the semiconductor industry and Micron is preferred 

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred.

• Experience with Visual Basic for automation and tool integration is preferred.

Embody Micron’s core values: 

• People – Respect, develop, and empower others 

• Innovation – Drive continuous improvement and breakthrough thinking 

• Tenacity – Show grit and determination 

• Collaboration – Build trust and foster teamwork 

• Customer Focus – Deliver excellence and value  

What to Expect 
Micron is proud to be an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other protected factor. 

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement.  

Key responsibilities and duties include:  

Equipment Development:  

• Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking  

• Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity  

• Establish and improve equipment management projects to deliver technode requirements  

Equipment Strategy:  

• Evaluate and promote new equipment and materials to enhance process capabilities  

• Establish hardware strategic roadmaps for 5+ years in post probe wafer and die processing  

• Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron’s products. cost, availability, and improve hardware and process capability  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

Job Requirements: 

• Bachelor’s or advanced degree in Engineering or Science is required 

• Strong analytical, logical, and critical thinking skills 

• Effective communicator, able to collaborate across all levels 

• Growth mindset with a passion for continuous learning 

• Internship or experience in the semiconductor industry is a plus 

• Demonstrated leadership and a track record of impact are highly desirable 

• Interest in and knowledge of the semiconductor industry and Micron is preferred 

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred.  

• Experience with Visual Basic for automation and tool integration is preferred. 

Embody Micron’s core values: 

• People – Respect, develop, and empower others 

• Innovation – Drive continuous improvement and breakthrough thinking 

• Tenacity – Show grit and determination 

• Collaboration – Build trust and foster teamwork 

• Customer Focus – Deliver excellence and value  

What to Expect 
Micron is proud to be an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other protected factor. 

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.  

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.  

We are looking for an Advanced Packaging Metrology-RDA Engineer to join our Advanced Packaging Technology Development (APTD) team! 

Your responsibilities include but are not limited to developing and enabling innovative inspection and metrology techniques to enable advanced packaging technologies. You will also be required to identify, diagnose, and propose yield related breakthroughs. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new metrology and RDA technologies for solutions that drive the future. Additional responsibilities include establishing equipment evaluation and long-range strategy to enable advanced packaging technology roadmap.  

Key responsibilities and duties include:  

Recipe Development and Optimization:  

• Develop and optimize metrology recipes for various semiconductor processes  

• Ensure that the recipes are accurate and efficient for production needs  

• Develop and execute strategies for process monitoring, sampling, and continuous improvement (CIP)  

Inspection and Characterization:  

• Establish inspection methodologies and best-known methods (BKM) for metrology processes  

• Perform in-line characterization and validation of metrology recipes  

Data Analysis and Reporting:  

• Utilize data analysis tools like Power BI to summarize and report on metrology recipe status and project progress  

• Continuously analyze data to identify improvement opportunities and ensure process efficiency  

Quality and Performance Indicators:  

• Own and manage metrology tools, ensuring they meet performance indicators and quality standards  

• Drive the defense line readiness and set up control plans, OCAP (Out of Control Action Plans), and SPC (Statistical Process Control) charts  

Collaboration and Coordination:  

• Engage in early involvement with Advanced Packaging Technology Development (APTD) to ensure seamless integration of new technologies  

• Work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

Requirements 

• B.S/M.S./Ph.D. (or equivalent education) in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, or other related technical fields  

• 2 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field  

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics. 

• Experience with Visual Basic for automation and tool integration. 

• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control. 

• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding. 

• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability  

• Hands on experience with wafer/assembly tools or metrology/RDA systems  

• Tenacity to work effectively under timelines and limited resources  

• Consistent track record to solve problems and address root causes 

Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.  

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.  

Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post-fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.  

Key responsibilities and duties include:  

Process Development:  

• Establish and improve Wafer level process conditions and technologies (wafer thinning, backside metal interconnect)  

• Upgrade process capabilities and reduce production costs  

• Establish and improve process management projects to deliver technology node requirements and scaling for next node.  

Equipment and Materials:  

• Evaluate and promote new equipment and materials to enhance process capabilities  

• Set up process parameters for a variety of semiconductor equipment  

• Evaluate, promote, and plan for new equipment and materials  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities  

Requirements: 

• B.S/M.S./Ph.D. (or equivalent education) in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields  

• 2 or more years of semiconductor process development, preferably in wafer bonding, plating, warpage control and packaging field  

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics. 

• Experience with Visual Basic for automation and tool integration. 

• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control. 

• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding. 

• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability  

• Tenacity to work effectively under timelines and limited resources  

• Consistent track record to solve problems and address root causes 

As an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development (APTD), your responsibilities include but are not limited to providing package development characterization and failure analysis support for development test vehicles, qualifications, customer returns, new product introduction, and general test failures. You are the domain expert on advanced packaging characterization methodology and is responsible for establishing relevant analysis methods needed to support technology development. You will also have a thorough understanding of the product package assembly and process flow, to work with Process Integration, Process Development, and Product Engineering groups ensuring failures are classified and root cause fixes implemented.

Responsibilities and Tasks

Conduct Electrical Characterization

• Understand PFA techniques available for de-processing failures

• Understand assembly and test process

• Perform electrical verification to confirm failures

• Establish best known method for de-processing package

Provide Data Analysis

• Understand backend test flows, qualification methodologies and be able to pull relevant information

Communicate with Internal/External Groups

• Document failure analysis techniques used to isolate failure for other groups

• Quick, responsive analysis and feedback of PFA results to Product, Process Integration, Reliability, Assembly, RMA, and QRA

• Ensure the PFA lab understands best method to obtain results and ensure lab is ready for analysis of new designs

Provide Technical Expertise

• Conduct TMO training and FA certification

• Serve as technical SME and mentor, contributing to the growth of technical capabilities within the team and fostering a culture of continuous learning.

• Participate actively in technical events such as conferences, workshops and forums to share knowledge and BKM across the network.

• Engage industry experts and vendors on cutting-edge FA tools and techniques required for Advanced Packaging development roadmap.

Maintain Equipment

• Coordinate calibrations (external to Micron)

• Procure parts as needed

• Coordinate host vendors to support equipment repair

Manage Laboratory

• Consistently upholds and promotes Micron’s safety standards, ensuring all activities are conducted in a safe and compliant manner.

• Manage laboratory to comply with TS, ISO14001 and OHSAS requirements.

• To manage the exhaust and scrubber systems of the FA Lab.

• To maintain records and procedures as per Micron GOPs

Education and Experience

• PhD, Master’s, or Bachelor’s degree in Materials Science, Chemical Engineering, Electrical/Electronics Engineering or related discipline. 

• 4+ years of experience in the semiconductor process, preferably in R&D or technology development or failure analysis field, with strong expertise in failure analysis methodologies and techniques.

• Hands-on proficiency with key analytical tools and methods, including: SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, Ion Milling, delayering, and decapsulation techniques.

• Strong communication skills with the ability to collaborate effectively across internal teams and external partners.

• A mindset that emphasizes customer focus, continuous improvement, and striving for excellence.

  Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

Company Overview

Our client is a well-established FMCG food distributor in Singapore, specialising in Indian and Pakistani products. They are expanding digital capabilities to grow online sales and enhance brand visibility through e-commerce and online marketplaces.

Job Summary

Manage and grow the company’s e-commerce platforms and digital marketing efforts to drive online sales growth, improve customer experience, and strengthen brand presence in a fast-evolving FMCG environment.

Responsibilities

E-Commerce & Marketplace Management

• Manage daily operations of e-commerce platforms and online marketplaces such as Shopee, Lazada, and RedMart to ensure seamless sales processes
• Create and maintain accurate product listings, pricing, and descriptions to enhance product appeal and consistency across channels
• Monitor inventory levels and coordinate with warehouse and operations teams to maintain product availability
• Analyze product sales data and forecast short- and mid-term sales to identify trends and growth opportunities

Digital Marketing & Campaigns

• Plan and execute online promotions, campaigns, and social media activities to increase brand visibility and sales
• Support digital marketing initiatives including Facebook Ads and Google Ads to optimize campaign effectiveness
• Monitor campaign performance and adjust strategies to improve sales outcomes

Sales Analysis & Reporting

• Track and analyze online sales performance, website traffic, and customer trends to inform business decisions
• Identify opportunities to increase online revenue and improve product visibility
• Prepare sales reports and basic forecasts for management review

Customer Experience

• Ensure a smooth and positive online shopping experience for customers
• Respond promptly and professionally to customer enquiries and feedback to maintain high satisfaction levels

Partnership & Platform Coordination

• Collaborate with online marketplaces and platform partners to support initiatives expanding the company’s digital reach
• Assist in developing strategies to enhance the company’s online presence

Preferred competencies and qualifications

• Degree in Business, Marketing, E-Commerce, or related discipline
• 1–3 years of experience in e-commerce, digital marketing, or online marketplace management
• Proven experience (1-2 Years) in e-commerce management, digital marketing, or online marketplace management platform. Prior Experience in SAP would be an added advantage.
• Strong understanding of digital marketing, SEO, and social media with a focus on local trends
• Experience with Facebook Ads and Google Ads is an added advantage
• Familiarity with Shopee, Lazada, RedMart, Amazon, or other e-commerce platforms
• Proficiency in Microsoft Office tools, especially Excel (VLOOKUP, PivotTable)
• Strong analytical, communication, and organizational skills
• Ability to work collaboratively in a fast-paced environment
• Detail-oriented with strong organizational skills

Job Description

• Supervise cleaning teams to ensure compliance with SOPs and service standards.

• Monitor daily operations and conduct site inspections with clients (e.g. CAG); follow up on cleaning gaps.

• Plan work schedules and deploy manpower efficiently.

• Review cleaning job reports and prepare information for monthly meetings.

• Compile basic operational data and propose improvements to work processes.

• Conduct daily roll calls and team briefings.

• Manage staff performance and provide feedback for improvement.

• Handle feedback, investigations, and incident report submissions.

• Ensure operational KPIs are met.

• Perform other reasonable ad-hoc operational duties as assigned.

Job Requirements

• Minimum 3 years of relevant working experience in cleaning operations or a related field.

• Able to work at East location(s).

• Working Hours: Monday to Friday, with alternate weekend duties.

• Good communication and basic supervisory skills.

Remuneration

• Salary: SGD 3,400 – 3,800, commensurate with experience.

It presents your catering company as a leader in authentic Indian cuisine in Singapore, outlines the responsibilities of coordinating logistics and communication across teams, and specifies the qualifications you’re looking for in candidates. It also highlights the benefits of joining your team, such as career growth opportunities and a supportive work environment.

Role:
M&E Supervisor (Construction / Up to $4500)

• Working Days: 5 Days A Week (Monday – Friday), 8.30am to 5.30pm, Saturday may need to work half day depends on project (Can claim OT)
• Office at (City Hall), Working at Seletar
• Salary: $3300 to $4500

Requirements

Diploma/Degree in Mechanical / Electrical Engineering

Minimum 3 years relevant experience in M&E Supervision (preferably in Data centre, industrial or commercial projects).

Strong technical knowledge of M&E systems, codes and construction practices.

Hands-on experience in site supervision, coordination and inspection processes.

Roles & Responsibilities

Attend to all daily sub-contractors meeting to discuss daily M&E issues to meet the project target schedule.

Check the site progress and safety compliance of the subcontractors and report the findings to the immediate superior and safety officer.

Check the subcontractors’ works are done accordance to the approved drawings / details and take remedial actions for non-conformance.

Equipped with the knowledge to conduct daily activities inspections with the project RE or RTO and take actions to clear their comments to ensure that the works are approved for commencement.

Keep proper records of the inspection forms for future reference and submit as evidence for legal issue arising from unforeseen future defects.

Show added confidence when dealing with general workers or sub-contractors and peers, when in doubt to always seek consultation with senior site staff and to understand contractors’ contractual obligation and practice mutual respect at all levels.

Strive to achieve fast and efficient approval for all assignments and always be vigilant with keen observation to put into practice BCA good practice in all aspects of work on site.

Participate in assisting the Environmental Health Safety program set by the PM and WSHO that will contribute to a safe and clean site.

Make effort to upgrade oneself to meet/exceed present standards through attendance of construction courses by BCA or equivalent institutions and study on cost saving methods that are feasible for site usage.

Able to accept additional work that form part of the project team’s own work activities which will assist the in-cost saving.

Provide Guidance to new / fresh M&E supervisor that join the company to ensure seamless integration to the team without affecting the site progress.

✅ Wee Yuan Huan

✅ Reg No: R21100383

✅ The Supreme HR Advisory Pte Ltd

✅ EA No: 14C7279

Product area

Behind everything our users see online is the architecture built by the Technical Infrastructure team to keep it running. From developing and maintaining our data centers to building the next generation of Google platforms, we make Google's product portfolio possible. We're proud to be our engineers' engineers and love voiding warranties by taking things apart so we can rebuild them. We keep our networks up and running, ensuring our users have the best and fastest experience possible.

Job description

A problem isn’t truly solved until it’s solved for all. That’s why Googlers build products that help create opportunities for everyone, whether down the street or across the globe. As a Technical Program Manager at Google, you’ll use your technical expertise to lead complex, multi-disciplinary projects from start to finish. You’ll work with stakeholders to plan requirements, identify risks, manage project schedules, and communicate clearly with cross-functional partners across the company. You're equally comfortable explaining your team's analyses and recommendations to executives as you are discussing the technical tradeoffs in product development with engineers. 

Additional job description

The Global Submarine Networks (GSN) team designs, builds and operates the subsea network used by Google to provide the products and services. The team collaborates with internal stakeholders and suppliers to create construction agreements, oversee the delivery of each cable system, then operate and maintain that infrastructure for reliability and security.

Qualifications

Job responsibilities

• Transform prospective customer and business requests into detailed technical specifications for custom submarine cable solutions, including delineating hand-off points at colocation centers and creating technical diagrams.
• Partner with business team and new customers and manage the end-to-end contracting process for infrastructure business.
• Act as an internal customer advocate by tracking related infrastructure builds to identify key areas of opportunity and potential risks to customer delivery.
• Ensure that customers receive the specific technical solutions they purchased and that these solutions are operationally supportable by working with Network Delivery and Service Management teams.
• Manage the technical handoff and documentation process for customer deliveries, including detailed engineering specifications.

Minimum qualifications

• Bachelor's degree in a technical field, or equivalent practical experience.
• 5 years of experience in program management.
• 5 years of experience in submarine cable systems or the telecommunications industry.
• Experience in Salesforce for agreement management and other project tracking tools.

Preferred qualifications

• 5 years of experience in managing cross-functional or cross-team projects.
• Knowledge of subsea networking tests, including landing station configurations, beach manholes, and fronthaul infrastructure.
• Excellent problem-solving and communication skills with the ability to construct, articulate, and defend messages or insights from analysis.

About Fei Siong Group

Fei Siong Group (FSG) is one of Singapore’s leading Food & Beverage operators, managing over 160 outlets across 19 brands with a workforce of more than 1,700 employees. Our portfolio includes food atriums, quick- and full-service restaurants, food kiosks, hawker stalls, and a hawker centre.

Role Overview

As an Operations Administrator, you will support the Centre Manager in ensuring smooth day-to-day operations, compliance with standards, and consistent service excellence. This role offers broad exposure to operational coordination, compliance, and stakeholder management within a dynamic F&B environment.

Key Responsibilities

• Support smooth and efficient daily operations within the centre.

• Uphold and enforce Company Rules & Regulations, ensuring compliance with relevant government regulations.

• Conduct regular audits to ensure adherence to company standards, policies, and regulatory requirements.

• Provide guidance and operational support to foster a positive working environment and employee engagement.

• Support the delivery of consistent customer service and food quality standards.

• Monitor customer feedback and reviews, and take proactive actions to address issues and improve satisfaction.

• Maintain positive working relationships with stakeholders, suppliers, and customers.

• Study industry trends, market competition, and customer preferences, and provide recommendations for continuous improvement.

Requirements

• Experience in a similar role within the F&B industry will be an advantage.

• Strong communication, negotiation, and interpersonal skills.

• Passion for the F&B industry with an interest in customer experience and operations.

• Able to work effectively in a fast-paced and dynamic environment.

• Candidates without relevant experience are welcome to apply; training will be provided.

Why Join Fei Siong Group

• Exposure to large-scale F&B operations

• Hands-on operational and compliance experience

• Supportive team environment with growth opportunities

JOB DESCRIPTION:

Department: Regional Logistics Management

Reports to: General Manager Regional Supply Chain Management

Functional relationships:

• ASEAN India Regional Sales Office, ASEAN India Regional Manufacturing Site, Business Process Management in the same division, HQ SCM Strategy Department

• Same with above in Japan, Singapore, Malaysia, Philippines, Thailand, Vietnam, India

Key Duties & Responsibilities:

• Policy, strategy alignment and coordination of global, regional projects by collaborating with Japan HQ or other group company in Japan.

• To initiate periodical meetings with Japan HQ or other group company to solve problems in own division.

• Activities to improve service quality, cost efficiency, operational productivity, compliance and customer experience using methodologies such as Kaizen, PDCA, Root Cause Analysis, and value chain mapping.

• Identify, assess and prioritize process improvement opportunities across transport, warehousing, inventory flow, delivery and logistics support functions.

• To establish and drive standard operating procedures (SOPs), process documentation and best-practice sharing ASEAN India sales offices

• Ensure process consistency using KGI (key goal index) and KPI (key performance index) while allowing appropriate localization for country-specific operational and regulatory requirements

• Support and execute global and regional transformation projects including process harmonization, supply chain changes and logistics network improvements

• Prepare or support business cases for process changes, systems improvements, and operational productivity initiatives

• Supervise and manage direct report, ensuring clear work allocation, role clarity, and delivery of objectives.

• Set performance expectations, monitor progress, and conduct regular performance feedback discussions.

• Review and prioritize team workload to ensure alignment with regional transformation priorities and business needs.

• Manage multiple process improvement and transformation projects simultaneously across the region.

• Manage project timeline, deliverables, milestones, risks, dependencies and stakeholder communication.

• Support initiatives to improve customer experience through better service consistency, delivery reliability, issue resolution, and communication.

• Ensure logistics improvements contribute directly to service excellence and customer satisfaction.

Ability/Competency required:

• Bachelor’s degree or master's degree in supply chain management, logistics, business administration, or related field.

• At least 5 years of working experience in electronics component manufacturing company.

• Native level Japanese speaking & writing and business level English speaking & writing skills to support communication with Japan and other overseas sales offices.

• Having proactive attitude and strong communication and interpersonal skills.

• Stakeholder management and cross-functional collaboration.

• Strong planning, organization, and follow-through.

• Results-oriented and hands-on execution mindset.

• Adaptability and resilience in a fast-paced regional environment.

• Cultural sensitivity and ability to work across diverse markets.

We are hiring an Operations Manager to lead our soft services division. This role requires immediate, demonstrated competence in three non-negotiable areas. If you lack these capabilities, do not apply.

Non-Negotiable Requirements

1. Financial & Administrative Autonomy (Advanced Excel):

• Required: Microsoft Advanced Excel Certification or equivalent proven capability.
• Must: Independently manage site budgets, cost analysis, and produce all required internal financial reports. Your system competence must support full autonomy over site performance data.

2. Client Management & Commercial Safeguarding:

• Required: Documented track record in effective Client Relationship Management (CRM).
• Must: Produce and present all necessary client-facing and billing reports to ensure zero obstruction to monthly invoicing. You must possess deep contractual knowledge to actively protect against scope creep.

3. End-to-End Local Recruitment Solutions:

• Required: Direct ownership of the entire recruitment cycle for Singapore Citizens/PRs—from candidate search and sourcing to successful employment on-site.
• Must: Solve all local manpower challenges and reliably ensure full, high-quality staffing for all sites.

Key Responsibilities

• Drive operational excellence and ensure high service standards across all soft services contracts.
• Lead, mentor, and manage supervisors and frontline staff.
• Implement efficiency improvements and cost-optimization initiatives.

To Apply: Submit your CV, focusing on specific evidence of meeting the three non-negotiable requirements listed above.

COMPANY DESCRIPTION

Mediacorp is Singapore's largest content creator and national media network, operating a suite of TV channels, radio stations, and multiple digital platforms. Its mission is to engage, entertain, and enrich audiences by harnessing the power of creativity.

We are committed to creating an inclusive and diverse workplace where talent thrives. Our hiring decisions are made based on merit and fit-to-role. If you have a disability or special need which requires accommodation to participate in the recruitment process, please inform us when you submit your online application. We will be happy to support as necessary.

Thank you for your interest and application to this role. Please note that only short-listed candidates will be contacted.

RESPONSIBILITIES

As a Broadcast Operations Executive, you will be responsible for overseeing linear TV playout operations, providing radio operation support, and monitoring digital TV via IP systems.

The role involves continuously monitoring TV and radio equipment performance to ensure seamless broadcasts. Additionally, you will maintain compliance records and service logs while staying vigilant for any system anomalies or faults. Strong attention to detail, adherence to technical instructions, and effective communication with stakeholders are essential for this role.

Key Responsiblities & Challenges

• Monitor incoming, outgoing, and off-air TV and radio signals to ensure broadcast quality and process continuity.
• Operate live TV playout systems in coordination with News, Studio, and OB productions.
• Oversee and coordinate prompt insertion of ICA traffic messages into Zetta playlists for radio broadcast.
• Ensure hourly radio headline updates on Gold 90.5, 95FM, Warna 924, and 987FM from 8:00 AM to 9:00 PM.
• Verify recorded content segments against cue sheets, commercial breaks, and on-air promotion schedules for accuracy.
• Check and confirm availability of subtitle files prior to broadcast to prevent missing or incorrect captioning.
• Review and validate crawler text to ensure accuracy and compliance before on-air deployment.
• Conduct routine checks of BCP (path C) playlists for completeness and correctness, ensuring readiness for transmission.
• Monitor Free-to-Air (FTA) channels on meWATCH to validate output quality and ensure alignment with scheduled programming.
• Prepare and submit TV playout and radio operation reports based on assigned shift duties.
• Execute recovery procedures swiftly to restore normal on-air service in the event of broadcast disruption.
• Collaborate with program planning, scheduling, and ad sales teams to source filler content for time adjustments.
• Adhere to workplace safety and cybersecurity policies throughout operational tasks.
• Identify recurring issues within TV playout and radio operations and recommend solutions for continuous improvement.

• Diploma in a relevant field.
• Experience in TV and radio broadcast operations will be an advantage.
• Understanding of TV and Radio operations, and playout automation system.
• Knowledge of broadcast workflows, automation playlist and signal transmission.
• Ability to manage live and recorded broadcasts with precision.
• Clearly conveys information to stakeholders, ensuring smooth coordination between teams.
• Listens actively and provides constructive feedback to enhance team performance.
• Works effectively across departments, including News and Entertainment Production Studios, and Technology Group.
• This role operates on a 24/7 shift basis. Candidates should be comfortable with rotating shifts, including nights, weekends and public holidays.

Responsibilities

• Execute daily processing of settlement-related payments and collections across multiple investment products with a high degree of accuracy.
• Perform routine checks and balancing of client accounts to ensure records are complete, accurate, and aligned with system data.
• Investigate variances and exceptions, working with internal teams and counterparties to resolve issues promptly.
• Support operational enhancements, including system upgrades, automation initiatives, and workflow improvements.
• Ensure all transactions and processes comply with internal controls, regulatory requirements, and operational guidelines.
• Prepare operational reports and maintain proper documentation for audits and management review.
• Participate in user testing, process reviews, and rollout of new tools or enhancements to improve efficiency.
• Take on ad-hoc operational tasks and support cross-functional projects when required.

Requirements

• Degree or Diploma holder in any discipline, with at least 2 years of relevant experience in operations, settlements, or a similar back-office function within financial services.
• Strong attention to detail with the ability to manage transactional work accurately in a time-sensitive environment.
• Good communication and stakeholder management skills, with a proactive and solution-oriented mindset.
• Proficient in Microsoft Office (especially Excel); exposure to workflow automation tools or basic scripting (e.g. Power Automate, macros, or similar) is an added advantage.

Please submit your updated resume in Word format by using the Apply Now Button.
We regret that only shortlisted candidates will be notified.
Email resume to ken.ng@peopleprofilers.com
People Profilers Pte Ltd, 20 Cecil Street,#08-09, PLUS Building, Singapore 049705.
Tel: 6950 9724
http://www.peopleprofilers.com
EA License Number: 02C4944
Registration Number: R1872398
Posting Personnel: Ng Jwee Ken
Ref: 8X39V4VR

About Our Client

Our client is a well‑established A1main contractor with a strong regional track record in delivering large‑scale, complex and mission‑critical developments, including data centres. Known for its robust engineering culture, integrated in‑house delivery and strong emphasis on quality and safety, the organisation continues to expand its data centre portfolio across Southeast Asia.

About the role

The Head of M&E (Data Centre Projects) is the senior technical authority responsible for M&E strategy, governance and delivery across all data centre projects. The role provides leadership from design through construction, commissioning and handover, working closely with project leadership to ensure consistency, technical excellence and delivery certainty. The position reports functionally to the Head of M&E and operationally to the Project Director for Data Centre projects, with details to be shared during the interview process.

Key Responsibilities

M&E Leadership & Data Centre Delivery

• Act as the overall M&E lead for all data centre projects, setting technical direction, standards, and best practices.
• Lead end‑to‑end M&E delivery from planning, design coordination and permitting through construction, commissioning and final handover.
• Ensure projects are delivered in line with programme, budget, quality, reliability, and performance requirements typical of mission‑critical facilities.
• Provide technical oversight and decision‑making on complex M&E systems including power, cooling, redundancy, and resilience strategies.

Project& Stakeholder Management

• Manage and coordinate all M&E interfaces with internal teams, consultants, specialist contractors, vendors and suppliers.
• Act as the key M&E liaison with clients, consultants, and authorities to ensure alignment with project objectives and regulatory requirements.
• Chair and lead M&E‑related coordination and progress meetings, driving timely resolution of technical and delivery issues.
• Monitor progress, quality, and risk across active data centre projects, intervening where necessary to protect outcomes.

People & Team Leadership

• Lead and develop the internal M&E production teams and coordinators across multiple projects.
• Provide mentoring, technical guidance, and capability development for senior and mid‑level M&E staff.
• Promote a culture of accountability, collaboration, and continuous improvement within the M&E function.

Procurement & Governance

• Oversee procurement of M&E consultants and contractors, including scope development, tender evaluation and contract negotiations.
• Ensure all procurement and commercial activities comply with internal governance, compliance, and risk frameworks.
• Support tendering and pre‑construction activities for new data centre projects, providing expert M&E input.

Digital Engineering & BIM

• Lead M&E design coordination using BIM and digital delivery tools.
• Support and participate in the organisation’s Virtual Design & Construction (VDC) initiatives to enhance coordination, constructability and efficiency.

Safety, Compliance & Risk

• Ensure all M&E works comply with statutory requirements, industry codes, and project‑specific standards.
• Champion safety, quality and risk management across all M&E activities.

Requirements

• Degree in Mechanical or Electrical Engineering from a recognised university.
• Minimum 15 years of M&E experience with an A1 main contractor, delivering large‑scale and complex building projects such as data centres, commercial developments, mixed‑use projects or mission‑critical facilities.
• Strong, hands‑on experience in data centre M&E systems and full project lifecycle delivery.
• At least 10 years of people management experience, with a proven track record of leading and developing high‑performing teams.
• Demonstrated experience in tendering, procurement, and evaluation of consultants and contractors.
• Deep technical knowledge of mechanical and electrical systems.
• Strong leadership, stakeholder management, and communication skills.
• Commercially astute with sound risk and governance awareness.
• Able to operate effectively in fast‑paced, complex and multi‑project environments.
• Proactive, resilient, and solutions‑oriented leadership style.
• The role involves regional travel to support data centre projects outside Singapore (e.g. Kuala Lumpur, Johor, Batam), with frequency determined by business needs and project stages.

Interested candidate kindly send your CV to wenyu.jiang@peoplesearch.jobs. Please indicate your availability, expected salary and reason for leaving current job.

We regret that only shortlisted candidates will be contacted.

• Minimum of 18+ years of operations experience managing a team covering derivatives operations 
• Some hands-on experience covering derivatives operations gained in a futures exchange and clearing house is essential
• Hands-on experience driving project management (in operations) and systems implementation is required

Our client is a growing firm in the FI industry. This is a hands-on Head of Operations role overseeing an operations team covering derivatives exchange operations and project management functions. This role will also be part of the senior executive team.

ROLE AND RESPONSIBILITIES

• Oversee an operations team covering derivative exchange operations.
• Drive project management and initiatives. Lead the implementation of enhanced capabilities and efficiency in the operations function
• Make recommendation and presentation to senior management 
• Spearhead and implement system transformation and implementation projects.
• Work on other strategic matters directed by senior management

QUALIFICATIONS/ ACADEMIC BACKGROUND/ SKILLS

• A seasoned operations professional with min of 18+ years of operations. Some hands-on experience covering derivatives operations gained in a futures exchange and clearing house is essential
• Hands-on experience driving project management (in operations) and systems implementation is required
• Very hands-on despite being senior
• Possess strong stakeholder management skills
• Driven, agile/adaptable and flexible.
• Possess good presentation and communication skills
• Driven with good people skills and team management skills

To apply, pl send your cv in word doc to resume@cap-cg.com. Pl also include details on your current salary, expected salary and notice period in your cv.

We regret to inform that only shortlisted candidates will be notified.

Posted by:

CAP Consulting (EA license: 14C7175)

Caroline Poh (EA Registration: R1105649)

Date ad is posted - 10 April 26

We are a fast-growing logistics and transportation company in Singapore, specializing in last-mile delivery solutions. We provide efficient and reliable delivery services across the island, supporting e-commerce and business distribution needs.

Key Responsibilities:

- Plan and coordinate daily last-mile delivery operations to ensure timely and efficient distribution

- Optimize delivery routes and schedules to improve productivity and reduce costs

- Monitor delivery performance and ensure service level agreements (SLA) are met

- Liaise with drivers, warehouse team, and external vendors to ensure smooth operations

- Handle operational issues, delays, and customer escalations professionally

- Analyze operational data and recommend process improvements

- Ensure compliance with company policies and safety regulations

- Prepare reports on delivery performance and operational efficiency

Requirements:

- Bachelor’s Degree in any discipline

- Minimum 1–2 years of experience in logistics, transportation, or operations-related roles

- Strong coordination and problem-solving skills

- Good communication and interpersonal skills

- Ability to work in a fast-paced environment

- Proficiency in Microsoft Excel or logistics systems is an advantage