Your Browser is Not Supported

To ensure jobstore run smoothly, please use the latest version of the following supported browsers:

Advanced Search
Jobs in Malaysia   »   Jobs in Batu Kawan, Pulau Pinang   »   Manufacturing / Production jobs   »   Senior Assembly Process Engineer - Wire Bond

Senior Assembly Process Engineer - Wire Bond

Batu Kawan, Pulau Pinang, MY
Req. ID: #

As a Wire Bond Process Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives.

Responsibilities and Tasks :

style="list-style-type: disc;"-

-Evaluate and Improve Wire Bond Processes, Materials, and/or Equipment

Maintain in-depth process knowledge

-Maintain materials and equipment knowledge as it relates to the process and how they interact

-Optimize process and/or equipment variables by apply DOE techniques

-Maintain knowledge of material attributes (shelf life, storage requirements, etc.)

-Define process edges and center the process (CPK)

-Determine root cause and implement corrective actions

-Define and maintain operation procedures


1) Bachelor's or Master degree in Electronic, Mechanical, Mechatronic or related Engineering

2) Min 5 years related experience in Assembly packaging or Semiconductor manufacturing background

3) Possess good knowledge in Wire Bond Processes

5) Familiar with Failure Mode Effects Analysis (FMEA), Statistical Process Control (SPC) and Problem solving skills


Knowledge in Design Of Experiment (DOE) will be an added advantage

7) Self-motivated, possess initiative and ability to work independently

8) Team player with good communication and interpersonal skills

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, Micron’s Human Resources Department at # or # and/or by completing our General Contact Form

Keywords: Batu Kawan || Pulau Pinang (MY-07) || Malaysia (MY) || Backend Manufacturing || Experienced || Regular || Engineering || #LI-IC1 || Tier 4 ||
✱   This job post has expired   ✱

Sharing is Caring

Know others who would be interested in this job?