Key Job Accountabilities:
· To establish new processes capability based on unit process/equipment/material roadmap related to 2.5/3D, heterogenous integration packaging, and wafer-level packaging process technologies.
· To perform process and material DoE study and characterization
· To continuously improve new processes and capabilities.
· To qualify new materials, perform inspections, measurements for data collections and prepare summary reports.
Required Experience and Qualifications:
· 3-5 years related to process engineering
· Photolithography and/or plating process related experiences
· Engineering statistic and process control (Lean six sigma or DMAIC) knowledge
· Design of Experiments
· Fresh graduates are welcome to apply, training will be provided.