Job Description
Basic Purpose of the Job
- Lead and develop the FOL Process Engineering organization (Die Attach, Clip Attach, Wire Bond, Plasma and AOI).
- Ensure stable yield, high equipment/process capability, adherence to customer and reliability requirements, and timely closure of quality/EFAR/GMRB issues.
- Drive continuous improvement, standardization, process governance, and readiness for volume and package‑mix expansion.
Reporting Relationship
- Reports to the Assembly Engineering Manager; leads a team of Process Engineers across Die Attach, Clip Attach, Wire Bond, Plasma and AOI.
Responsibilities
Major Duties and Responsibilities
- Provide strategic process ownership for all FOL Package Group (SPC governance, PFMEA/Control Plan, recipe management, process capability Ppk, documentation).
- Lead engineering responses to yield losses, top defect contributors, customer complaints, reliability audit failures, and GMRB cases.
- Oversee execution of Continuous Improvement Plan, productivity projects, and proliferation activities across CBSM, SOSM, and PPD packages.
- Ensure audit readiness (IATF/ISO/Customer), compliance to change control, and cross‑functional alignment with Production, Quality, Equipment, NPI, Planning, and SQE.
- Develop technical talent, strengthen process ownership, and balance engineering workload.
Qualifications
- Education
- Bachelor’s degree in Engineering (Mechanical, Electronics, Chemical, or related field).
- Experience
- 8+ years in semiconductor assembly (Die Attach / Wire Bond), with proven leadership in high‑mix, high‑complexity FOL operations.
- Demonstrated capability in yield improvement, DOE, SPC, PFMEA/Control Plan, and equipment/materials qualification.
- Skills & Knowledge Requirements
- Strong technical mastery in FOL processes (DA, WB, Clip Attach, Plasma) and failure mechanisms.
- Excellent analytical skills (Minitab/Exensio/SPC), problem‑solving (8D, DMAIC), and audit/customer‑facing communication.
- Ability to lead teams, manage cross‑functional escalations, and sustain process governance under high‑volume/high‑complexity environments
About Us
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
About The Team
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.
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